A feed-through component for a conductor feed-through which passes through a part of a housing, for example a battery housing, is embedded in a glass or glass ceramic material and has at least one conductor, for example an essentially pin-shaped conductor, and a head part. The surface, in particular the cross-sectional surface, of the head part is greater than the surface, in particular the cross-sectional surface, of the conductor, for example of the essentially pin-shaped conductor. The head part is embodied such that is can be joined to an electrode-connecting component, for example an electrode-connecting part, which may be made of copper, a copper alloy CuSiC, an aluminum alloy AlSiC or aluminum, with a mechanically stable and non-detachable connection.

A feed-through component for a conductor feed-through which passes through a part of a housing, for example a battery housing, is embedded in a glass or glass ceramic material and has at least one conductor, for example an essentially pin-shaped conductor, and a head part. The surface, in particular the cross-sectional surface, of the head part is greater than the surface, in particular the cross-sectional surface, of the conductor, for example of the essentially pin-shaped conductor. The head part is embodied such that is can be joined to an electrode-connecting component, for example an electrode-connecting part, which may be made of copper, a copper alloy CuSiC, an aluminum alloy AlSiC or aluminum, with a mechanically stable and non-detachable connection.

A glass for sealing of the present invention includes as a glass composition, in terms of mol %, 60% to 80% of SiO.sub.2, 8% to 5.8% of B.sub.2O.sub.3, 12% to 18.7% or Li.sub.2O+Na.sub.2O+K.sub.2O, and 2% to 12% of MgO+CaO+SrO+BaO, and has a molar ratio SiO.sub.2/B.sub.2O.sub.3 of 14 or more.

A glass for sealing of the present invention includes as a glass composition, in terms of mol %, 60% to 80% of SiO.sub.2, 8% to 5.8% of B.sub.2O.sub.3, 12% to 18.7% or Li.sub.2O+Na.sub.2O+K.sub.2O, and 2% to 12% of MgO+CaO+SrO+BaO, and has a molar ratio SiO.sub.2/B.sub.2O.sub.3 of 14 or more.

A lead insertion system adapted to insert a lead into a glass tube includes a first robot on which a first gripper is mounted and a second robot on which a second gripper is mounted. The first gripper grips the glass tube and the second gripper grips the lead. The lead insertion system includes a flame heater heating the glass tube gripped by the first robot and the lead gripped by the second robot with a flame. The second robot inserts the lead into the glass tube held by the first robot with the lead heated by the flame and the glass tube heated and softened by the flame.

The present disclosure relates to a bonding glass which has improved water resistance and has a coefficient of thermal expansion (25-300) of from 14.Math.10.sup.6K.sup.1 to 17.Math.10.sup.6K.sup.1, comprising, in mol % on an oxide basis, 5-7 of B.sub.2O.sub.3, 10-14 of Al.sub.2O.sub.3, 36-43 of P.sub.2O.sub.5, 15-22 of Na.sub.2O, 12.5-20 of K.sub.2O, 2-6 of Bi.sub.2O.sub.3 and >0-6 of R oxide, where R oxide is an oxide selected from the group consisting of MnO.sub.2 and SiO.sub.2 and SnO.sub.2 and Ta.sub.2O.sub.5 and Nb.sub.2O.sub.5 and Fe.sub.2O.sub.3 and GeO.sub.2 and CaO. The bonding glass is free of PbO except for, at most, impurities. The bonding glass may have a glass transition temperature Tg of from 390 C. to 430 C. The present disclosure also relates to uses of this bonding glass.

The present disclosure relates to a bonding glass which has improved water resistance and has a coefficient of thermal expansion (25-300) of from 14.Math.10.sup.6K.sup.1 to 17.Math.10.sup.6K.sup.1, comprising, in mol % on an oxide basis, 5-7 of B.sub.2O.sub.3, 10-14 of Al.sub.2O.sub.3, 36-43 of P.sub.2O.sub.5, 15-22 of Na.sub.2O, 12.5-20 of K.sub.2O, 2-6 of Bi.sub.2O.sub.3 and >0-6 of R oxide, where R oxide is an oxide selected from the group consisting of MnO.sub.2 and SiO.sub.2 and SnO.sub.2 and Ta.sub.2O.sub.5 and Nb.sub.2O.sub.5 and Fe.sub.2O.sub.3 and GeO.sub.2 and CaO. The bonding glass is free of PbO except for, at most, impurities. The bonding glass may have a glass transition temperature Tg of from 390 C. to 430 C. The present disclosure also relates to uses of this bonding glass.

A glass-to-metal seal assembly for electrical components. The glass-to-metal seal assembly provides ceramic washers that sandwiches the glass portion of the glass-to-metal seals. The ceramic washer encases the glass seal, thereby reinforcing the glass surface against crack propagation and the formation of a fragile glass meniscus at the interface of the glass seal and the encased electrical component. The ceramic washers may have a coefficient of thermal expansion that closely matches the coefficient of thermal expansion all of the other components of the assembly.

The present invention discloses a planar glass sealing structure and a manufacturing method thereof, the planar glass sealing structure comprises, in a top-down order: a first glass substrate, an insulating layer, a metal sealing frame and a second glass substrate. The insulating layer is formed as a frame shape, and disposed on a peripheral margin of the first glass substrate; the metal sealing frame is formed by heating to melt a metal solder layer between the first and second glass substrate, and it can keep a fixed gap between the first and second glass substrate, so that an inner space thereof is kept in an excellent sealed condition. The present invention can ensure the sealing structure of two correspondingly assembled glass substrates, so that the inner space thereof is insulated from moisture and oxygen, so as to increase the performance and quality of the device.

The present invention discloses a planar glass sealing structure and a manufacturing method thereof, the planar glass sealing structure comprises, in a top-down order: a first glass substrate, an insulating layer, a metal sealing frame and a second glass substrate. The insulating layer is formed as a frame shape, and disposed on a peripheral margin of the first glass substrate; the metal sealing frame is formed by heating to melt a metal solder layer between the first and second glass substrate, and it can keep a fixed gap between the first and second glass substrate, so that an inner space thereof is kept in an excellent sealed condition. The present invention can ensure the sealing structure of two correspondingly assembled glass substrates, so that the inner space thereof is insulated from moisture and oxygen, so as to increase the performance and quality of the device.