The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A glass composition, a macrocomposite, and methods of forming the macrocomposite including dispersing or immersing a metal in a glass. Preferably, the macrocomposite does not include an organic resin, an adhesive, or a polymer.

A method of forming metallic nanoparticles in glass is disclosed that creates evenly distributed metallic nanoparticles with desired size in any glass type.

Formation of a source of electrons trapped on the surface of the glass particles by crushing and grinding glass material into powder followed by heat treatment of the glass powder to neutralise metal ions doped in the glass by the trapped source of electrons, followed by the aggregation and growth of the metal into nanoparticles. The present method allows the homogeneous distribution of metal nanoparticles throughout the glass volume. The size and concentration of the metallic nanoparticles is controlled by the heat treatment temperature and duration as well as the amount of metal ions.

A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580 C. to 760 C. This chip resistor prevents the resistive element from being peeled off.

Provided is a conductive paste for forming a solar cell electrode containing a glass frit component (A) as glass frit (II), the glass frit component (A) containing the following in the content ratio to the total molar number in terms of oxide: (a) 30 to 70 mol % of tellurium element, (b) 18 to 30 mol % of tungsten element, (c) 5 to 30 mol % of zinc element, (d) 1 to 15 mol % of boron element, (e) 0.3 to 5 mol % of aluminum element, (f) 0.3 to 7 mol % of one or more selected from rare earth elements in terms of oxide, and (g) 0.1 to 7 mol % of one or more selected from the group consisting of tin, lithium, and barium elements in terms of oxide.

The conductive paste may have better electric characteristics and a small variation in the characteristics even at a relatively low firing temperature (for example, 760 C.).

The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The disclosure is directed to broadband, glass optical polarizers and to methods for making the glass optical polarizers. The glass optical polarizer includes a substantially bubble free fusion drawn glass having two pristine glass surfaces and a plurality of elongated zero valent metallic particle polarizing layers.

Provided is an antireflective-film attached transparent substrate having a luminous transmittance of 20% to 84% and a b* value of a transmission color being 5 or smaller under a D65 light source, in which the antireflective film has a luminous reflectance being 1% or lower and a sheet resistance being 10.sup.4/ or higher, and in which the antireflective film has a multilayer structure built up of at least two layers, at least one layer is constituted mainly of silicon oxide, and at least another layer is constituted mainly of a mixed oxide of at least one oxide of Mo and W and at least one oxide of Si, Nb, Ti, Zr, Ta, Al, Sn, and In, and has an extinction coefficient at 550 nm being in a range of 0.005 to 3.

A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580 C. to 760 C. This chip resistor prevents the resistive element from being peeled off.

A glass composition, a macrocomposite, and methods of forming the macrocomposite including dispersing or immersing a metal in a glass. Preferably, the macrocomposite does not include an organic resin, an adhesive, or a polymer.