C04B37/003

COMPOSITE CERAMIC ATOMIZER AND METHOD OF PREPARING THE SAME

Provided is a composite ceramic atomizer, comprising a first main body and a second main body, wherein the first main body and the second main body are integrally formed by using a glazing and sealing process, and the first main body is connected to the second main body by means of a glazed surface formed by glazing. The glazed surface completely or partially covers a surface at the joint between the first main body and the second main body. The first main body comprises a heating carrier and a conductive path for heating, the conductive path being formed on a surface of or inside the heating carrier and having a first contact part and a second contact part connected to a power supply. The second main body is used for liquid conduction.

Composite substrate, method for producing the same, and electronic device

A composite substrate includes a supporting substrate and a functional substrate that are directly joined together, the supporting substrate being a sintered sialon body.

BONDING SCINTILLATOR MATERIAL TO PRODUCE LARGE PANELS OR OTHER SHAPES

A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.

HIGH TEMPERATURE RESISTANT SILICON JOINT FOR THE JOINING OF CERAMICS

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with a high purity silicon or a silicon alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck.

Shower plate, semiconductor manufacturing apparatus, and method for manufacturing shower plate

A shower plate according to the present disclosure includes a ceramic sintered body, the ceramic sintered body comprising a first surface, a second surface facing the first surface, and a through hole positioned between the first surface and the second surface. An inner surface of the through hole includes a protruding crystal grain which protrudes more than an exposed part of a grain boundary phase existing between crystal grains. In addition, a semiconductor manufacturing apparatus according to the present disclosure includes the shower plate mentioned above.

Screen printing plate and manufacturing method of electronic component
10933679 · 2021-03-02 · ·

In some embodiments, a screen printing plate 10 includes a metal mesh part 13 and a metal mask part 14 provided on one side of the metal mesh part 13 integrally with the metal mesh part 13. In addition, the metal mask part 14 has an opening part 14a, and when the dimension from the outer edge 14a2 of the opening part 14a to the metal mesh part 13 represents a fill depth, this fill depth is the largest in the part corresponding to the center area of the opening part 14a. The screen printing plate does not cause the actual printing thickness to vary easily, even when the target printing thickness is reduced.

Braze alloys for joining or repairing ceramic matrix composite (CMC) components

A braze alloy for joining or repairing ceramic matrix composite (CMC) components comprises a braze composition including silicon at a concentration from about 48 at. % to about 66 at. %, titanium at a concentration from about 1 at. % to about 35 at. %, and an additional element selected from aluminum, cobalt, vanadium, nickel, and chromium. The braze composition comprises a melting temperature of less than 1300 C.

SENSOR ELEMENT, GAS SENSOR, AND METHOD FOR MANUFACTURING SENSOR ELEMENT
20210080423 · 2021-03-18 · ·

A sensor element (10) having a laminate structure, and extending in an axial direction AX, the sensor element including a first and second ceramic layers (118B, 115) disposed apart from each other in a laminating direction; a third ceramic layer (118) intervening between the first and second ceramic layers in the laminating direction and having a hollow space (10G) formed therein; and an internal space which is the hollow space surrounded by the first ceramic layer, the second ceramic layer, and the third ceramic layer, wherein, at a periphery (10f) of the internal space, a fourth ceramic layer (181) containing as a main component a ceramic material different from that contained as a main component in the first and third ceramic layers intervenes between the first ceramic layer and the third ceramic layer which are exposed to the internal space. Also disclosed is a method for manufacturing the gas sensor element.

COMPOSITE COMPONENTS AND METHODS FOR PREVENTING FLOW FROM INFILTRATED COMPONENT DURING RE-INFILTRATION

A method for modifying a composite component may include positioning a barrier segment between an infiltrated segment of the composite component and a green segment to form an assembly; and initiating an infiltration process. The barrier segment may have a barrier segment permeability that is lower than a permeability of the infiltrated segment, a permeability of the green segment, or both. A composite component may include an infiltrated segment infiltrated with a molten material during a prior infiltration process; a green segment that is uninfiltrated; and a barrier segment having a microstructure different from the infiltrated segment, the green segment, or both. The microstructure of the barrier segment may be configured to slow a flow of material between the infiltrated segment and the green segment during a subsequent infiltration process.

METHODS FOR JOINING CERAMIC COMPONENTS TO FORM UNITARY CERAMIC COMPONENTS

Methods for forming a unitary ceramic component are provided. The method may include: positioning a braze reactant layer in a contact area between a first densified ceramic component and a second densified ceramic component; positioning a pack material around at least a portion of the first densified ceramic component or the second densified ceramic component; positioning at least one infiltrate source in fluid communication with the braze reactant layer; and thereafter, heating the at least one infiltrate source, the pack material, the first densified ceramic component, and the second densified ceramic component to a braze temperature that is at or above a melting point of at least one phase of the infiltrate composition such that at least one phase of infiltrate composition melts and flows into the braze reactant layer and reacts with a ceramic precursor compound therein to form a ceramic material.