An electronic device is provided. The electronic device includes a back frame, a panel disposed on the back frame, a protective substrate disposed on the panel, and an adhesive element disposed on a portion of the back frame. The back frame and the protective substrate adhere to each other via the adhesive element.

A scraping device for undried joining material protruding from a segment joint body in which side surfaces of a plurality of pillar-shaped honeycomb structure segments are joined via the undried joining material, the segment joint body having an outer peripheral side surface, a first honeycomb-shaped end surface, and a second honeycomb-shaped end surface located on an opposite side of the first honeycomb-shaped end surface, the scraping device includes a stand for placing the segment joint body; a controller; and a scraping robot comprising at least one scraping spatula configured to be movable in at least one scraping direction along at least one surface of the outer peripheral side surface, the first honeycomb-shaped end surface, and the second honeycomb-shaped end surface while being pressed against the at least one surface.

A manufacturing method of a low heat-conducting magnesium-aluminium spinel brick includes: (1) evenly mixing sintered magnesia, fused magnesia, magnesium-aluminium spinel and corundum to prepare flame retardant coating raw material mixed powder, adding naphthalene binder to the flame retardant coating raw material mixed powder to prepare the flame retardant coating raw materials after evenly mixing; (2) evenly mixing forsterite, fayalite and magnesia, adding the naphthalene binder to the mixed powder, moulding, drying, and then burning to obtain aggregate composite hortonolite raw materials; adding the naphthalene binder to the aggregate composite hortonolite having granularity ≤5 mm to prepare the thermal insulating layer raw materials after evenly mixing; (3) spacing and loading the flame retardant coating raw materials and the thermal insulating layer raw materials in a mold, pressing into green bricks, keeping the green bricks at a temperature of 110° C. for 24 hours, drying, and burning into magnesium-aluminium spinel bricks.

An electronic device having a curved surface is provided. The electronic device having the curved surface includes a back frame having a curved surface, a panel having a curved surface disposed on the back frame having the curved surface, a protective substrate having a curved surface disposed on the panel having the curved surface, and a patterned adhesive element disposed on a portion of the back frame having the curved surface. The back frame having the curved surface and the protective substrate having the curved surface adhere to each other via the patterned adhesive element. The method for fabricating the electronic device having the curved surface is also provided.

Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

A scraping device for undried joining material protruding from a segment joint body in which side surfaces of a plurality of pillar-shaped honeycomb structure segments are joined via the undried joining material, the segment joint body having an outer peripheral side surface, a first honeycomb-shaped end surface, and a second honeycomb-shaped end surface located on an opposite side of the first honeycomb-shaped end surface, the scraping device includes a stand for placing the segment joint body; a controller; and a scraping robot comprising at least one scraping spatula configured to be movable in at least one scraping direction along at least one surface of the outer peripheral side surface, the first honeycomb-shaped end surface, and the second honeycomb-shaped end surface while being pressed against the at least one surface.

This patent document relates to systems, structures, devices, and fabrication processes for ceramic matrix composites suitable for use in a nuclear reactor environment and other applications requiring materials that can withstand high temperatures and/or highly corrosive environments. In one exemplary aspect, a method of joining and sealing ceramic structures is disclosed. The method comprises forming a joint of a ceramic structure and an end plug using a sealing material, wherein the end plug has a hole that goes through a top surface and a bottom surface of the end plug; filling the ceramic structure with a desired gas composition through the hole; heating a material into a molten form using a heat source; and directing the material into the hole, wherein the material solidifies to seal the end plug.