An apparatus for a lead-free piezoelectric ink-jet printhead is disclosed. Piezoelectric printheads, while more expensive are favored because they use a wider variety of inks. The piezoelectric printhead includes a diaphragm, a plurality of piezoelectric actuators comprising a lead-free piezoelectric material, at least one nozzle, at least one ink chamber, a top electrode, and a drive circuit. The deflection of the diaphragm on the body chamber contributes to a pressure pulse that is used to eject a drop of liquid from the nozzle. According to an exemplary embodiment, a lead-free piezoelectric printhead operated at smaller thicknesses and significantly higher electric fields is disclosed, along with methods of making such printheads.

The present disclosure provides a ceramic package for quantum computing and a method for preparation. The ceramic package for quantum computing may include a first ceramic plate, a vacuum tube, and a second ceramic plate connected sequentially from bottom to top, wherein the first ceramic plate is installed with a first light window, the second ceramic plate is installed with a second light window, the first light window and the second light window cover a signal inlet and a signal outlet of the vacuum tube, respectively; the first ceramic plate is provided with a lead wire on a side depart from the vacuum tube and configured to lead a signal into a system. The method for preparation may include placing the first ceramic plate, the vacuum tube, the second ceramic plate, the lead wire, and the first solder sheet in a mold for positioning, and soldering the solder sheet into a sintered member by heating and melting the solder sheet; plating nickel and gold on an outer surface of the sintered member, respectively; providing a gold layer on a welding surface of the light window and a plating layer on a photon signal passage; and soldering a gold-plated sintered member to the first light window and the second light window with gold and tin through the second solder sheet, respectively, to form a ceramic package with a vacuum channel.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Disclosed herein are sealed devices comprising at least one cavity containing at least one quantum dot or at least one laser diode are also disclosed herein. The sealed devices can comprise a glass substrate sealed to an inorganic substrate, optionally via a sealing layer, the seal extending around the at least one cavity. Display and optical devices comprising such sealed devices are also disclosed herein, as well as methods for making such sealed devices.

Various sapphire and laminate structures are discussed herein. One embodiment may take the form of a sapphire structure having a first sapphire sheet with a first sapphire plane type forming the major surface and a second sapphire sheet having a second different sapphire plane type forming the major surface. The first and second sapphire sheets are fused together to form the sapphire structure.

Sintered product having a chemical analysis such that, in mass percentages: SiO.sub.2 content is greater than 0.2% and less than 2%, and CaO content is greater than 0.1% and less than 1.5%, and MgO content is less than 0.3%, and alumina and other elements being the complement at 100%, the content of other elements being less than 1.5%, having a relative density greater than 90%, comprising, for more than 90% of its volume, a stack of ceramic platelets (10) laid flat, all of said platelets having an average thickness less than 3 m, more than 95% by number of said platelets each containing more than 95% by mass of alumina, having a width (l) greater than 81 mm.

A method of integrally bonding a glass element to a support element, the method comprising a step of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method comprises a step of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step of locally heating the contact element in order to connect the glass element to the support element via the contact element. The method also comprises a step of coating at least a part of the contact recess with a separating layer prior to the step of insertion.

The present disclosure provides a ceramic package for quantum computing and a method for preparation. The ceramic package for quantum computing may include a first ceramic plate, a vacuum tube, and a second ceramic plate connected sequentially from bottom to top, wherein the first ceramic plate is installed with a first light window, the second ceramic plate is installed with a second light window, the first light window and the second light window cover a signal inlet and a signal outlet of the vacuum tube, respectively; the first ceramic plate is provided with a lead wire on a side depart from the vacuum tube and configured to lead a signal into a system. The method for preparation may include placing the first ceramic plate, the vacuum tube, the second ceramic plate, the lead wire, and the first solder sheet in a mold for positioning, and soldering the solder sheet into a sintered member by heating and melting the solder sheet; plating nickel and gold on an outer surface of the sintered member, respectively; providing a gold layer on a welding surface of the light window and a plating layer on a photon signal passage; and soldering a gold-plated sintered member to the first light window and the second light window with gold and tin through the second solder sheet, respectively, to form a ceramic package with a vacuum channel.

The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1) and a second component (2), B) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), C) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), D) heating at least the metal layer (4) to a first temperature (T1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and E) heating the arrangement to a second temperature (T2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.