Provided is a wavelength conversion member that can reduce strain under stress occurring at the interface between a substrate and a phosphor layer and is therefore less susceptible to breakage during use. The wavelength conversion member 1 comprises a substrate 10 and a phosphor layer 20 bonded on the substrate 10, the phosphor layer 20 including inorganic phosphor powder 22 dispersed in a glass matrix 21. In a temperature range of 30? C. to a setting point of the phosphor layer 20, a relation ?10?10.sup.?7?(?.sub.1??.sub.2)?10?10.sup.?7 (/? C.) is satisfied where ?.sub.1 represents a coefficient of thermal expansion of the substrate 10 and ?.sub.2 represents a coefficient of thermal expansion of the phosphor layer 20. The setting point is defined by Tf?(Tf?Tg)/3 (where Tg represents a glass transition point and Tf represents a deformation point).

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.

Disclosed herein is a device comprising: a glass substrate comprising a glass composition comprising xB.sub.2O.sub.3-ySiO.sub.2-zM.sub.2O, wherein 10x<100 by mol %; wherein 0<y<90 by mol %; wherein M is an alkali metal and wherein 0z10 by mol %, wherein the glass forms a structure comprising two or more immiscible phases, wherein the glass substrate has a dielectric constant lower than 6, and wherein the glass substrate has a dielectric loss tangent equal to or less than 1102 in a frequency range from 1 GHz to 1 THz.

Disclosed herein is a device comprising: a glass substrate comprising a glass composition comprising xB.sub.2O.sub.3-ySiO.sub.2-zM.sub.2O, wherein 10x<100 by mol %; wherein 0<y<90 by mol %; wherein M is an alkali metal and wherein 0z10 by mol %, wherein the glass forms a structure comprising two or more immiscible phases, wherein the glass substrate has a dielectric constant lower than 6, and wherein the glass substrate has a dielectric loss tangent equal to or less than 1102 in a frequency range from 1 GHz to 1 THz.

A method for annealing thin-films of ceramics such as Al.sub.2O.sub.3 on glass by laser such that the underlying glass substrate is unaffected by the laser heating. This is accomplished by applying a thin MgO buffer layer to the glass, depositing an amorphous ceramic layer on the textured transparent buffer layer, and annealing the ceramic layer with a heated line source. The ceramic layer crystallizing forming a ceramic coated substrate. The buffer layer is also textured which serves to induce texture in the Al.sub.2O.sub.3 film deposited on the buffer layer. The induced texture on the Al.sub.2O.sub.3 provides advantageous properties. The ceramic glass can be used for a variety of applications such as covers to solar panels, CICs used in satellites, displays, automobile windows, and substrates for LEDs.

The invention relates to substrate ceramic laminates. In particular, the invention relates to substrate ceramic laminates in which the ceramic layer is a functional layer.

The invention relates to substrate ceramic laminates. In particular, the invention relates to substrate ceramic laminates in which the ceramic layer is a functional layer.

Two substrate pieces are welded together with a focused laser beam. One of the pieces is transparent in the wave length of the laser beam. The two pieces are pressed together so the tops of the roughness of the joining surfaces become level and both a uniform and pocket like air layer is removed from between the surfaces. The focal point of the laser beam is focused in the common boundary surface of the substrate pieces and the pieces are set to movement in relation to the laser beam so that the focal point advances in the boundary surface according to the shape and length of the weld. The energy of the focal point melts the material of the two pieces at the same time. When the melts mix and harden, a weld is formed that joins the pieces hermetically and goes round the third piece(s) isolating it hermetically.