Patent classifications
C04B41/80
Oxide sintered material and method of manufacturing the same, sputtering target, and method of manufacturing semiconductor device
There are provided an oxide sintered material containing an In.sub.2O.sub.3 crystal phase, a Zn.sub.4In.sub.2O.sub.7 crystal phase and a ZnWO.sub.4 crystal phase, and a method of producing the oxide sintered material. The method includes forming the oxide sintered material by sintering a molded body containing In, W and Zn, and forming the oxide sintered material including placing the molded body at a first constant temperature selected from a temperature range of 500 C. or more and 1000 C. or less for 30 minutes or longer.
Oxide sintered material and method of manufacturing the same, sputtering target, and method of manufacturing semiconductor device
There are provided an oxide sintered material containing an In.sub.2O.sub.3 crystal phase, a Zn.sub.4In.sub.2O.sub.7 crystal phase and a ZnWO.sub.4 crystal phase, and a method of producing the oxide sintered material. The method includes forming the oxide sintered material by sintering a molded body containing In, W and Zn, and forming the oxide sintered material including placing the molded body at a first constant temperature selected from a temperature range of 500 C. or more and 1000 C. or less for 30 minutes or longer.
WATER-BASED INK COMPOSITION
The invention relates to a water-based ink composition for drop-on-demand (DoD) printing technology, which is intended for glazing and decorating ceramic products and provides colour or ceramic effects on ceramic supports once it has been fired at temperatures between 850 C. and 1280 C.
Process and Formulation to Join Ceramic Forms While Maintaining Structural and Physical Characteristics Across The Bond Surface
A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.
Process and Formulation to Join Ceramic Forms While Maintaining Structural and Physical Characteristics Across The Bond Surface
A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.
Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface
A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.
Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface
A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.
Flow path member
In the present disclosure, a flow path member includes a substrate, a flow path and a first oxide layer. The substrate contains non-oxide ceramics, and includes an outer surface. The flow path is in the substrate, and includes an inlet and an outlet. The first oxide layer is disposed on the outer surface.
Flow path member
In the present disclosure, a flow path member includes a substrate, a flow path and a first oxide layer. The substrate contains non-oxide ceramics, and includes an outer surface. The flow path is in the substrate, and includes an inlet and an outlet. The first oxide layer is disposed on the outer surface.
MEMBER FOR PLASMA PROCESSING DEVICES
A member for a plasma processing device of the present disclosure is a member for a plasma processing device made of ceramics and having a shape of a cylindrical body with a through hole in an axial direction. The ceramics is mainly composed of aluminum oxide, and has a plurality of crystal grains and a grain boundary phase that is present between the crystal grains. An inner peripheral surface of the cylindrical body has an arithmetic average roughness Ra of 1 m or more and 3 m or less, and an arithmetic height Rmax of 30 m or more and 130 m or less.