Patent classifications
C04B2237/50
ULTRAFAST LASER WELDING OF CERAMICS
Ceramic welding methods and welded articles are disclosed. The present disclosure shows that transparent and diffuse ceramics can be successfully joined using lasers. The diffuse ceramic welding can be aided by introducing a small gap for optical penetration while no gap is necessary in the transparent ceramics case. Laser welding is more versatile on transparent ceramics since one can focus through the material allowing the joining of more complex geometries and over multiple interaction zones, increasing the ultimate weld volumes.
Laser cutting of metal-ceramic substrates
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CERAMIC BONDED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT SUBSTRATE PRODUCTION METHOD
A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of an aluminum nitride, wherein, the copper member and the ceramic member are bonded to each other, and a Mg solid solution layer is provided between the copper member and the ceramic member and contains Mg in a state of a solid solution in a Cu primary phase.
Copper-ceramic bonded body and insulation circuit substrate
In a copper-ceramic bonded body of the present invention, at a bonding interface of a copper member and a ceramic member, there are formed a nitride compound layer containing one or more nitride forming elements selected from Ti, Nb, Hf, and Zr, and an Ag—Cu eutectic layer, in order from the ceramic member side, the thickness of the nitride compound layer is 0.15 μm or more and 1.0 μm or less, an intermetallic compound phase formed of an intermetallic compound that contains the nitride forming element and Si is present between the copper member and the ceramic member, and Cu and Si are present at the grain boundary of the nitride compound layer.
JOINING AND SEALING PRESSURIZED CERAMIC STRUCTURES
This patent document relates to systems, structures, devices, and fabrication processes for ceramic matrix composites suitable for use in a nuclear reactor environment and other applications requiring materials that can withstand high temperatures and/or highly corrosive environments. In one exemplary aspect, a method of joining and sealing ceramic structures is disclosed. The method comprises forming a joint of a ceramic structure and an end plug using a sealing material, wherein the end plug has a hole that goes through a top surface and a bottom surface of the end plug; filling the ceramic structure with a desired gas composition through the hole; heating a material into a molten form using a heat source; and directing the material into the hole, wherein the material solidifies to seal the end plug.
Nickel-Carbon And Nickel-Cobalt-Carbon Brazes And Brazing Processes For Joining Ceramics And Metals And Semiconductor Processing And Industrial Equipment Using Same
A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.
CERAMIC-ALUMINUM ASSEMBLY WITH BONDING TRENCHES
An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. A spacing between the first member and the second member along the adjacent faces is less than 5 m and a surface roughness of the adjacent faces of the first and second ceramic members is between 5 mm and 100 nanometers.
Ceramic-aluminum assembly with bonding trenches
An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 m.
LASER CUTTING OF METAL-CERAMIC SUBSTRATES
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.
SYSTEM AND METHOD FOR ELECTROSPINNING OF AN ULTRA-HIGH TEMPERATURE COMPOSITE STRUCTURE
A method for forming an ultra-high temperature (UHT) composite structure includes dispensing a polymeric precursor with a spinneret biased at a first DC voltage; forming a plurality of nanofibers from the polymeric precursor; receiving the plurality of nanofibers with a collector biased at a second DC voltage different than the first DC voltage; and changing a direction of movement of the plurality of nanofibers between the spinneret and the collector with a plurality of magnets having a magnetic field by adjusting the magnetic field.