C07C55/32

Photoresist with top-coating photo-decomposable base for photolithography

A lithographic method includes forming a photoresist layer on a target layer, forming a photo-decomposable base (PDB) layer on the photo resist layer, performing an exposure operation using a mask, and performing a negative development treatment to form a patterned photoresist layer on the target layer. In some cases, the photo-decomposable base layer includes a self-generating top coating photo-decomposable base (TC-PDB) layer. The method can also include forming a top surface water-resistant coating in separate coating process. In some embodiments, a top surface water-resistant coating is self-generated during a photoresist coating process.

Radiation-sensitive resin composition, method of forming resist pattern, and compound
12259653 · 2025-03-25 · ·

A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; a radiation-sensitive acid generator; and a compound represented by the following formula (1). In the following formula (1), R.sup.1 represents a hydrogen atom or a monovalent organic group having 1 to 30 carbon atoms; and X.sup.n+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3. It is preferable that R.sup.1 in the following formula (1) represents an organic group, and that the organic group has a ring structure. It is preferable that R.sup.1 in the following formula (1) represents an organic group, and that the organic group is an acid-labile group. X.sup.n+ in the following formula (1) preferably represents a sulfonium cation, an iodonium cation, or a combination thereof. ##STR00001##

Radiation-sensitive resin composition, method of forming resist pattern, and compound
12259653 · 2025-03-25 · ·

A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; a radiation-sensitive acid generator; and a compound represented by the following formula (1). In the following formula (1), R.sup.1 represents a hydrogen atom or a monovalent organic group having 1 to 30 carbon atoms; and X.sup.n+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3. It is preferable that R.sup.1 in the following formula (1) represents an organic group, and that the organic group has a ring structure. It is preferable that R.sup.1 in the following formula (1) represents an organic group, and that the organic group is an acid-labile group. X.sup.n+ in the following formula (1) preferably represents a sulfonium cation, an iodonium cation, or a combination thereof. ##STR00001##