Patent classifications
C08F12/34
PHOSPHORUS-CONTAINING RESIN AND FLAME-RETARDANT AND HEAT-RESISTANT COMPOSITION COMPRISING THE SAME
A phosphorus-containing resin, wherein the phosphorus-containing resin comprises a structure as below:
##STR00001## wherein R.sup.A and R.sup.B are each independently a phenylethene group; Ar.sup.1, Ar.sup.2 are each independently a bivalent arylene group. The phosphorus-containing resin of the instant disclosure has high reactivity, and may crosslink with other materials, making the flame-retardant and heat-resistant composition possess excellent flame-retardant and heat resistance effect, therefore having high industrial value.
Polymer functional film and method for producing same
The present invention provides a polymer functional film obtained by polymerizing and curing a composition including (A) a styrene-based monomer represented by Formula (HSM); (B) a crosslinking agent represented by Formula (CL); and (C) a polymerization initiator represented by Formula (PI-1) or (PI-2), and a method for producing the same: ##STR00001## in which R.sup.1 represents a halogen atom or N.sup.+(R.sup.2)(R.sup.3)(R.sup.4)(X.sub.1.sup.?); n1 represents an integer from 1 to 10; here, R.sup.2 to R.sup.4 each independently represent a particular substituent; X.sub.1.sup.? represents an organic or inorganic anion; L.sup.1 represents an alkylene group or an alkenylene group; Ra, Rb, Rc and Rd each independently represent a particular substituent; n2 and n4 each independently represent an integer from 1 to 10; X.sub.2.sup.? and X.sub.3.sup.? each independently represent an organic or inorganic anion; and R.sup.5 to R.sup.10 each represent a hydrogen atom or a particular substituent.
Polymer functional film and method for producing same
The present invention provides a polymer functional film obtained by polymerizing and curing a composition including (A) a styrene-based monomer represented by Formula (HSM); (B) a crosslinking agent represented by Formula (CL); and (C) a polymerization initiator represented by Formula (PI-1) or (PI-2), and a method for producing the same: ##STR00001## in which R.sup.1 represents a halogen atom or N.sup.+(R.sup.2)(R.sup.3)(R.sup.4)(X.sub.1.sup.?); n1 represents an integer from 1 to 10; here, R.sup.2 to R.sup.4 each independently represent a particular substituent; X.sub.1.sup.? represents an organic or inorganic anion; L.sup.1 represents an alkylene group or an alkenylene group; Ra, Rb, Rc and Rd each independently represent a particular substituent; n2 and n4 each independently represent an integer from 1 to 10; X.sub.2.sup.? and X.sub.3.sup.? each independently represent an organic or inorganic anion; and R.sup.5 to R.sup.10 each represent a hydrogen atom or a particular substituent.
Thermosetting composition with photo-alignment property, alignment layer, substrate with alignment layer, retardation plate, and device
A thermosetting composition with a photo-alignment property includes a copolymer containing a photo-alignment constitutional unit represented by the following formula (1) and a thermal cross-linking constitutional unit represented by the following formula (2). Here, in the formula (1), X represents a photo-alignment group, L.sup.1 represents a divalent linking group or a single bond, R.sup.1 represents a hydrogen atom or a monovalent organic group, and k represents 1 to 5; in the formula (2), Y represents a thermal cross-linking group, L.sup.2 represents a divalent linking group or a single bond, R.sup.2 represents a hydrogen atom or a monovalent organic group, and 1 represents 1 to 5. ##STR00001##
Thermosetting composition with photo-alignment property, alignment layer, substrate with alignment layer, retardation plate, and device
A thermosetting composition with a photo-alignment property includes a copolymer containing a photo-alignment constitutional unit represented by the following formula (1) and a thermal cross-linking constitutional unit represented by the following formula (2). Here, in the formula (1), X represents a photo-alignment group, L.sup.1 represents a divalent linking group or a single bond, R.sup.1 represents a hydrogen atom or a monovalent organic group, and k represents 1 to 5; in the formula (2), Y represents a thermal cross-linking group, L.sup.2 represents a divalent linking group or a single bond, R.sup.2 represents a hydrogen atom or a monovalent organic group, and 1 represents 1 to 5. ##STR00001##
Thermosetting composition with photo-alignment property, alignment layer, substrate with alignment layer, retardation plate, and device
An embodiment of the present invention provides a thermosetting composition with a photo-alignment property, including a copolymer containing a photo-alignment constitutional unit represented by the following formula (1) and a thermal cross-linking constitutional unit. In the formula (1), X represents a photo-alignment group causing a photo-isomerization reaction or a photo-dimerization reaction, L.sup.1 represents a single bond, O, S, COO, COS, CO, OCO, OCO(CH.sub.2).sub.nCOO, OCOCH.sub.2CH.sub.2OCH.sub.2CH.sub.2COO, OCOC.sub.6H.sub.4O, OCOC.sub.6H.sub.10O, COO(CH.sub.2).sub.nO, COOC.sub.6H.sub.4O, COOC.sub.6H.sub.10O, O(CH.sub.2).sub.nO, OC.sub.6H.sub.4O, OC.sub.6H.sub.10O, or (CH.sub.2).sub.nO, n represents 1 to 4, R.sup.1 represents a hydrogen atom or a monovalent organic group, and k represents 1 to 5. ##STR00001##
Thermosetting composition with photo-alignment property, alignment layer, substrate with alignment layer, retardation plate, and device
An embodiment of the present invention provides a thermosetting composition with a photo-alignment property, including a copolymer containing a photo-alignment constitutional unit represented by the following formula (1) and a thermal cross-linking constitutional unit. In the formula (1), X represents a photo-alignment group causing a photo-isomerization reaction or a photo-dimerization reaction, L.sup.1 represents a single bond, O, S, COO, COS, CO, OCO, OCO(CH.sub.2).sub.nCOO, OCOCH.sub.2CH.sub.2OCH.sub.2CH.sub.2COO, OCOC.sub.6H.sub.4O, OCOC.sub.6H.sub.10O, COO(CH.sub.2).sub.nO, COOC.sub.6H.sub.4O, COOC.sub.6H.sub.10O, O(CH.sub.2).sub.nO, OC.sub.6H.sub.4O, OC.sub.6H.sub.10O, or (CH.sub.2).sub.nO, n represents 1 to 4, R.sup.1 represents a hydrogen atom or a monovalent organic group, and k represents 1 to 5. ##STR00001##
ADHESIVES COMPRISING POLYINDANE RESINS
The present invention is generally related to various types of compositions that comprise a polyindane resin. In particular, the polyindane resins may be utilized in various polymer-based and elastomer-based formulations in order to enhance several properties and characteristics of those formulations. More specifically, adhesive formulations are provided that comprise at least one polyindane resin, which may be used to replace or enhance the functionality of existing hydrocarbon resins typically used in adhesive formulations. Compositions comprising at least one thermoplastic elastomer and at least one polyindane resin are also provided.
RESIN COMPOSITIONS
The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.
RESIN COMPOSITIONS
The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.