Provided herein are perfluoro copolymers of a perfluoro dioxole monomer, a perfluoro dioxane monomer, and an optional perhalo monomer. Methoda of making the perfluoro copolymers and methods of using the perfluoro copolymers are also disclosed.

The present disclosure provides a composition comprising: (A) a polypropylene polymer; (B) a polyolefin elastomer; (C) an acetoacetyl functional polymer; (D) an optional additive component; and (E) an optional compatibilizer. The present disclosure also provides an article made from the composition.

The present disclosure provides a composition comprising: (A) a polypropylene polymer; (B) a polyolefin elastomer; (C) an acetoacetyl functional polymer; (D) an optional additive component; and (E) an optional compatibilizer. The present disclosure also provides an article made from the composition.

The present invention provides a vinyl alcohol-amino acid ester copolymer that is excellent in properties such as cell culture properties, biocompatibility, antibacterial properties, and solubility in organic solvents, and is applicable to the medical field, the biomaterial field, and the agricultural field (medical and life science fields). Provided is a vinyl alcohol-amino acid ester copolymer including a unit represented by the following formula (1) and a unit represented by the following formula (2):

##STR00001##

where, in the formula (2), R.sup.1 represents a hydrocarbon group that may optionally have a substituent, R.sup.2 and R.sup.3 each independently represent a hydrogen atom or a hydrocarbon group, and R.sup.1 and R.sup.2, or R.sup.2 and R.sup.3, may optionally be bonded together to form a cyclic structure.

The present invention provides a vinyl alcohol-amino acid ester copolymer that is excellent in properties such as cell culture properties, biocompatibility, antibacterial properties, and solubility in organic solvents, and is applicable to the medical field, the biomaterial field, and the agricultural field (medical and life science fields). Provided is a vinyl alcohol-amino acid ester copolymer including a unit represented by the following formula (1) and a unit represented by the following formula (2):

##STR00001##

where, in the formula (2), R.sup.1 represents a hydrocarbon group that may optionally have a substituent, R.sup.2 and R.sup.3 each independently represent a hydrogen atom or a hydrocarbon group, and R.sup.1 and R.sup.2, or R.sup.2 and R.sup.3, may optionally be bonded together to form a cyclic structure.

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength. ##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength. ##STR00001##

Embodiments described herein relate to flat optical devices and encapsulation materials for flat optical devices. One or more embodiments include a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d. The first arrangement of the first plurality of pillars includes a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first adhesion-promoting material is disposed over the first arrangement of the first plurality of pillars. A first encapsulation layer is disposed over the first adhesion-promoting material. The first encapsulation layer fills the gap g between adjacent pillars of the first plurality of pillars. The first encapsulation layer includes a fluoropolymer.