C08F228/06

PHOTOACID-GENERATING COMPOUND AND ASSOCIATED POLYMER, PHOTORESIST COMPOSITION, AND METHOD OF FORMING A PHOTORESIST RELIEF IMAGE
20180095363 · 2018-04-05 ·

A photoacid-generating compound has the structure

##STR00001##

wherein m, n, R.sup.1, R.sup.2, X, Y, and Z.sup. are defined herein. The photoacid-generating compound exhibits strong absorption and chemical sensitivity to extreme ultraviolet radiation, while also absorbing longer wavelengths with desirably reduced chemical sensitivity. Also described are a polymer incorporating the residue of a polymerizable version of the photoacid-generating compound, a photoresist composition that includes the photoacid-generating compound, the polymer, or a combination thereof, and a method of forming a photoresist relief image using the photoresist composition.

Resist composition, method of forming resist pattern, and polymeric compound

A polymeric compound including a structural unit (a0) represented by general formula (a0-1) shown below and a polycyclic group-containing structural unit (a2m) other than the structural unit (a0), the structural unit (a2m) containing a lactone-containing polycyclic group, a SO.sub.2-containing polycyclic group or a carbonate-containing polycyclic group, and a resist composition including the same: ##STR00001##
wherein R.sup.0 represents a hydrocarbon group of 1 to 6 carbon atoms which may have a substituent, or a hydrogen atom; Ya.sup.0 represents a single bond or a divalent linking group; L represents an ester bond; and Ra.sup.0 represents a polycyclic group having a bridged ring polycyclic skeleton or a condensed ring polycyclic skeleton, which has in its skeleton C(O)O or SO.sub.2, and at least one of an alkyl group, an alkoxy group, a halogen atom and a halogenated alkyl group.

Resist composition, method of forming resist pattern, and polymeric compound

A polymeric compound including a structural unit (a0) represented by general formula (a0-1) shown below and a polycyclic group-containing structural unit (a2m) other than the structural unit (a0), the structural unit (a2m) containing a lactone-containing polycyclic group, a SO.sub.2-containing polycyclic group or a carbonate-containing polycyclic group, and a resist composition including the same: ##STR00001##
wherein R.sup.0 represents a hydrocarbon group of 1 to 6 carbon atoms which may have a substituent, or a hydrogen atom; Ya.sup.0 represents a single bond or a divalent linking group; L represents an ester bond; and Ra.sup.0 represents a polycyclic group having a bridged ring polycyclic skeleton or a condensed ring polycyclic skeleton, which has in its skeleton C(O)O or SO.sub.2, and at least one of an alkyl group, an alkoxy group, a halogen atom and a halogenated alkyl group.

A LIGHT-ACTIVATED RESIN COMPOSITION AND ITS USE IN 3D-PRINTING

The present invention relates to a light-activated resin composition comprising a multi-functional acrylate or methacrylate monomer, a cyclic monomer comprising a cleavable or pre-cleavable group and a photo-initiator. It also relates to a degradable polymer, a degradable 3D-printed article, and to a process for preparing such polymer and article. It further relates to the use of a monomer comprising a thionolactone or sulfide cyclic methacrylate for preparing a degradable 3D-printed article.

A LIGHT-ACTIVATED RESIN COMPOSITION AND ITS USE IN 3D-PRINTING

The present invention relates to a light-activated resin composition comprising a multi-functional acrylate or methacrylate monomer, a cyclic monomer comprising a cleavable or pre-cleavable group and a photo-initiator. It also relates to a degradable polymer, a degradable 3D-printed article, and to a process for preparing such polymer and article. It further relates to the use of a monomer comprising a thionolactone or sulfide cyclic methacrylate for preparing a degradable 3D-printed article.

Resist composition and pattern forming process

A resist composition is provided comprising a polymer comprising recurring units (a) having an oxazolidinedione, thioxooxazolidinone, thiazolidinedione or thioxothiazolidinone structure and recurring unit (b1) having an acid labile group-substituted carboxyl group and/or recurring units (b2) having an acid labile group-substituted phenolic hydroxyl group. The resist composition suppresses acid diffusion, exhibits a high resolution, and forms a pattern of satisfactory profile with low edge roughness.

Resist composition and pattern forming process

A resist composition is provided comprising a polymer comprising recurring units (a) having an oxazolidinedione, thioxooxazolidinone, thiazolidinedione or thioxothiazolidinone structure and recurring unit (b1) having an acid labile group-substituted carboxyl group and/or recurring units (b2) having an acid labile group-substituted phenolic hydroxyl group. The resist composition suppresses acid diffusion, exhibits a high resolution, and forms a pattern of satisfactory profile with low edge roughness.

ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

The present invention has an object to provide an active-light-sensitive or radiation-sensitive resin composition having high DOF and low LWR; a pattern forming method using the composition; and a method for manufacturing an electronic device. The active-light-sensitive or radiation-sensitive resin composition of the present invention includes a resin P and a compound that generates an acid upon irradiation with active light or radiation, in which the resin P has a repeating unit p1 and a repeating unit p2 represented by specific formulae, and the repeating unit p2 does not have a group in which a hydroxy group of a hydroxyadamantyl group is protected with a group that decomposes by the action of an acid to leave.

ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

The present invention has an object to provide an active-light-sensitive or radiation-sensitive resin composition having high DOF and low LWR; a pattern forming method using the composition; and a method for manufacturing an electronic device. The active-light-sensitive or radiation-sensitive resin composition of the present invention includes a resin P and a compound that generates an acid upon irradiation with active light or radiation, in which the resin P has a repeating unit p1 and a repeating unit p2 represented by specific formulae, and the repeating unit p2 does not have a group in which a hydroxy group of a hydroxyadamantyl group is protected with a group that decomposes by the action of an acid to leave.

METHOD FOR MANUFACTURING POLYMER COMPOUND
20170166664 · 2017-06-15 ·

A method for manufacturing a polymer compound which has a constituent unit (a10) which includes a hydroxy group and a constituent unit (a1) which includes an acid decomposable group of which a polarity increases due to an effect of an acid, the method including copolymerizing a monomer for deriving a constituent unit (a0) which includes a group which protects a phenolic hydroxyl group or a hydroxy group of a carboxy group with an organic silicon compound and a monomer for deriving the constituent unit (a1) and obtaining a prepolymer which has the constituent unit (a0) and the constituent unit (a1), and selectively deprotecting the constituent unit (a0) by reacting a compound which has a fluoride anion with the prepolymer and obtaining a polymer compound which has the constituent unit (a10) and the constituent unit (a1).