Patent classifications
C08F267/10
Dielectric Film Forming Composition
This disclosure relates to dielectric film forming compositions containing a) at least one fully imidized polyimide polymer; b) at least one metal-containing (meth)acrylates; c) at least one catalyst; and d) at least one solvent, as well as related processes and related products. The compositions can form a dielectric film that generates substantially no debris when the dielectric film is patterned by laser ablation process.
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
An object of the present invention is to provide a resin composition which does not inhibit photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention contains: a compound (A) represented by the following formula (1); and a compound (B) containing one or more carboxy groups, other than the compound (A) represented by the following formula (1):
##STR00001## wherein each R.sub.1 independently represents a group represented by the following formula (2) or a hydrogen atom; and each R.sub.2 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R.sub.1 is a group represented by the following formula (2):
##STR00002## wherein -* represents a bonding hand.
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
An object of the present invention is to provide a resin composition which does not inhibit photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention contains: a compound (A) represented by the following formula (1); and a compound (B) containing one or more carboxy groups, other than the compound (A) represented by the following formula (1):
##STR00001## wherein each R.sub.1 independently represents a group represented by the following formula (2) or a hydrogen atom; and each R.sub.2 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R.sub.1 is a group represented by the following formula (2):
##STR00002## wherein -* represents a bonding hand.
CONTROL OF POLYMER ARCHITECTURES BY LIVING RING-OPENING METATHESIS COPOLYMERIZATION
In an aspect, a method of synthesizing a graft copolymer comprises the steps of: copolymerizing a first macromonomer and a first reactive diluent; wherein said first macromonomer comprises a first backbone precursor directly or indirectly covalently linked to a first polymer side chain group; wherein said reactive diluent is provided in the presence of the first macromonomer at an amount selected so as to result in formation said graft copolymer having a first backbone incorporating said diluent and said first macromonomer in a first polymer block characterized by a preselected first graft density or a preselected first graft distribution of said first macromonomer. In some embodiments of this aspect, said preselected first graft density is any value selected from the range of 0.05 to 0.75. In some methods, the composition and amount of said diluent is selected to provide both a first preselected first graft density and a first preselected first graft distribution.
CONTROL OF POLYMER ARCHITECTURES BY LIVING RING-OPENING METATHESIS COPOLYMERIZATION
In an aspect, a method of synthesizing a graft copolymer comprises the steps of: copolymerizing a first macromonomer and a first reactive diluent; wherein said first macromonomer comprises a first backbone precursor directly or indirectly covalently linked to a first polymer side chain group; wherein said reactive diluent is provided in the presence of the first macromonomer at an amount selected so as to result in formation said graft copolymer having a first backbone incorporating said diluent and said first macromonomer in a first polymer block characterized by a preselected first graft density or a preselected first graft distribution of said first macromonomer. In some embodiments of this aspect, said preselected first graft density is any value selected from the range of 0.05 to 0.75. In some methods, the composition and amount of said diluent is selected to provide both a first preselected first graft density and a first preselected first graft distribution.
RESIN COMPOSITION, PREPREG OR RESIN SHEET COMPRISING THE RESIN COMPOSITION, AND LAMINATE AND PRINTED CIRCUIT BOARD COMPRISING THEM
The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
RESIN COMPOSITION, PREPREG OR RESIN SHEET COMPRISING THE RESIN COMPOSITION, AND LAMINATE AND PRINTED CIRCUIT BOARD COMPRISING THEM
The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
RESIN COMPOSITION, PREPREG OR RESIN SHEET COMPRISING THE RESIN COMPOSITION, AND LAMINATE AND PRINTED CIRCUIT BOARD COMPRISING THEM
The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
Lignin-Containing Polymers
Click reactions may be used to bond polymers to lignin by taking advantage of lignin's terminal hydroxyl and thiol groups via an alkyne-azide click reaction or a thiol-alkene or thiol-alkyne click reaction. By selecting functional polymers, these methods may be used to synthesize lignin-containing polymer materials with an array of different properties, such as self-healing polymers.
Lignin-Containing Polymers
Click reactions may be used to bond polymers to lignin by taking advantage of lignin's terminal hydroxyl and thiol groups via an alkyne-azide click reaction or a thiol-alkene or thiol-alkyne click reaction. By selecting functional polymers, these methods may be used to synthesize lignin-containing polymer materials with an array of different properties, such as self-healing polymers.