Patent classifications
C08F2500/08
Ethylene/Alpha-Olefin Copolymer with Excellent Electrical Insulation
An ethylene/alpha-olefin copolymer and method for preparing the same is disclosed herein. In some embodiments, an ethylene/alpha-olefin copolymer satisfying the following conditions, (a) a density of 0.85 to 0.89 g/cc, (b) a molecular weight distribution of 1.8 to 2.3, (c) a melt index (MI.sub.2.16) of 1 to 100 dg/min, and (d) a full width at half maximum (FWHM) of a crystallization peak of 15 or more. The ethylene/alpha-olefin copolymer has high volume resistance and light transmittance.
Ethylene/Alpha-Olefin Copolymer with Excellent Electrical Insulation
An ethylene/alpha-olefin copolymer and method for preparing the same is disclosed herein. In some embodiments, an ethylene/alpha-olefin copolymer satisfying the following conditions, (a) a density of 0.85 to 0.89 g/cc, (b) a molecular weight distribution of 1.8 to 2.3, (c) a melt index (MI.sub.2.16) of 1 to 100 dg/min, and (d) a full width at half maximum (FWHM) of a crystallization peak of 15 or more. The ethylene/alpha-olefin copolymer has high volume resistance and light transmittance.
CATALYST COMPONENTS FOR THE POLYMERIZATION OF OLEFINS
A solid catalyst component for the homopolymerization or copolymerization of olefins, made from or containing Ti, Mg, halogen, and at least one non-aromatic diazo compounds.
MULTIMODAL ETHYLENE COPOLYMER
The present invention relates to a new multimodal ethylene copolymer (P), to the use of the copolymer in film applications and to a film comprising the copolymer of the invention.
MULTIMODAL ETHYLENE COPOLYMER
The present invention relates to a new multimodal ethylene copolymer (P), to the use of the copolymer in film applications and to a film comprising the copolymer of the invention.
Olefin-based polymer
The present invention relates to an olefin-based polymer, which has (1) a density (d) ranging from 0.85 to 0.90 g/cc, (2) a melt index (MI, 190° C., 2.16 kg load conditions) ranging from 0.1 g/10 min to 15 g/10 min, (3) the density (d) and the melt temperature (Tm) satisfying Tm (° C.)=a×d−b of Equation 1 (2,350<a<2,500, and 1,900<b<2,100), and (4) a ratio (hardness/Tm) of the hardness (shore A) to the melt temperature (Tm) in a range of 1.0 to 1.3. The olefin-based polymer according to the present invention exhibits excellent anti-blocking properties due to having improved hardness as a low-density olefin-based polymer.
Olefin-based polymer
The present invention relates to an olefin-based polymer, which has (1) a density (d) ranging from 0.85 to 0.90 g/cc, (2) a melt index (MI, 190° C., 2.16 kg load conditions) ranging from 0.1 g/10 min to 15 g/10 min, (3) the density (d) and the melt temperature (Tm) satisfying Tm (° C.)=a×d−b of Equation 1 (2,350<a<2,500, and 1,900<b<2,100), and (4) a ratio (hardness/Tm) of the hardness (shore A) to the melt temperature (Tm) in a range of 1.0 to 1.3. The olefin-based polymer according to the present invention exhibits excellent anti-blocking properties due to having improved hardness as a low-density olefin-based polymer.
RESIN COMPOSITION AND MOLDED ARTICLE
An object of the present invention is to provide a resin composition and a molded article each having suppressed surface stickiness while having high stress-relaxing ability and vibration-absorbing ability at room temperature. A resin composition (X) containing 10 to 50 parts by mass of a thermoplastic resin (A) and 50 to 90 parts by mass of an inorganic substance (B), wherein a tan δ peak temperature and tan δ peak value, obtained by performing dynamic viscoelastic measurement at a frequency of 10 rad/s (1.6 Hz) in the temperature range of −40 to 150° C., are 0° C. or higher and 60° C. or lower, and 0.8 or more and 5.0 or less, respectively.
RESIN COMPOSITION AND MOLDED ARTICLE
An object of the present invention is to provide a resin composition and a molded article each having suppressed surface stickiness while having high stress-relaxing ability and vibration-absorbing ability at room temperature. A resin composition (X) containing 10 to 50 parts by mass of a thermoplastic resin (A) and 50 to 90 parts by mass of an inorganic substance (B), wherein a tan δ peak temperature and tan δ peak value, obtained by performing dynamic viscoelastic measurement at a frequency of 10 rad/s (1.6 Hz) in the temperature range of −40 to 150° C., are 0° C. or higher and 60° C. or lower, and 0.8 or more and 5.0 or less, respectively.
Olefin-Based Polymer
The present invention relates to an olefin-based polymer satisfying requirements: (1) a melt index (MI, 190° C., 2.16 kg load conditions) ranging from 1.0 to 10.0 g/10 min; (2) a density (d) ranging from 0.875 to 0.895 g/cc; (3) 0.5 J/g≤dH(100)≤3.0 J/g and 1.0 J/g≤dH(90)≤6.0 J/g as measured by successive self-nucleation/annealing (SSA) using a differential scanning calorimeter (DSC); (4) 15≤T(90)−T(50)≤30 and 50° C.≤T(50)≤75° C. as measured by SSA using a DSC; and (5) a melting point (Tm) of 55° C.≤Tm≤80° C. as measured using a DSC. The olefin-based polymer according to the present invention is a low-density olefin-based polymer and has a highly crystalline region introduced therein, thereby exhibiting high mechanical stiffness.