Patent classifications
C08G8/04
High-rigidity rubber composition
A rubber composition comprises at least one phenol/aldehyde resin based on at least one aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted, and at least one aromatic polyaldehyde selected from 1,3-benzenedicarboxaldehyde, 1,4-benzenedicarboxaldehyde and mixtures of these compounds.
POLYMER, ORGANIC LAYER COMPOSITION AND METHOD OF FORMING PATTERNS
A polymer, an organic layer composition including the polymer, and a method of forming a pattern using the organic layer composition, the polymer including a reaction product of a first compound represented by Chemical Formula 1 and a second compound represented by Chemical Formula 2:
(CHO).sub.n1Ar.sup.1XAr.sup.2(CHO).sub.n2[Chemical Formula 1] wherein, in Chemical Formula 1, X is O, S, or NR, in which R is a hydrogen, or a substituted or unsubstituted C1 to C30 alkyl group, Ar.sup.1 and Ar.sup.2 are independently a substituted or unsubstituted C6 to C30 aromatic ring group, and n1 and n2 are independently an integer of 1 to 3;
Ar.sup.3(OH).sub.m[Chemical Formula 2] wherein, in Chemical Formula 2, Ar.sup.3 is a substituted or unsubstituted C10 to C30 fused aromatic ring group in which at least two rings are fused, and m is an integer of 1 to 3.
POLYMER, ORGANIC LAYER COMPOSITION AND METHOD OF FORMING PATTERNS
A polymer, an organic layer composition including the polymer, and a method of forming a pattern using the organic layer composition, the polymer including a reaction product of a first compound represented by Chemical Formula 1 and a second compound represented by Chemical Formula 2:
(CHO).sub.n1Ar.sup.1XAr.sup.2(CHO).sub.n2[Chemical Formula 1] wherein, in Chemical Formula 1, X is O, S, or NR, in which R is a hydrogen, or a substituted or unsubstituted C1 to C30 alkyl group, Ar.sup.1 and Ar.sup.2 are independently a substituted or unsubstituted C6 to C30 aromatic ring group, and n1 and n2 are independently an integer of 1 to 3;
Ar.sup.3(OH).sub.m[Chemical Formula 2] wherein, in Chemical Formula 2, Ar.sup.3 is a substituted or unsubstituted C10 to C30 fused aromatic ring group in which at least two rings are fused, and m is an integer of 1 to 3.
EXPANDABLE POROUS ORGANIC POLYMER-BASED HYDROGEN ION CONDUCTIVE MATERIAL AND METHOD FOR PREPARING SAME
The present invention relates to a porous organic polymer-based hydrogen ion conductive material and a method for preparing the same. More specifically, the present invention relates to a method for preparing a porous organic polymer (POP)-based material with high proton conductivity that is applicable to a membrane electrode assembly (MEA) of a proton exchange membrane fuel cell (PEMFC). The porous organic polymer-based proton conductive material of the present invention can be prepared in an easy and simple manner by microwave treatment and acid treatment requiring short processing time and low processing cost. In addition, the porous organic polymer-based proton conductive material of the present invention can be developed into a highly proton conductive material having the potential to replace Nafion through a simple post-synthesis modification. Therefore, the porous organic polymer-based proton conductive material of the present invention is suitable for use in a proton exchange membrane fuel cell.
METHOD FOR PURIFYING COMPOUND OR RESIN AND METHOD FOR PRODUCING COMPOSITION
A method for purifying a material, the method comprising: a step of preparing a solution comprising a solvent and at least one material selected from the group consisting of a compound represented by the following formula (1A) and a resin having a structure represented by the following formula (2A); and a step of purification in which the solution is passed through a filter:
##STR00001## wherein, X represents an oxygen atom, a sulfur atom, a single bond, or non-crosslinked state; R.sup.a represents a 2n-valent group having 1 to 40 carbon atoms or a single bond; each R.sup.b independently represents one of various functional groups; each m is independently an integer of 0 to 9; n is an integer of 1 to 4; and each p is independently an integer of 0 to 2; provided that at least one R.sup.b represents a group comprising one selected from a hydroxyl group and a thiol group, and all m cannot be 0 at the same time;
##STR00002## wherein, X, R.sup.a, R.sup.b, n and p are the same as defined in the formula (1A); R.sup.c represents a single bond or an alkylene group having 1 to 40 carbon atoms; each m.sup.2 is independently an integer of 0 to 8; provided that at least one R.sup.b represents a group comprising one or more selected from a hydroxyl group and a thiol group, and all m.sup.2 cannot be 0 at the same time.
METHOD FOR PURIFYING COMPOUND OR RESIN AND METHOD FOR PRODUCING COMPOSITION
A method for purifying a material, the method comprising: a step of preparing a solution comprising a solvent and at least one material selected from the group consisting of a compound represented by the following formula (1A) and a resin having a structure represented by the following formula (2A); and a step of purification in which the solution is passed through a filter:
##STR00001## wherein, X represents an oxygen atom, a sulfur atom, a single bond, or non-crosslinked state; R.sup.a represents a 2n-valent group having 1 to 40 carbon atoms or a single bond; each R.sup.b independently represents one of various functional groups; each m is independently an integer of 0 to 9; n is an integer of 1 to 4; and each p is independently an integer of 0 to 2; provided that at least one R.sup.b represents a group comprising one selected from a hydroxyl group and a thiol group, and all m cannot be 0 at the same time;
##STR00002## wherein, X, R.sup.a, R.sup.b, n and p are the same as defined in the formula (1A); R.sup.c represents a single bond or an alkylene group having 1 to 40 carbon atoms; each m.sup.2 is independently an integer of 0 to 8; provided that at least one R.sup.b represents a group comprising one or more selected from a hydroxyl group and a thiol group, and all m.sup.2 cannot be 0 at the same time.
Heat treated polymer powders
The invention relates to heat treatment of polymorphic semicrystalline or crystallizable polymers to increase the content of the highest melting crystalline form. Such heat treatment results in a polymer powder that has a consistent, uniform melting range, improved flow and improved durability of the powder particle size for applications that require powder flow at elevated temperatures. In addition to improved powder properties, the articles produced from the powders also exhibit better physical properties in both appearance and in mechanical properties. Thus the invention also includes polymer powders and articles produced by the described processes.
Resist multilayer film-attached substrate and patterning process
The present invention provides a resist multilayer film-attached substrate, including a substrate and a resist multilayer film formed on the substrate, in which the resist multilayer film has an organic resist underlayer film difficultly soluble in ammonia hydrogen peroxide water, an organic film soluble in ammonia hydrogen peroxide water, a silicon-containing resist middle layer film, and a resist upper layer film laminated on the substrate in the stated order. There can be provided a resist multilayer film-attached substrate that enables a silicon residue modified by dry etching to be easily removed in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.
Resist multilayer film-attached substrate and patterning process
The present invention provides a resist multilayer film-attached substrate, including a substrate and a resist multilayer film formed on the substrate, in which the resist multilayer film has an organic resist underlayer film difficultly soluble in ammonia hydrogen peroxide water, an organic film soluble in ammonia hydrogen peroxide water, a silicon-containing resist middle layer film, and a resist upper layer film laminated on the substrate in the stated order. There can be provided a resist multilayer film-attached substrate that enables a silicon residue modified by dry etching to be easily removed in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.
OPTICAL MEMBER FORMING COMPOSITION
The present invention provides an optical member forming composition comprising a compound represented by the following formula (0):
##STR00001##