C08G8/04

Laminate and making method

A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.

Method for producing an ablative resin

A method for producing a propulsion nozzle, wherein the nozzle is produced from an ablative resin, the method including a step of pre-polymerization wherein an innovative aldehyde compound is used.

Method for producing an ablative resin

A method for producing a propulsion nozzle, wherein the nozzle is produced from an ablative resin, the method including a step of pre-polymerization wherein an innovative aldehyde compound is used.

Process for the preparation of novolac alkylphenol resins

Process for the preparation of a novolac alkylphenol resin using a defined mixture of mono- and dialkylphenols, an aldehyde, and an acid catalyst. The mixture of mono- and dialkylphenols comprises 20 to 70 mol % mono-alkylphenols having an alkyl group of 1 to 18 carbon atoms, and 30 to 80 mol % of dialkylphenols having alkyl groups of 1 to 18 carbon atoms. The molar ratio of aldehyde in comparison to the mono- and dialkylphenol mixture is greater than or equal to 1. Novolac alkylphenol resins prepared according to this invention contain, of each individual starting material phenolic monomer component, less than 0.5 mass %, and in the best case, less than 0.1 mass % in comparison to the total obtained alkylphenol resin.

Phenolic resin composition, epoxy resin composition, and cured epoxy resin
10351660 · 2019-07-16 · ·

A phenolic resin composition and an epoxy resin composition from which a cured epoxy resin having excellent heat resisting properties and a low dielectric constant can be produced. The phenolic resin composition contains a modified phenolic resin and a tetrakisphenolethane compound, the modified phenolic resin being prepared by condensation of a cyclic hydrocarbon compound having two or more unsaturated bonds and a compound having a phenolic hydroxyl group, in which the content of the tetrakisphenolethane compound is 3% to 60% by mass with respect to the total content of the modified phenolic resin and the tetrakisphenolethane compound. The epoxy resin composition is prepared by epoxidizing the phenolic resin composition. The cured epoxy resin is prepared by allowing the epoxy resin composition to react with a hardener.

Phenolic resin composition, epoxy resin composition, and cured epoxy resin
10351660 · 2019-07-16 · ·

A phenolic resin composition and an epoxy resin composition from which a cured epoxy resin having excellent heat resisting properties and a low dielectric constant can be produced. The phenolic resin composition contains a modified phenolic resin and a tetrakisphenolethane compound, the modified phenolic resin being prepared by condensation of a cyclic hydrocarbon compound having two or more unsaturated bonds and a compound having a phenolic hydroxyl group, in which the content of the tetrakisphenolethane compound is 3% to 60% by mass with respect to the total content of the modified phenolic resin and the tetrakisphenolethane compound. The epoxy resin composition is prepared by epoxidizing the phenolic resin composition. The cured epoxy resin is prepared by allowing the epoxy resin composition to react with a hardener.

RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I):

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wherein m, n, 1, R.sub.1, and R.sub.2 are as defined in the specification.

GLYOXALATED LIGNIN COMPOSITIONS
20190194510 · 2019-06-27 ·

This disclosure includes adhesive compositions comprising lignin, as well as methods of making such adhesive compositions, methods of making glyoxalated lignin or glyoxalating lignin-fiber mixtures, particularly glyoxalated kraft lignin, and methods of making lignocellulosic composite products including the present adhesive compositions.

METHOD FOR PRODUCING DIHYDROXYNAPHTHALENE CONDENSATE AND DIHYDROXYNAPHTHALENE CONDENSATE

The invention provides: a dihydroxynaphthalene condensate which suppresses soft particle generation and is suitably usable for a composition excellent in filterability; and a method for producing the dihydroxynaphthalene condensate, in the method for producing a dihydroxynaphthalene condensate, dihydroxynaphthalene to be used has a sulfur element content of 100 ppm or less in terms of mass among constituent elements. The dihydroxynaphthalene and a condensation agent are condensed in presence of an acid or a base to produce the dihydroxynaphthalene condensate.

HALOGEN AND POLYHALIDE MEDIATED PHENOLIC POLYMERIZATION
20190177587 · 2019-06-13 ·

The disclosure provides a catalyst for use with a phenolic resins which imparts accelerated curing at reduced temperatures. The catalyst is selected from elemental halogen or onium polyhalide compounds.