An underlayer composition, comprising a polymer comprising a repeating unit of formula (1):

##STR00001##

wherein Ar is a monocyclic or polycyclic C.sub.5-60 aromatic group, wherein the aromatic group comprises one or more aromatic ring heteroatoms, a substituent group comprising a heteroatom, or a combination thereof; X is C or O; R.sup.1, R.sup.2; R.sup.a and R.sup.b are as provided herein; optionally, R.sup.1 and R.sup.2 can be taken together form a 5- to 7-membered ring; optionally, one of R.sup.11 to R.sup.13 can be taken together with R.sup.1 to form a 5- to 7-membered ring; wherein R.sup.a and R.sup.b optionally may be taken together to form a 5- to 7-membered ring; wherein one of R.sup.a or R.sup.b optionally may be taken together with R.sup.2 to form a 5- to 7-membered ring; and when X is O, R.sup.a and R.sup.b are absent.

An underlayer composition, comprising a polymer comprising a repeating unit of formula (1):

##STR00001##

wherein Ar is a monocyclic or polycyclic C.sub.5-60 aromatic group, wherein the aromatic group comprises one or more aromatic ring heteroatoms, a substituent group comprising a heteroatom, or a combination thereof; X is C or O; R.sup.1, R.sup.2; R.sup.a and R.sup.b are as provided herein; optionally, R.sup.1 and R.sup.2 can be taken together form a 5- to 7-membered ring; optionally, one of R.sup.11 to R.sup.13 can be taken together with R.sup.1 to form a 5- to 7-membered ring; wherein R.sup.a and R.sup.b optionally may be taken together to form a 5- to 7-membered ring; wherein one of R.sup.a or R.sup.b optionally may be taken together with R.sup.2 to form a 5- to 7-membered ring; and when X is O, R.sup.a and R.sup.b are absent.

Provided is a composition containing a polyphenol compound (B) and a solvent, in which the polyphenol compound (B) is at least one selected from a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2):

##STR00001##

wherein R.sup.Y, R.sup.T, X, m, N, r, and L are as described in the description.

Provided is a composition containing a polyphenol compound (B) and a solvent, in which the polyphenol compound (B) is at least one selected from a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2):

##STR00001##

wherein R.sup.Y, R.sup.T, X, m, N, r, and L are as described in the description.

An object of the present invention is to provide a useful underlayer film forming composition. The following underlayer film forming composition can solve the problem described above. An underlayer film forming composition comprising: a compound having a constituent unit represented by the following formula (1); and a solvent, wherein the weight average molecular weight of the compound is 1,000 to 30,000 as the molecular weight in terms of polystyrene, and the solubility of the compound in propylene glycol monomethyl ether acetate is 10% by mass at 23° C.:

##STR00001##

wherein A is a single bond or a divalent group; each R.sup.1 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group; each R.sup.2 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group, where at least one R.sup.2 is a hydroxy group and/or a thiol group; each m.sup.1 is independently an integer of 0 to 5; each m.sup.2 is independently an integer of 0 to 8; and each p.sup.2 is independently an integer of 0 to 2.

An object of the present invention is to provide a useful underlayer film forming composition. The following underlayer film forming composition can solve the problem described above. An underlayer film forming composition comprising: a compound having a constituent unit represented by the following formula (1); and a solvent, wherein the weight average molecular weight of the compound is 1,000 to 30,000 as the molecular weight in terms of polystyrene, and the solubility of the compound in propylene glycol monomethyl ether acetate is 10% by mass at 23° C.:

##STR00001##

wherein A is a single bond or a divalent group; each R.sup.1 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group; each R.sup.2 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group, where at least one R.sup.2 is a hydroxy group and/or a thiol group; each m.sup.1 is independently an integer of 0 to 5; each m.sup.2 is independently an integer of 0 to 8; and each p.sup.2 is independently an integer of 0 to 2.

The invention relates to heat treatment of polymorphic semicrystalline or crystallizable polymers to increase the content of the highest melting crystalline form. Such heat treatment results in a polymer powder that has a consistent, uniform melting range, improved flow and improved durability of the powder particle size for applications that require powder flow at elevated temperatures. In addition to improved powder properties, the articles produced from the powders also exhibit better physical properties in both appearance and in mechanical properties. Thus the invention also includes polymer powders and articles produced by the described processes.

The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process. ##STR00001##

The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process. ##STR00001##

A polymer to which there is attached a group represented by the following formula (1):

##STR00001##

(wherein each of R.sub.x, S.sub.y, and S.sub.z represents a hydrogen atom or a monovalent organic group; each of R.sub.y and R.sub.z represents a single bond or a divalent organic group; each of ring Ar.sub.y and ring Ar.sub.z represents a C4 to C20 cyclic alkyl group or a C6 to C30 aryl group, and ring Ar.sub.y and ring Ar.sub.z may be linked together to form a new ring structure therebetween; n.sub.y is an integer of 0 to the maximum number corresponding to allowable substitution to ring Ar.sub.y; n.sub.z is an integer of 0 to the maximum number corresponding to allowable substitution to ring Ar.sub.z; and * is a polymer bonding site).