A polymer to which there is attached a group represented by the following formula (1):

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(wherein each of R.sub.x, S.sub.y, and S.sub.z represents a hydrogen atom or a monovalent organic group; each of R.sub.y and R.sub.z represents a single bond or a divalent organic group; each of ring Ar.sub.y and ring Ar.sub.z represents a C4 to C20 cyclic alkyl group or a C6 to C30 aryl group, and ring Ar.sub.y and ring Ar.sub.z may be linked together to form a new ring structure therebetween; n.sub.y is an integer of 0 to the maximum number corresponding to allowable substitution to ring Ar.sub.y; n.sub.z is an integer of 0 to the maximum number corresponding to allowable substitution to ring Ar.sub.z; and * is a polymer bonding site).

Compositions, methods, and resins using alkyl aldehydes and phenols are provided herein. In one embodiment, a composition comprising an alkylphenol resin can be prepared by condensing at least one phenolic monomer selected from the group consisting of phenol, cresol, resorcinol, xylenol, ethyl phenol, alkylresorcinols, and combinations thereof; and at least one alkyl aldehyde having from 5 to 12 carbon atom alkyl groups. The alkylphenol resins of the application are free of octylphenol or nonylphenol monomers. In one embodiment, the alkylphenol resins may be prepared using formaldehyde, and alternatively, in another embodiment, the alkylphenol resins may be prepared without the use of formaldehyde. The process to make these new alternative alkylphenol resins is a cost effective process and easy to scale-up.

Compositions, methods, and resins using alkyl aldehydes and phenols are provided herein. In one embodiment, a composition comprising an alkylphenol resin can be prepared by condensing at least one phenolic monomer selected from the group consisting of phenol, cresol, resorcinol, xylenol, ethyl phenol, alkylresorcinols, and combinations thereof; and at least one alkyl aldehyde having from 5 to 12 carbon atom alkyl groups. The alkylphenol resins of the application are free of octylphenol or nonylphenol monomers. In one embodiment, the alkylphenol resins may be prepared using formaldehyde, and alternatively, in another embodiment, the alkylphenol resins may be prepared without the use of formaldehyde. The process to make these new alternative alkylphenol resins is a cost effective process and easy to scale-up.

An object of the present invention is to provide a new compound that is useful as a film forming material for lithography and the like. The above object can be achieved by a compound represented by the following formula (1).

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An object of the present invention is to provide a new compound that is useful as a film forming material for lithography and the like. The above object can be achieved by a compound represented by the following formula (1).

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A hard-mask forming composition including a resin (P1) containing a structural unit (u11) represented by General Formula (u11-1), and a resin (P2) containing an aromatic ring and a polar group, provided that the resin (P1) is excluded from the resin (P2), wherein R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, Rp.sup.11 is an aldehyde group, a group represented by Formula (u-r-1), a group represented by Formula (u-r-2), or a group represented by Formula (u-r-3)

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An alkoxylated bio-oil composition is provided. The alkoxylated bio-oil composition may include an alkoxylated bio-oil prepared from an alkoxylation of dewatered bio-oil. A method for preparing an alkoxylated bio-oil composition is provided. A copolymer composition is provided. The copolymer composition may include an alkoxylated bio-oil copolymer unit. A method for preparing a copolymer composition is provided.

An alkoxylated bio-oil composition is provided. The alkoxylated bio-oil composition may include an alkoxylated bio-oil prepared from an alkoxylation of dewatered bio-oil. A method for preparing an alkoxylated bio-oil composition is provided. A copolymer composition is provided. The copolymer composition may include an alkoxylated bio-oil copolymer unit. A method for preparing a copolymer composition is provided.

An object of the present invention is to provide a compound and the like that are applicable to a wet process and are useful for forming a photoresist and an underlayer film for photoresists excellent in heat resistance, solubility, and etching resistance. A compound represented by the following formula (1) can solve the problem described above.

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The present invention provides a composition capable of forming a film having high etching resistance, as well as a method for forming a resist pattern and a method for forming an insulating film, using the composition.

A composition comprising a base material (A) and a polyphenol compound (B), wherein the mass ratio between the base material (A) and the polyphenol compound (B) is 5:95 to 95:5.

A method for forming an insulating film, comprising the step of: developing the photoresist layer after the radiation irradiation.