Patent classifications
C08G8/04
SURFACE FORMULATIONS COMPRISING PHENOLS
The present disclosure describes surface formulations that form a layer on surfaces and comprise a phenol selected from: (I), (II), (III), (IV) or (V), with detailed descriptions of variables herein.
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SURFACE FORMULATIONS COMPRISING PHENOLS
The present disclosure describes surface formulations that form a layer on surfaces and comprise a phenol selected from: (I), (II), (III), (IV) or (V), with detailed descriptions of variables herein.
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PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE LAYER AND METHOD FOR PATTERN FORMATION
A photosensitive resin composition, a protective layer, and a method for pattern formation are provided. The photosensitive resin composition includes an alkali-soluble resin (A), a sensitizer (B), an additive (C), and a solvent (D). The additive (C) includes a compound represented by Formula (C-1) as follows. In Formula (C-1), the definitions of R.sup.1 to R.sup.4 are as defined in the specification.
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PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE LAYER AND METHOD FOR PATTERN FORMATION
A photosensitive resin composition, a protective layer, and a method for pattern formation are provided. The photosensitive resin composition includes an alkali-soluble resin (A), a sensitizer (B), an additive (C), and a solvent (D). The additive (C) includes a compound represented by Formula (C-1) as follows. In Formula (C-1), the definitions of R.sup.1 to R.sup.4 are as defined in the specification.
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COMPOUND, COMPOSITION CONTAINING THE SAME, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR FORMING INSULATING FILM
A composition containing a polyphenol compound (B), wherein the polyphenol compound (B) is one or more selected from the group consisting of a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2):
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COMPOUND, COMPOSITION CONTAINING THE SAME, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR FORMING INSULATING FILM
A composition containing a polyphenol compound (B), wherein the polyphenol compound (B) is one or more selected from the group consisting of a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2):
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Halogen and polyhalide mediated phenolic polymerization
A catalyst for use with a phenolic resins which imparts accelerated curing at reduced temperatures. The catalyst is selected from elemental halogen or opium polyhalide compounds of the general formula:
O.sup.+X.sub.(2n+1).sup.,
where 1n4, Q is onium group, preferably selected from ammonium, sulfonium and phosphonium; and X is a halide. Each X may be the same or different and may include mixed halides such a XBr.sub.2Cl or Cl.sub.2Br.
Halogen and polyhalide mediated phenolic polymerization
A catalyst for use with a phenolic resins which imparts accelerated curing at reduced temperatures. The catalyst is selected from elemental halogen or opium polyhalide compounds of the general formula:
O.sup.+X.sub.(2n+1).sup.,
where 1n4, Q is onium group, preferably selected from ammonium, sulfonium and phosphonium; and X is a halide. Each X may be the same or different and may include mixed halides such a XBr.sub.2Cl or Cl.sub.2Br.
Direct alkoxylation of bio-oil
An alkoxylated bio-oil composition is provided. The alkoxylated bio-oil composition may include an alkoxylated bio-oil prepared from an alkoxylation of dewatered bio-oil. A method for preparing an alkoxylated bio-oil composition is provided. A copolymer composition is provided. The copolymer composition may include an alkoxylated bio-oil copolymer unit. A method for preparing a copolymer composition is provided.
Direct alkoxylation of bio-oil
An alkoxylated bio-oil composition is provided. The alkoxylated bio-oil composition may include an alkoxylated bio-oil prepared from an alkoxylation of dewatered bio-oil. A method for preparing an alkoxylated bio-oil composition is provided. A copolymer composition is provided. The copolymer composition may include an alkoxylated bio-oil copolymer unit. A method for preparing a copolymer composition is provided.