C08G8/28

Methods for making wet gels and dried gels therefrom

Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can include a carboxylic acid, an anhydride, a homopolymer, a copolymer, or any mixture thereof. At least the hydroxybenzene compound and the aldehyde compound can be reacted to produce a wet gel. The reaction mixture can include about 10 wt % to about 65 wt % of the hydroxybenzene compound, about 5 wt % to about 25 wt % of the aldehyde compound, up to about 85 wt % of the carboxylic acid, up to about 40 wt % of the anhydride, up to about 40 wt % of the homopolymer, and up to about 40 wt % of the copolymer, where weight percent values are based on the combined weight of the hydroxybenzene compound, the aldehyde compound, and the additive.

Methods for making wet gels and dried gels therefrom

Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can include a carboxylic acid, an anhydride, a homopolymer, a copolymer, or any mixture thereof. At least the hydroxybenzene compound and the aldehyde compound can be reacted to produce a wet gel. The reaction mixture can include about 10 wt % to about 65 wt % of the hydroxybenzene compound, about 5 wt % to about 25 wt % of the aldehyde compound, up to about 85 wt % of the carboxylic acid, up to about 40 wt % of the anhydride, up to about 40 wt % of the homopolymer, and up to about 40 wt % of the copolymer, where weight percent values are based on the combined weight of the hydroxybenzene compound, the aldehyde compound, and the additive.

Composition of additives comprising a copolymer and a resin
12241031 · 2025-03-04 · ·

The present invention relates to a composition of additives comprising: at least one first compound selected from: (i) copolymers of ethylene and vinyl acetate having a molar mass Mn included in the range ranging from 10,000 to 60,000 g.Math.mol1, optionally grafted by at least one alkyl (meth)acrylate group, the alkyl chain of which is saturated and contains from 12 to 30 carbon atoms; and (ii) polymers comprising at least 90 mol % of units derived from alkyl. (meth)acrylate monomer, the alkyl chain of which is saturated and contains from 18 to 22 carbon atoms; and at least one second compound selected from the modified alkylphenol-aldehyde resins. The invention also relates to the use of this composition of additives for lowering the viscosity of a liquid petroleum product such as a crude oil and for reducing the deposition of paraffins.

Composition of additives comprising a copolymer and a resin
12241031 · 2025-03-04 · ·

The present invention relates to a composition of additives comprising: at least one first compound selected from: (i) copolymers of ethylene and vinyl acetate having a molar mass Mn included in the range ranging from 10,000 to 60,000 g.Math.mol1, optionally grafted by at least one alkyl (meth)acrylate group, the alkyl chain of which is saturated and contains from 12 to 30 carbon atoms; and (ii) polymers comprising at least 90 mol % of units derived from alkyl. (meth)acrylate monomer, the alkyl chain of which is saturated and contains from 18 to 22 carbon atoms; and at least one second compound selected from the modified alkylphenol-aldehyde resins. The invention also relates to the use of this composition of additives for lowering the viscosity of a liquid petroleum product such as a crude oil and for reducing the deposition of paraffins.

Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant

Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether.

Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant

Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether.

Process for stabilizing phenolic resins containing calixarenes

This invention relates to a process for stabilizing a phenolic resin containing a mixture of linear phenolic resins and calixarenes and a demulsifier composition comprising the stabilized phenolic resins prepared from the process. The process comprises contacting the phenolic resin with an alkylene carbonate, in the presence of a base catalyst, to at least partially alkoxylate the phenolic hydroxyl groups of the calixarenes. This process forms a stabilized phenolic resin with an increased solubility in a hydrocarbon solvent.

Process for stabilizing phenolic resins containing calixarenes

This invention relates to a process for stabilizing a phenolic resin containing a mixture of linear phenolic resins and calixarenes and a demulsifier composition comprising the stabilized phenolic resins prepared from the process. The process comprises contacting the phenolic resin with an alkylene carbonate, in the presence of a base catalyst, to at least partially alkoxylate the phenolic hydroxyl groups of the calixarenes. This process forms a stabilized phenolic resin with an increased solubility in a hydrocarbon solvent.

POLYCONDENSATION PRODUCT BASED ON AROMATIC COMPOUNDS, METHOD FOR THE PREPARATION AND USE THEREOF

Proposed is a polycondensation product comprising as monomer components at least one aryl polyoxyalkylene ether, at least one vicinally disubstituted aromatic compound, at least one aldehyde and also optionally further aromatic compounds; processes for preparing same, and also use thereof as dispersant for aqueous suspensions of inorganic binders and as grinding assistant for inorganic binders.

RESIN SOLID ACID AND METHOD FOR PRODUCING SAME

The resin solid acid is a sulfo group-modified resin obtained by introducing sulfo groups into a raw material resin in an uncarbonized state, the yield of the sulfo group-modified resin based on the weight of the uncarbonized raw material resin is 80% or more, the amount of sulfo groups in the sulfo group-modified resin is 1 mmol/g or more, and the raw material resin is in the form of a powder, granules or fibers. In addition, the method for producing the resin solid acid is a production method for obtaining a sulfo group-modified resin by comprising a step for adding a sulfonating agent in the form of any of sulfuric acid, fuming sulfuric acid or chlorosulfonic acid to a raw material resin in an uncarbonized state, and a step for heating the uncarbonized raw material resin at 200 C. or lower.