Patent classifications
C08G59/14
LIQUID COMPRESSION MOLDING MATERIAL
A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.
MULTIFUNCTIONAL SUPERHYDROPHOBIC PARTICLES FOR CHEMICAL ADHESION AND BLOOMING
Provided herein is a multifunctional particle and methods of forming the same. The multifunctional particle includes a surface of the particle; a first moiety coupled to the surface and having at least one substantially hydrophobic appendage; and a second moiety coupled to the surface and having at least one appendage comprising a reactive functional group and a substantially hydrophilic repeating unit, whereby the particle is substantially superhydrophobic as a result of the substantially hydrophobic appendage, chemically reactive as a result of the reactive functional group, and migratory to a surface of a substantially hydrophobic matrix in which the particle may be included as a result of the substantially hydrophilic repeating unit. Additionally, antimicrobial functional groups may be coupled to the surface.
Photocurable composition and method for producing semiconductor device
A photocurable composition for forming coating film having flattening properties on a substrate, with high fillability into patterns and capability of forming a coating film that is free from thermal shrinkage, which contains at least one compound that contains a photodegradable nitrogen-containing and/or sulfur-containing structure, a hydrocarbon structure, and a solvent. A compound which contains at least one photodegradable structure in one molecule. A compound which contains the photodegradable structures, and the hydrocarbon structure in one molecule, or a combination of compounds which contain the structures in separate molecules. The hydrocarbon structure is a saturated or unsaturated, linear, branched or cyclic hydrocarbon group having a carbon atom number of 1 to 40. The nitrogen-containing structure contains a reactive nitrogen-containing functional group or reactive carbon-containing functional group produced by irradiation with ultraviolet light; and the sulfur-containing structure contains an organic sulfur radical or carbon radical produced by irradiation with ultraviolet light.
Photocurable composition and method for producing semiconductor device
A photocurable composition for forming coating film having flattening properties on a substrate, with high fillability into patterns and capability of forming a coating film that is free from thermal shrinkage, which contains at least one compound that contains a photodegradable nitrogen-containing and/or sulfur-containing structure, a hydrocarbon structure, and a solvent. A compound which contains at least one photodegradable structure in one molecule. A compound which contains the photodegradable structures, and the hydrocarbon structure in one molecule, or a combination of compounds which contain the structures in separate molecules. The hydrocarbon structure is a saturated or unsaturated, linear, branched or cyclic hydrocarbon group having a carbon atom number of 1 to 40. The nitrogen-containing structure contains a reactive nitrogen-containing functional group or reactive carbon-containing functional group produced by irradiation with ultraviolet light; and the sulfur-containing structure contains an organic sulfur radical or carbon radical produced by irradiation with ultraviolet light.
SIZING AGENT COATED CARBON FIBER BUNDLE, METHOD FOR MANUFACTURING SAME, PREPREG, AND CARBON FIBER REINFORCED COMPOSITE MATERIAL
Provided are a sizing agent coated carbon fiber bundle that has excellent mechanical characteristics when used as a carbon fiber reinforced composite material, as well as excellent ease of handling; a method for manufacturing the same; and a prepreg and carbon fiber reinforced composite material of excellent mechanical characteristics, employing the fiber bundle. The carbon fiber bundle is coated with a sizing agent that includes a polyether aliphatic epoxy compound having two or more epoxy groups per molecule and/or a polyol aliphatic epoxy compound or a non-water-soluble compound having a glass transition temperature of −100-50° C., wherein the sizing agent coated carbon fiber bundle is characterized in that the flatness ratio (width/thickness) of the carbon fiber bundle cross section is 10-150, and a two edge part/center part sizing agent deposition ratio, obtained by dividing the carbon fiber bundle in the width direction along the fiber direction into three equal parts by mass, and computing the ratio from the ratio of the mass of the sizing agent to the mass of the carbon fiber bundle in the center part and in both end parts, is 1.05-1.5.
Structural adhesive compositions
An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.
Flame retardant with compositions
A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition.
CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING
This invention relates to a conductive epoxy resin composition, in particular for bonding copper substrate, and the cured product, and the use thereof as well as a semiconductor device comprising the cured product.
CURABLE EPOXY RESIN COMPOSITION
An advanced epoxy resin including a reaction product of (A) at least one epoxy resin; (B) at least one cashew nutshell liquid; and (C) at least one multifunctional carboxylic acid; a curable epoxy resin composition prepared using the above advanced epoxy resin; and the use of the above curable epoxy resin composition to prepare a coating.
Methods for making functionalized fluorinated monomers, fluorinated monomers, and compositions for making the same
A method of making a functionalized fluorinated monomer for use in making oligomers and polymers that can be used to improve surface properties of polymer-derived systems, such as coatings. The method of making a functionalized fluorinated monomer includes reacting at least one fluorinated nucleophilic reactant, such as a fluorinated alcohol, with at least one compound containing at least one epoxide group. Other methods include reaction of a fluorinated alcohol with a cyclic carboxylic anhydride. In another embodiment, a method includes reacting a fluorinated mesylate, tosylate or triflate with an amine, alkoxide or phenoxide. In other embodiments, the method includes reacting a fluorinated alcohol with an alkyl halide, or reacting a fluorinated alkyl halide with an amine. The functionalized fluorinated monomers may be used as intermediates and reacted to modify the functional groups thereon. Further, the functionalized fluorinated monomers may be reacted to form polymers or oligomers, or with polymers or oligomers having functional groups to modify the polymer or oligomer through the functional group thereon.