An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is 86% or more of the area of the entire region corresponding to the compression-molded body on the chip.

An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is 86% or more of the area of the entire region corresponding to the compression-molded body on the chip.

The present disclosure is directed to multiphase dispersions and nanaocomposites comprised of continuous matrix or binder and endohedrally impregnated cellular carbon filler. These nanocomposites may exhibit superior mechanical, electrical, thermal, or other properties, and may be used in a variety of products, including hierarchical fiber-reinforced composites with nanocomposite matrices.

The present disclosure is directed to multiphase dispersions and nanaocomposites comprised of continuous matrix or binder and endohedrally impregnated cellular carbon filler. These nanocomposites may exhibit superior mechanical, electrical, thermal, or other properties, and may be used in a variety of products, including hierarchical fiber-reinforced composites with nanocomposite matrices.

Provided are a stereoisomer of an epoxy compound that when contained in a curable composition, can improve the heat resistance and dielectric properties of the cured product of the curable composition, a curable composition containing the stereoisomer, and a cured product of the curable composition. A stereoisomer of an epoxy compound represented by Formula (1) below, the stereoisomer being represented by Formula (2), and a curable composition containing the stereoisomer are used:

##STR00001##

in which in Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and

##STR00002##

in which in Formula (2), R.sup.1 to R.sup.18 are each the same as in Formula (1).

Provided are a stereoisomer of an epoxy compound that when contained in a curable composition, can improve the heat resistance and dielectric properties of the cured product of the curable composition, a curable composition containing the stereoisomer, and a cured product of the curable composition. A stereoisomer of an epoxy compound represented by Formula (1) below, the stereoisomer being represented by Formula (2), and a curable composition containing the stereoisomer are used:

##STR00001##

in which in Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and

##STR00002##

in which in Formula (2), R.sup.1 to R.sup.18 are each the same as in Formula (1).

The invention relates to a comb polymer having repeating units of at least one of the structures of formulae (I) to (IV) wherein R.sup.1 represents a polyoxyalkylene group and A represents an organic group, and wherein the comb polymer has end groups of the general formula (V) wherein R.sup.2 and R.sup.3 independent of each other are selected from a) organic groups having 1 to 24 carbon atoms and b) R.sup.1.

##STR00001##

Provided are a prepreg in which reinforcing fibers are impregnated with an epoxy resin composition containing an epoxy resin (A) and an epoxy resin curing agent (B) containing a reaction product (X) of a component (x1) and a component (x2) described below, a fiber-reinforced composite material that is a cured product of the prepreg, a method for producing the prepreg, and a method for producing a high-pressure gas storage tank.

(x1) At least one selected from the group consisting of meta-xylylenediamine and para-xylylenediamine

(x2) At least one selected from the group consisting of unsaturated carboxylic acids represented by General Formula (1) below and derivatives thereof.

##STR00001##

(In Formula (1), R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 13 carbons.)

A nanocomposite, comprising a carbonaceous perimorph, the perimorph comprising at least one cell. The cell comprises a cell wall possessing an average thickness of less than 100 nm and a morphology evolved from a template. The composite comprises an interior space having a morphology evolved from the template with a diameter between 10 nm and 1,000 nm, and one of a linear structure, a non-linear structure, and an infiltrated endomorph. The endomorph substantially fills the interior space of the perimorph.

A nanocomposite, comprising a carbonaceous perimorph, the perimorph comprising at least one cell. The cell comprises a cell wall possessing an average thickness of less than 100 nm and a morphology evolved from a template. The composite comprises an interior space having a morphology evolved from the template with a diameter between 10 nm and 1,000 nm, and one of a linear structure, a non-linear structure, and an infiltrated endomorph. The endomorph substantially fills the interior space of the perimorph.