Controlled release polyurea microcapsules can be prepared from a combination of polyisocyanates using emulsion polymerization. Encapsulated catalysts prepared using the polyurea microcapsules can be used to control the cure rate of coatings and sealants.

Sulfur-containing polymeric particles having a high sulfur content can be prepared using emulsion polymerization. The sulfur-containing polymeric particles are useful in aerospace coatings and sealants.

Sulfur-containing polymeric particles having a high sulfur content can be prepared using emulsion polymerization. The sulfur-containing polymeric particles are useful in aerospace coatings and sealants.

Described is a thiol-ene composition that includes a resinous mixture of at least a first monomer and at least a second monomer, in which the first monomer is a polyfunctional allyl monomer and the second monomer is a polyfunctional thiol and the molar ratio of the first monomer to the second monomer is about 60:40 to about 80:20. Said composition further includes conductive colloidal particles in an amount between about 4 wt % and about 7 wt % of the total composition. When cured, a formed composition offers self-healing properties and resistance to abrasions and scratches that exceed the levels found in comparative thiol-enes that either lack the addition of the conductive colloidal particles and/or have a less effective ratio of first monomer to second monomer.

Described is a thiol-ene composition that includes a resinous mixture of at least a first monomer and at least a second monomer, in which the first monomer is a polyfunctional allyl monomer and the second monomer is a polyfunctional thiol and the molar ratio of the first monomer to the second monomer is about 60:40 to about 80:20. Said composition further includes conductive colloidal particles in an amount between about 4 wt % and about 7 wt % of the total composition. When cured, a formed composition offers self-healing properties and resistance to abrasions and scratches that exceed the levels found in comparative thiol-enes that either lack the addition of the conductive colloidal particles and/or have a less effective ratio of first monomer to second monomer.

A resin composition capable of forming a cured film having a high refractive index, high transparency and high heat resistance, and a polymer which is used for the resin composition. A polymer having a structural unit of Formula (1): ##STR00001##
wherein A.sub.1 and A.sub.2 are each independently an O group or a C(O)O group; X is a divalent organic group having at least one aromatic ring or heterocyclic ring, wherein, when the X has two or more aromatic rings or heterocyclic rings, the rings are optionally bonded to each other via a single bond, are optionally bonded to each other via a heteroatom, or optionally form a condensed ring; and Y is a divalent organic group having at least one aromatic ring or condensed ring. A resin composition, includes: the polymer; a cross-linking agent; and a solvent.

A resin composition capable of forming a cured film having a high refractive index, high transparency and high heat resistance, and a polymer which is used for the resin composition. A polymer having a structural unit of Formula (1): ##STR00001##
wherein A.sub.1 and A.sub.2 are each independently an O group or a C(O)O group; X is a divalent organic group having at least one aromatic ring or heterocyclic ring, wherein, when the X has two or more aromatic rings or heterocyclic rings, the rings are optionally bonded to each other via a single bond, are optionally bonded to each other via a heteroatom, or optionally form a condensed ring; and Y is a divalent organic group having at least one aromatic ring or condensed ring. A resin composition, includes: the polymer; a cross-linking agent; and a solvent.

Provided is a sealant sheet formed as a sheet. The sealant sheet comprises an epoxy group-containing polysulfide. The epoxy group-containing polysulfide has a disulfide structure and an epoxy group in its molecule.

Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH.sub.2OR.sup.1) (CH.sub.2OR.sup.2) (CH.sub.2OR.sup.3) (CH.sub.2OR.sup.4) (wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently hydrogen or C.sub.nH.sub.2nSH (wherein n is 2 to 6), at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is C.sub.nH.sub.2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

Controlled release polyurea microcapsules can be prepared from a combination of polyisocyanates using emulsion polymerization. Encapsulated catalysts prepared using the polyurea microcapsules can be used to control the cure rate of coatings and sealants.