A method of storing gas comprises providing a recipient for receiving the gas and providing a porous gas storage material. The gas storage material comprises a cross-linked polymeric framework and a plurality of pores for gas sorption. The cross-linked polymeric framework comprises aromatic ring-containing monomeric units comprising at least two aromatic rings. The aromatic ring-containing monomeric units are linked by covalent cross-linking between aromatic rings to form a stable, rigid nanoporous material for storing the gas at pressures significantly greater than the atmospheric pressure, for example in excess of 100 bar. A possible application is the storage and transportation of compressed natural gas.

The object of the present invention is to attain both water/oil repellency and hardness. The transparent film of the present invention comprises: a polysiloxane backbone; and a first hydrocarbon chain-containing group bonded to a part of silicon atoms forcing the polysiloxane backbone, wherein the thickness of the transparent film is not less than 6 nm and not more than 50 nm.

The object of the present invention is to attain water repellency as well as the heat resistance and the light resistance. the transparent film of the present invention comprises: a polysiloxane backbone; and a trialkylsilyl containing molecular chain bonded to a part of silicon atoms forming the polysiloxane backbone, wherein alkyl groups in the trialkylsilyl containing molecular chain may be replaced by fluoroalkyl groups, and the transparent film satisfies at least one of the relationships of:

(B.sub.H−A.sub.0)/A.sub.0×100(%)≧−27(%); and

(B.sub.L−A.sub.0)/A.sub.0×100(%)≧−15(%), provided that A.sub.0 is an initial contact angle of a liquid droplet on the transparent film, B.sub.H is a contact angle of a liquid droplet on the transparent film incubated at 200° C. for 24 hours, and B.sub.L is a contact angle of a liquid droplet on the transparent film irradiated by a xenon lamp with an intensity of 250 W for 100 hours.

The object of the present invention is to attain water repellency as well as the heat resistance and the light resistance. the transparent film of the present invention comprises: a polysiloxane backbone; and a trialkylsilyl containing molecular chain bonded to a part of silicon atoms forming the polysiloxane backbone, wherein alkyl groups in the trialkylsilyl containing molecular chain may be replaced by fluoroalkyl groups, and the transparent film satisfies at least one of the relationships of:

(B.sub.H−A.sub.0)/A.sub.0×100(%)≧−27(%); and

(B.sub.L−A.sub.0)/A.sub.0×100(%)≧−15(%), provided that A.sub.0 is an initial contact angle of a liquid droplet on the transparent film, B.sub.H is a contact angle of a liquid droplet on the transparent film incubated at 200° C. for 24 hours, and B.sub.L is a contact angle of a liquid droplet on the transparent film irradiated by a xenon lamp with an intensity of 250 W for 100 hours.

A process for preparing spherical silicone resin particles in which alkoxysilanes are reacted with water to form a hydrolysate is provided. The resulting silicone resin particles are isolated from a mixture. The silicone resin particles are dried and the particles are deagglomerated by ultrasonic sieving.

A composition, in particular a cosmetic composition, for making up and/or caring for keratin materials, including at least one aqueous phase gelled with at least one non-starchy hydrophilic gelling agent; at least one oily phase gelled with at least one non-cellulose-based lipophilic gelling agent other than apolar hydrocarbon-based waxes with a melting point of greater than 75.0° C. and silicone polyamides; the phases forming therein a macroscopically homogeneous mixture; the composition also including at least one UV-screening agent.

A composition, in particular a cosmetic composition, for making up and/or caring for keratin materials, including at least one aqueous phase gelled with at least one non-starchy hydrophilic gelling agent; at least one oily phase gelled with at least one non-cellulose-based lipophilic gelling agent other than apolar hydrocarbon-based waxes with a melting point of greater than 75.0° C. and silicone polyamides; the phases forming therein a macroscopically homogeneous mixture; the composition also including at least one UV-screening agent.

Epoxy silane oligomers are prepared from a glycidoxypropyl alkoxysilane in the presence of an alcohol and an esterification and/or transesterification catalyst, and have improved storage stability. The oligomers are particularly useful as scrub-resistant additives for aqueous architectural coatings.

Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an —Si—O—Si— backbone. The organosiloxane block copolymer comprises at least two blocks that are phase-separated. The organosiloxane block copolymer has at least a first glass transition temperature (Tg.sup.1) and a second glass transition temperature (Tg.sup.2), the second glass transition temperature being at 25° C. or higher. A 1 mm thick cast film of the adhesive composition has, in some embodiments, a light transmittance of at least 95%. The adhesive composition of the various embodiments of the present invention can be B-staged at about Tg.sup.2 or at about 100° C. below Tg.sup.2.

Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an —Si—O—Si— backbone. The organosiloxane block copolymer comprises at least two blocks that are phase-separated. The organosiloxane block copolymer has at least a first glass transition temperature (Tg.sup.1) and a second glass transition temperature (Tg.sup.2), the second glass transition temperature being at 25° C. or higher. A 1 mm thick cast film of the adhesive composition has, in some embodiments, a light transmittance of at least 95%. The adhesive composition of the various embodiments of the present invention can be B-staged at about Tg.sup.2 or at about 100° C. below Tg.sup.2.