A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

A networked silicone is disclosed. The networked silicone comprises crosslinked strands of looped organosilicon compounds. A composition for preparing the networked silicone is also disclosed, and comprises (A) a looped organosilicon compound, (B) a crosslinking organosilicon compound, and optionally (C) a catalyst. Additionally, a method of preparing the networked silicone is disclosed, and comprises reacting the looped organosilicon compound (A) and the crosslinking organosilicon compound (B), optionally in the presence of the catalyst (C), to give the networked silicone. A reaction product comprising the networked silicone is also disclosed. The reaction product is prepared from the composition and/or in accordance with the method, and may be a cured product. Additionally, a composite article and a method of forming the same are disclosed. The composite article is formed by disposing a networked silicone composition on the substrate and curing the networked silicone composition, thereby preparing the composite article.

According to the present invention, a siliceous film forming composition, which is capable of filling trenches having narrow widths and high aspect ratios and forming a thick film, can be provided. A siliceous film forming composition comprising: (a) a block copolymer comprising a linear and/or cyclic block A having a polysilane skeleton comprising 5 or more silicon and a block B having a polysilazane skeleton comprising 20 or more silicon, and (b) a solvent.

The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R.sup.aSiO.sub.3/2] (I) and constituent units represented by formula (II) [R.sup.aSiO.sub.2/2(OR.sup.b)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R.sup.aSiO.sub.3/2] (I) and constituent units represented by formula (II) [R.sup.aSiO.sub.2/2(OR.sup.b)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

The present invention relates a hydroxyl-functionalized unimodal polysiloxane polyalkyleneglycol brush copolymer of the structure [A(-X—B)].sub.s, wherein: A represents said polysiloxane backbone; B represents said polyalkyleneglycol side chain; X is a linker group characterized by including the moiety Si—C—C— of which said Si is a part of the polysiloxane backbone A; and s is an integer of from 1 to 100, wherein the polysiloxane backbone A contains less than 500 ppm mol % of SiH moiety based on the total moles of the silicon atom which constitutes the polysiloxane backbone, and said copolymer has a polydispersity index of from 1.3 to 5.0; and a method for producing said hydroxyl-functionalized unimodal polysiloxane polyalkyleneglycol brush copolymer.

Photocurable poly(siloxane) formulations for making stereolithographic 3D-printed PDMS structures, stereolithographic 3D-printing methods for making PDMS structures, and stereolithographic 3D-printed PDMS structures. ##STR00001##

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows:

##STR00001## Wherein x=70-80, y=10-20.

The structural formula of the phenolic-modified silicone rubber resin is shown as follows:

##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows:

##STR00001## Wherein x=70-80, y=10-20.

The structural formula of the phenolic-modified silicone rubber resin is shown as follows:

##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

A cross-linked composition is disclosed. In various embodiments, the cross-linked composition comprises the reaction product of: a first siloxane having at least one pendant polycyclic anhydride group; a second siloxane having at least one pendant polycyclic anhydride group; and a polyol having at least two hydroxyl groups reactive with the pendant polycyclic anhydride groups of the first and second siloxanes. A personal care composition is also provided. The personal care composition comprises a cross-linked composition having at least two carboxyl groups. In various embodiments, the cross-linked composition is as described above. The personal care composition further comprises a least one cosmetic component; optionally in a cosmetically acceptable medium. Methods of forming the cross-linked composition and the personal care composition are also disclosed. A polycyclic anhydride composition and polyorganosiloxane composition are also disclosed.