An amphiphilic polymer, an amphiphilic polymer manufacturing method, a contact lens material including the amphiphilic polymer, and contact lens manufacturing method are provided. The amphiphilic polymer includes poly(dimethylsiloxane) and amphiphilic chitosan bonded to the same. The contact lens material includes the amphiphilic polymer. The amphiphilic polymer manufacturing method includes providing a poly(dimethylsiloxane), providing an amphiphilic chitosan, and bonding the amphiphilic chitosan to the poly(dimethylsiloxane).

The notched Izod impact toughness and tensile elongation of poly(lactic acid) (PLA)-homopolymers are increased by about 2 to about 4 times by blending therewith a PLA-copolymer having a difunctional flexible middle segment such as a polysiloxane or a polyether from about 0.6 wt. % to about 20 wt. %. The PLA-homopolymer-PLA-copolymer blend having a difunctional flexible polymer from about 0.5 wt. % to about 10 wt. % is thermally annealed to provide impact toughness of at least about 5 kJ/m.sup.2 and tensile elongation of greater than 12%. This exceptional improvement observed in the PLA blend is a synergistic effect of the addition of the difunctional flexible polymer of the copolymer and thermal annealing. The improvement observed in the mechanical properties with high PLA homopolymer content above about 90 to about 98 wt. % is unusual and results in an increased scope of molding and thermoforming applications. The annealed PLA-copolymers having a difunctional flexible middle segment have also been found to have improved notched Izod impact properties.

According to various embodiments, a microcellular foam is provided, wherein the microcellular foam comprises a polymer blend, the polymer blend comprising: from 70 to 95% by weight low density polyethylene (LDPE); and from 5 to 30% by weight of polydimethylsiloxane grafted LDPE (PDMS-g-LDPE), wherein the microcellular foam has an average cell size of less than 60 μm.

According to various embodiments, a microcellular foam is provided, wherein the microcellular foam comprises a polymer blend, the polymer blend comprising: from 70 to 95% by weight low density polyethylene (LDPE); and from 5 to 30% by weight of polydimethylsiloxane grafted LDPE (PDMS-g-LDPE), wherein the microcellular foam has an average cell size of less than 60 μm.

Disclosed are a fluorine-silicon-containing polyphosphate ester and method for preparation thereof, having a chemical structural formula of: ##STR00001##
wherein R.sub.1 is ##STR00002##
R.sub.2 is ##STR00003##
n=10˜100. The fluorine-silicon-containing polyphosphate ester of the present invention uses silicon phosphorus and fluorine for improving flame retardancy. Phosphorus catalyzes the system to form a phosphorus-rich carbon layer, performing a protective-layer function and thereby preventing further breakdown of the epoxy resin. The silicon-containing epoxy resin forms a silica-containing carbon layer during the process of combustion, strengthening the carbon-layer structure and further improving the protective function of the carbon-layer. The introduction of elemental fluorine improves the thermal stability of the epoxy resin, thereby improving the flame retardancy performance of the system.

Disclosed are a fluorine-silicon-containing polyphosphate ester and method for preparation thereof, having a chemical structural formula of: ##STR00001##
wherein R.sub.1 is ##STR00002##
R.sub.2 is ##STR00003##
n=10˜100. The fluorine-silicon-containing polyphosphate ester of the present invention uses silicon phosphorus and fluorine for improving flame retardancy. Phosphorus catalyzes the system to form a phosphorus-rich carbon layer, performing a protective-layer function and thereby preventing further breakdown of the epoxy resin. The silicon-containing epoxy resin forms a silica-containing carbon layer during the process of combustion, strengthening the carbon-layer structure and further improving the protective function of the carbon-layer. The introduction of elemental fluorine improves the thermal stability of the epoxy resin, thereby improving the flame retardancy performance of the system.

A polymer comprising polysiloxane, silphenylene, isocyanuric acid, and norbornene skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency, light resistance, and heat resistance.

The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R.sup.aSiO.sub.3/2] (I) and constituent units represented by formula (II) [R.sup.aSiO.sub.2/2(OR.sup.b)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R.sup.aSiO.sub.3/2] (I) and constituent units represented by formula (II) [R.sup.aSiO.sub.2/2(OR.sup.b)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

A plasma polymerized thin film having low dielectric constant prepared by depositing a first precursor material represented by the following Chemical Formula 1: ##STR00001## wherein in the above Chemical Formula 1, R.sub.1 to R.sub.14 are each independently H or a substituted or non-substituted C.sub.1-C.sub.5 alkyl group, and when the R.sub.1 to R.sub.14 are substituted, their substituents comprise an amino group, a hydroxyl group, a cyano group, a halogen group, a nitro group, or a methoxy group.