A plasma polymerized thin film having low dielectric constant prepared by depositing a first precursor material represented by the following Chemical Formula 1: ##STR00001## wherein in the above Chemical Formula 1, R.sub.1 to R.sub.14 are each independently H or a substituted or non-substituted C.sub.1-C.sub.5 alkyl group, and when the R.sub.1 to R.sub.14 are substituted, their substituents comprise an amino group, a hydroxyl group, a cyano group, a halogen group, a nitro group, or a methoxy group.

A sealing composite includes a molecular formula as follows: ##STR00001##

The invention relates to the use of a polymer for improving the clean-ability of a surface coating or for reducing the dirt pick up of a surface coating, wherein the polymer is a a non-crosslinked polymer having a polymer main chain comprising i) polysiloxane segments comprising repeating units of the formula (I) wherein R 1 independent of each occurrence represents a hydrocarbyl group and n is an integer in the range of 6 to 150, and ii) non-polysiloxane segments having at least one functional group comprising at least one of hydroxyl group, acryloyl group, methacryloyl group, acetyl group, urethane group, and methyl ether group, wherein the number of links between non-polysiloxane segments and polysiloxane segments in the polymer is less than 9.5%, calculated on the average number of silicon atoms per polysiloxane segment, and wherein at least one non-polysiloxane segment is located between two polysiloxane segments.

##STR00001##

The instant application relates to a polysiloxane-based coating composition, comprising: Polysiloxane of formula I wherein each R.sub.1 is independently a hydroxyl group or an alkyl, aryl or alkoxy group having up to 6 carbon atoms, each R.sub.2 independently is hydrogen or alkyl or aryl group having up to 6 carbon atoms, and n is selected so that the molecular weight for the polysiloxane is 400 to 10000; a non-aromatic epoxide resin having more than one 1, 2-epoxide group per molecule with an epoxide equivalent weight of 100 to 5000; a multi-functional (meth) acrylate monomer; and a cure system comprising at least one alkoxy functional aminosilane. Furthermore, it also relates to a method of coating surface using said coating composition and the substrate coated therewith.

##STR00001##

Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R.sup.1SiO.sub.3/2 (wherein R.sup.1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO.sub.4/2; and a linear structure (A2) block represented by (R.sub.2SiO.sub.2/2).sub.n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an SiOSi bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO.sub.3/2 unit.

A silsesquioxane compound represented by the following formula (I): (R.sup.aSiO.sub.1.5).sub.n, wherein R.sup.a is, each independently at each occurrence, R.sup.b or R.sup.c; provided that at least one R.sup.a is R.sup.b; R.sup.b is R.sup.1CF.sub.2R.sup.2R.sup.3; R.sup.1 is a divalent group; R.sup.2 is a divalent polymer chain; R.sup.3 is a halogen atom or a hydrogen atom; R.sup.c is a hydrogen atom, an alkyl group, a phenyl group, or (OSiR.sup.15.sub.2).sub.jR.sup.15; R.sup.15 is, each independently at each occurrence, a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; j is, each independently at each occurrence, an integer of 1 to 3; and n is an arbitrary integer.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.

A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R.sup.1SiO.sub.3/2 (where R.sup.1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO.sub.4/2 and a linear structure (A2) block represented by (R.sub.2SiO.sub.2/2).sub.n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a SiOSi bond and has an R.sup.1SiO.sub.3/2 unit.

A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component includes (I) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure.