A catalyst system comprising a combination of: 1) an activator; 2) one or more metallocene catalyst compounds; 3) a support comprising an organosilica material, which is a mesoporous organosilica material. The organosilica material is a polymer of at least one monomer of Formula [Z.sup.1OZ.sup.2 SiCh.sub.2].sub.3(i), where Z.sup.1 represents a hydrogen atom, a C1-C4 alkyl group, or a bond to a silic-on atom of another monomer and Z.sup.2 represents a hydroxyl group, a C.sub.1-C.sub.4alkoxy group, a C.sub.1-C.sub.6 salkyl group, or an oxygen atom bonded to a silicon atom of another monomer. This invention further relates to processes to polymerize olefins comprising contacting one or more olefins with the above catalyst system.

A catalyst system comprising a combination of: 1) an activator; 2) one or more metallocene catalyst compounds; 3) a support comprising an organosilica material, which is a mesoporous organosilica material. The organosilica material is a polymer of at least one monomer of Formula [Z.sup.1OZ.sup.2 SiCh.sub.2].sub.3(i), where Z.sup.1 represents a hydrogen atom, a C1-C4 alkyl group, or a bond to a silic-on atom of another monomer and Z.sup.2 represents a hydroxyl group, a C.sub.1-C.sub.4alkoxy group, a C.sub.1-C.sub.6 salkyl group, or an oxygen atom bonded to a silicon atom of another monomer. This invention further relates to processes to polymerize olefins comprising contacting one or more olefins with the above catalyst system.

A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.

A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.

A method of producing a silicon hydride oxide-containing organic solvent (coating solution) is provided with which a silicon hydride oxide coating film can be formed on a substrate. Using the silicon hydride oxide-containing organic solvent makes it unnecessary to place a coating solution in non-oxidizing atmosphere at the time of coating or to heat the substrate after coating because the silicon hydride oxide is formed in the coating solution before it is coated. The method includes blowing an oxygen-containing gas through an organic solvent containing a silicon hydride or a polymer thereof. The silicon hydride oxide may contain a proportion of (residual Si—H groups)/(Si—H groups before oxidation) of 1 to 40 mol %. The silicon hydride can be obtained by reacting a cyclic silane with a hydrogen halide in the presence of an aluminum halide, and reducing the obtained cyclic halosilane.

A polymerization inhibitor for a silane enables purification of the silane to a high degree because a polymer is not formed even when heating to distill the silane, even when a cyclic silane monomer is present. A high-purity cyclic silane composition is obtained, in particular high-purity cyclopentasilane, that can be polymerized and applied onto a substrate as a coating-type polysilane composition and fired to produce a good silicon thin film with high conductivity. The polymerization inhibitor includes a secondary or tertiary aromatic amine. The aromatic group is a phenyl group or a naphthyl group. The polymerization inhibitor is present in a proportion of 0.01 to 10 mol % per mole of the silane. In the polymerization inhibitor, a boiling point of the aromatic amine is 196° C. or higher.

A photovoltaic module comprising: (a) a photovoltaic laminate including: two or more electrically conducting dements extending through the photovoltaic laminate so that power is moved from one photovoltaic module towards another photovoltaic module or towards an inverter; and (b) one or more connectors connected to each of the two or more electrically conducting elements by a connection joint, each of the one or more connectors include: two or more opposing terminals that each are connected to and extend from one of the two or more electrically conducing elements; wherein a dielectric space is located between the two or more opposing terminals and the dielectric space blocks material used to form a connection joint from passing from a first terminal to a second terminal, the material from the connection joint cools before the material passes from one terminal to a second terminal, the material fails to travel from the first terminal to the second terminal, or a combination thereof.

A catalyst system comprising a combination of: 1) one or more catalyst compounds comprising at least one oxygen linkage, such as a phenoxide transition metal compound; 2) a support comprising an organosilica material, which may be a mesoporous organosilica material; and 3) an optional activator. Useful catalysts include biphenyl phenol catalysts (BPP). The organosilica material may be a polymer of at least one monomer of Formula [Z.sup.1OZ.sup.2SiCH.sub.2].sub.3 (I), where Z.sup.1 represents a hydrogen atom, a C.sub.1-C.sub.4 alkyl group, or a bond to a silicon atom of another monomer and Z.sup.2 represents a hydroxyl group, a C.sub.1-C.sub.4 alkoxy group, a C.sub.1-C.sub.6 alkyl group, or an oxygen atom bonded to a silicon atom of another monomer. This invention further relates to processes to polymerize olefins comprising contacting one or more olefins with the above catalyst system.

A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##

A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##