C08G77/70

POLYORGANOSILOXANE, POLYORGANOSILOXANE COMPOSITION, CURED PRODUCT, POLYORGANOSILOXANE-CONTAINING ELECTROLYTIC SOLUTION FOR ELECTROLYTIC CAPACITOR, AND ELECTROLYTIC CAPACITOR USING SAME

A polyorganosiloxane may be high in elasticity and/or strength. The polyorganosiloxane may include an M unit (R.sup.1R.sup.2R.sup.3SiO.sub.1/2) at a content of 10 mol. % or more relative to the total of silicon and a T unit (R.sup.6SiO.sub.3/2) at a content of 80 mol. % or less relative to the total of silicon. The polyorganosiloxane may have an alkoxy group bound, at a content of 0.07 to 4 wt. %, based on total polyorganosiloxane weight, and a reactive functional group bound to silicon, with 3 to 12 of the reactive functional groups bound on a number basis per a molecular weight of 1000 of the polyorganosiloxane. The weight loss of the polyorganosiloxane at 110° C. under 0.15 torr for 2 hours may be 5 wt. % or less.

Silicone polymer

Provided is a silicone polymer of the Formula (I):
M.sup.1.sub.aM.sup.2.sub.bM.sup.3.sub.cD.sup.1.sub.dD.sup.2.sub.eD.sup.3.sub.fT.sup.1.sub.gT.sup.2.sub.hT.sup.3.sub.iQ.sub.j. wherein: M.sup.1=R.sup.1R.sup.2R.sup.3SiO.sub.1/2 M.sup.2=R.sup.4R.sup.5R.sup.6SiO.sub.1/2 M.sup.3=R.sup.7R.sup.8R.sup.9SiO.sub.1/2 D.sup.1=R.sup.10R.sup.11SiO.sub.2/2 D.sup.2=R.sup.12R.sup.13SiO.sub.2/2 D.sup.3=R.sup.14R.sup.15SiO.sub.2/2 T.sup.1=R.sup.16SiO.sub.3/2 T.sup.2=R.sup.17SiO.sub.3/2 T.sup.3=R.sup.18SiO.sub.3/2 Q=SiO.sub.4/2 where R.sup.1, R.sup.2, R.sup.3, R.sup.5, R.sup.6, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.13, R.sup.15, R.sup.16 are independently chosen from a hydrogen, a C.sub.1-C.sub.60 aliphatic or aromatic group or C.sub.1-C.sub.60 alkoxy group; R.sup.4, R.sup.12, R.sup.17 are independently chosen from a C1-C60 alkyl, a C1-C60 alkoxy, or R.sup.19-A-R.sup.20— where A is chosen from a group comprising an unsaturated cyclic moiety chosen from an aromatic group, a fused aromatic group, an unsaturated alicyclic group, an unsaturated heterocyclic group, or a combination of two or more thereof; R.sup.19 is chosen from a —H, a C1-C60 alkyl, allyl, vinyl, alkoxy, allyloxy, vinyloxy, acrylate, or methacrylate; and R.sup.20 is chosen from a divalent organic group; R.sup.7, R.sup.14, R.sup.18 are independently selected from hydrogen or OR.sup.22 or unsaturated monovalent radicals or radicals containing heteroatom such as oxygen, nitrogen, sulfur or radicals containing organosilane groups; and
the subscripts a, b, c, d, e, f, g, h, i, j are zero or positive subject to the following limitations: 2≤a+b+c+d+e+f+g+h+i+j≤1000, b+e+h>0 and c+f+i≥0.

CURABLE SILICONE COMPOSITION WITH A GOOD FLAME RESISTANCE
20220119677 · 2022-04-21 ·

The invention relates to a curable silicone composition comprising (A) a polyorganosiloxane polymer, (B) a cross-linking organosilicon compound having at least 2 silicon-bonded reactive groups, (C) a catalyst capable of promoting the reaction between component (A) and component (B); and (D) from 0.001 to 20%, preferably from 0.01 to 16%, more preferably from 0.05 to 12% of a bentonite, based on the total weight of the other components in the composition; wherein the bentonite is treated with a treatment agent containing at least a quaternary ammonium salt. Furthermore, it is also related to a method of improving the flame resistance of a curable silicone composition as well as a product obtained therefrom.

TONER, EXTERNAL ADDITIVE FOR TONER, AND FINE PARTICLE

A toner including: a toner particle containing a binder resin and a colorant; and a fine particle on a surface of the toner particle, wherein the fine particle is a solid and substantially hemispherical shape, and has a substantially flat surface and a curved surface, and wherein a number-average value of a longest diameter “w” of the substantially flat surface is 10 to 400 nm. An external additive for a toner that is a solid and substantially hemispherical shape, and has a substantially flat surface and a curved surface, wherein a number-average value of a longest diameter “w” of the substantially flat surface is 10 to 400 nm. A fine particle that is a solid and substantially hemispherical shape, and has a substantially flat surface and a curved surface, wherein a number-average value of a longest diameter “w” of the substantially flat surface is 10 to 400 nm.

METHODS FOR MAKING POLYFUNCTIONAL ORGANOSILOXANES AND COMPOSITIONS CONTAINING SAME
20220025125 · 2022-01-27 ·

A polyfunctional organohydrogensiloxane is prepared using a boron containing Lewis acid as catalyst. The polyfunctional organohydrogensiloxane may be formulated into release coating compositions. Alternatively, the polyfunctional organohydrogensiloxane may be further functionalized with a curable group to form a clustered functional organosiloxane. The clustered functional organosiloxane may be formulated into thermal radical cure adhesive compositions.

CURABLE SILICONE COMPOSITION, AND LIGHT DIFFUSION MATERIAL FORMED THEREBY
20220025179 · 2022-01-27 ·

A curable silicone composition for forming a light diffusion material is disclosed. The curable silicone composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule and free of a fluoro-containing organic group; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of a fluoro-containing organic group; (C) an organopolysiloxane having at least one fluoro-containing organic group per molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition can be cured to form a light diffusion material exhibiting good to excellent transparency and diffusion properties.

ADHESIVE AGENT COMPOSITION, LAYERED PRODUCT AND PRODUCTION METHOD FOR LAYERED PRODUCT, AND METHOD FOR REDUCING THICKNESS OF SEMICONDUCTOR FORMING SUBSTRATE

An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO.sub.2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO.sub.2 (unit Q′) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO.sub.2 (unit Q″) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater.

Thermally Conductive Silicone Potting Composition
20220025181 · 2022-01-27 ·

The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm. The present invention also provides a thermal potting adhesive containing the thermally conductive silicone potting composition, a use of the thermally conductive silicone potting composition in an electronic component, and an electronic component, which is potted using the thermally conductive silicone potting composition.

WEATHER-RESISTANT HARD COAT COMPOSITION FOR GLASS-SUBSTITUTE SUBSTRATE, CURED PRODUCT, AND LAMINATE

The purpose of the present invention is to provide a weather-resistant hard coat composition for a glass-substitute substrate capable of efficiently forming a coating film excelling in weather resistance, scratch resistance, and toughness. The present invention provides: a weather-resistant hard coat composition for a glass-substitute substrate, the composition containing a polyorganosilsesquioxane having a constituent unit represented by Formula (1); a cured product thereof; and a laminate having a glass-substitute substrate and a coating film formed on at least one surface of the glass-substitute substrate. The coating film is a layer of a cured product of the weather-resistant hard coat composition for a glass-substitute substrate. [In formula (1), R.sup.1 represents a group containing an active energy ray-curable functional group.]

WEATHER-RESISTANT HARD COAT COMPOSITION FOR METAL, CURED PRODUCT, AND COATED METAL SUBSTRATE

The purpose of the present invention is to provide a weather-resistant hard coat composition for a metal, the composition being capable of efficiently forming a coating film excelling in weather resistance, scratch resistance, and flexibility. The present invention provides: a weather-resistant hard coat composition for a metal, the composition containing a polyorganosilsesquioxane having a constituent unit represented by Formula (1); a cured product thereof; and a coated metal substrate having a metal substrate and a coating film formed on at least one surface of the metal substrate. The coating film is a layer of a cured product of the weather-resistant hard coat composition for a metal. [In Formula (1), R.sup.1 represents a group containing an active energy ray-curable functional group.]


[R.sup.1SiO.sub.3/2]  (1)