An adhesive composition for use in debonding with infrared radiation, which composition can achieve debonding through irradiation with an infrared ray, the composition including a component (A) which is cured through hydrosilylation and a component (B) which is at least one species selected from the group consisting of a component containing an epoxy-modified polyorganosiloxane, a component containing a methyl group-containing polyorganosiloxane, and a component containing a phenyl group-containing polyorganosiloxane.

This composition does not contain a non-crosslinkable organopolysiloxane resin but contains: (A) an organopolysiloxane having, per molecule, two groups each represented by formula (1)

##STR00001##

(R.sup.1 represents a C.sub.1-20 monovalent hydrocarbon group, R.sup.2 represents an oxygen atom or the like, R.sup.3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3); (B) a monofunctional(meth)acrylate compound not including a siloxane structure; (C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2)

##STR00002##

(R.sup.1, R.sup.2, R.sup.3, a, and p are identical to those described above), a R.sup.4.sub.3SiO.sub.1/2 unit (b) (in the formula, R.sup.4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO.sub.4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and (D) a photoinitiator.

Said composition provides a cured product having excellent elastic modulus and adhesiveness when used as a temporary fixing material.

This organic group-modified organosilicon resin is represented by the average composition formula (1).
(R.sup.1.sub.3SiO.sub.1/2).sub.a(R.sup.2.sub.3SiO.sub.1/2).sub.b(R.sup.3.sub.3SiO.sub.1/2).sub.c(R.sup.1.sub.2SiO.sub.2/2).sub.d(R.sup.1SiO.sub.3/2).sub.e(SiO.sub.4/2).sub.f  (1)
[a, b, c, d, e and f are numbers that satisfy 0≤a≤400, 0<b≤200, 0≤c≤400, 0≤d≤320, 0≤e≤320, 0<f≤1,000, and 0.5≤(a+b+c)/f≤1.5.] Because this organic group-modified organosilicon resin can form films softer than those formed with trimethylene siloxysilicate, the cosmetic obtained by blending with said silicon resin feels good when used, has good cosmetic holding properties, spreads easily and has an excellent finish, easy removal, and superior scratch resistance.

A color conversion panel includes a substrate, a low refractive layer disposed on one surface of the substrate and including a carbosilane-siloxane copolymer, a color conversion layer disposed on the low refractive layer and including a color conversion member and a planarization layer covering the low refractive layer and the color conversion layer, wherein the low refractive layer has a refractive index of less than or equal to 1.30 in a wavelength of 500 nm to 550 nm, and the color conversion member includes a quantum dot, and a manufacturing method thereof is provided.

A polyfunctional organohydrogensiloxane is prepared using a boron containing Lewis acid as catalyst. The polyfunctional organohydrogensiloxane may be formulated into release coating compositions. Alternatively, the polyfunctional organohydrogensiloxane may be further functionalized with a curable group to form a clustered functional organosiloxane. The clustered functional organosiloxane may be formulated into thermal radical cure adhesive compositions.

Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

Provided is a composition having antimicrobial, biocidal properties, in particular antiviral properties, for surface coatings of paper layers or material panels. The composition includes at least one formaldehyde resin, in particular a melamine-formaldehyde resin, at least one compound of general formula (I) R.sup.1SiX.sub.3 (I), where X is alkoxy, and R.sup.1 is an organic moiety selected from the group comprising C1-C10 alkyl, which may be interrupted by —O— or —NH—, and where R.sup.1 has at least one functional moiety Q.sub.1 selected from a group including an amino, methacrylic, methacryloxy, vinyl and epoxy group, at least one further compound of the general formula (II) SiX.sub.4 (II), where X is alkoxy, and at least one antimicrobial agent, in particular at least one biocide.

The present invention provides organofunctional siloxane coupling agents, dipodal siloxanes, siloxane block copolymers and a specific method for preparing these organofunctional siloxanes through an addition reaction of hydrido alkoxysilane and organofunctional disiloxanes to an organocyclosiloxane with a catalyst. The addition reaction of the current invention does not result in polymerization and therefore the novel siloxane couplings agents are free of cyclosiloxanes and polymeric siloxanes. This makes them apt for adhesives, coatings and sealant applications. The present invention also relates to the use of these organofunctional siloxane compounds for the treatment of fillers and surfaces.

An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO.sub.2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO.sub.2 (unit Q′) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO.sub.2 (unit Q″) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater.