Polyester-modified, branched organosiloxanes can be used as plastics additives. Corresponding plastics compositions contain at least one plastics additive (A) and at least one plastic (B). The at least one plastics additive (A) can be one or more polyester-modified, branched organosiloxanes. Moulding compounds or shaped bodies can contain this plastics composition. The plastics composition, the moulding compounds, and the shaped bodies are useful,

Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use. The adhesive composition comprises: (A) a chain-like organopolysiloxane having at least two aliphatic unsaturated carbon-carbon bond-containing groups only at the terminals of the molecular chain; (B) a straight-chain organohydrogenpolysiloxane having silicon-bonded hydrogen atoms only at both terminals of the molecular chain; (C) a resinous organopolysiloxane; and (D) an organopolysiloxane having at least one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than the ends of the molecular chain, and having three or more aliphatic unsaturated carbon-carbon bond groups in the molecule.

A one-pack type curable silicone gel composition which contains: 100 parts by mass of (A) a branched chain organopolysiloxane having a specific structure from 0.1 part by mass to 50 parts by mass of (B) a diorganopolysiloxane having both molecular chain ends blocked with diorganohydrogensiloxy groups; (C) a platinum-based catalyst; and (D) a phosphite compound represented by formula (3)

##STR00001##

(wherein R.sup.2 represents a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and X represents a hydrogen atom or a methyl group) in such an amount that more than 3 molecules hut not more than 15 molecules of the phosphite compound represented by formula (3) are present per one platinum atom in component (C). This one-pack type curable silicone gel composition is stable in terms of characteristics and physical properties even if exposed to a temperature more than 50° C. for a long period of time.

Reaction system for preparing acetoxy function-bearing siloxanes having chain lengths of more than 3 silicon atoms, comprising silanes and/or siloxanes bearing alkoxy groups, silanes and/or siloxanes bearing acetoxy groups, silanes and/or siloxanes bearing hydroxy groups and/or simple siloxane cycles and/or DT cycles, and also a reaction medium comprising acetic anhydride, Brønsted acid and acetic acid, wherein Brønsted acids having a pKa ≤−1.30 are used, and wherein the acetic acid is present in the reaction system in amounts of 0.4 to 15.0 percent by weight, based on the reaction system, wherein the molar ratio of Brønsted acid used to acetic acid is in a defined range, with the proviso that either the sole use of trifluoromethanesulfonic acid and also of trifluoromethanesulfonic acid and acetic acid is excluded, and/or that the Brønsted acid used at least in part has a pKa between −1.3 and >−13.5.

An absorbent composition includes an amino-siloxane having structure (I): wherein R.sup.1 is independently at each occurrence a C.sub.1-C.sub.6 aliphatic or aromatic radical; R.sup.2 is independently at each occurrence a C.sub.2-C.sub.10 aliphatic or aromatic radical; R.sup.3 is independently at each occurrence a hydrogen atom or a C.sub.1-C.sub.6 aliphatic or aromatic radical; R.sup.4 is independently at each occurrence a C.sub.1-C.sub.18 aliphatic or aromatic radical or R.sup.5, wherein R.sup.5 comprises structure (II): wherein X is independently at each occurrence an oxygen atom or a sulfur atom; w is between 0 and 5; y is between 0 and 10; and z is between 0 and 10; wherein, when R.sup.4 is R.sup.5 comprising the structure (II), a sum of w, y, and z is greater than or equal to 0, and, when R.sup.4 is not R.sup.5, a sum of w, y, and z is greater than or equal to 1. ##STR00001##

Si-containing film forming compositions are disclosed comprising a precursor having the formula [—NR—R.sup.4R.sup.5Si—(CH.sub.2).sub.t—SiR.sup.2R.sup.3—].sub.n wherein n=2 to 400; R, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 are independently H, a hydrocarbon group, or an alkylamino group, and provided that at least one of R.sup.2, R.sup.3, R.sup.4, and R.sup.5 is H; and R is independently H, a hydrocarbon group, or a silyl group. Exemplary pre-cursors include, but are not limited to, [—NH—SiH.sub.2—CH.sub.2—SiH.sub.2—].sub.n, and [—N(SiH.sub.2—CH.sub.2—SiH.sub.3)—SiH.sub.2—CH.sub.2—SiH.sub.2—].sub.n.

A silicone rubber composition is provided. The silicone rubber composition comprises a hydrophobic silica, polyamide microparticles, a liquid organopolysiloxane having two chain ends each bearing an alkenyl group, a liquid polyhydroalkylsiloxane having two chain ends each bearing an SiR′.sub.3O.sub.1/2 group, and a hydrosilylation catalyst. The ratio of the number of (R′HSiO.sub.2/2) units in the polyhydroalkylsiloxane to the number of alkenyl groups is greater than 5. Such a composition has good adhesive properties with respect to a crosslinked butyl rubber composition, good friction resistance properties and good flexibility properties.

A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.

A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.

A networked silicone is disclosed. The networked silicone comprises crosslinked strands of looped organosilicon compounds. A composition for preparing the networked silicone is also disclosed, and comprises (A) a looped organosilicon compound, (B) a crosslinking organosilicon compound, and optionally (C) a catalyst. Additionally, a method of preparing the networked silicone is disclosed, and comprises reacting the looped organosilicon compound (A) and the crosslinking organosilicon compound (B), optionally in the presence of the catalyst (C), to give the networked silicone. A reaction product comprising the networked silicone is also disclosed. The reaction product is prepared from the composition and/or in accordance with the method, and may be a cured product. Additionally, a composite article and a method of forming the same are disclosed. The composite article is formed by disposing a networked silicone composition on the substrate and curing the networked silicone composition, thereby preparing the composite article.