Patent classifications
C08G77/80
Curable resin composition, cured product thereof, and semiconductor device using the same
According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.
CURABLE SILICONE COMPOSITION, CURABLE HOT-MELT SILICONE, AND OPTICAL DEVICE
A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa.Math.s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.
Polysiloxane Films and Methods of Making Polysiloxane Films
A method of forming a polysiloxane film on a substrate comprises polymerizing a siloxane monomer in a reaction chamber containing the substrate. The polymerization is catalyzed by a 30-60 W radio frequency plasma, the pressure in the reaction chamber during the polymerization is 100-400 mTorr, the residence time of the siloxane monomer in the reaction chamber is 5-120 minutes, the siloxane monomer is heated to 30-200° C. before entering the reaction chamber, and the polymerization is carried out at a temperature of 30-100° C.
Polysiloxane Films and Methods of Making Polysiloxane Films
A polysiloxane film comprises Si—O bonds and has a thickness of 0.3 to 1.5 microns. Adjacent electrodes coated with the polysiloxane film have a leakage current of at most 0.01 mA at 10 V after contact with water. An electrode coated with the polysiloxane film has a contact resistance of at least 0.01 ohms at 1.0 mm of pogo pin compression under a 1.0 N load. The polysiloxane film provides IPx7 protection from ingress of water.
COATING MATERIAL AND FILM
The purpose of the present invention is to provide a product, in particular, a coating material capable of preventing icing and/or snow accretion. This product includes a first oil component, a second oil component, and a first resin precursor, which is a precursor for a resin component. The first resin precursor including the first and second oil components is cured to form an oil-containing resin layer including the first and second oil components and the resin component. The second oil component constitutes a low-temperature phase-separable oil component that may be phase-separated from the first oil component to exude from the oil-containing resin layer when a temperature decreases to a predetermined value or lower.
Addition-curable silicone resin composition and a semiconductor device
An addition-curable silicone resin composition which exhibits good adhesion to a substrate and has good compatibility with an inorganic filler, as well as a cured product thereof and a highly reliable semiconductor device encapsulated with the cured product, are provided. The addition-curable silicone resin composition includes (A) a linear or branched organopolysiloxane having at least one alkenyl group, said organopolysiloxane comprising at least one unit selected from R.sup.1R.sup.2SiO.sub.2/2 and R.sup.1R.sup.2.sub.2SiO.sub.1/2 units, and at least one unit selected from R.sup.2′.sub.2SiO.sub.2/2, R.sup.2′.sub.3SiO.sub.1/2 and R.sup.2′SiO.sub.3/2 units, wherein a percentage of a total number of the R.sup.1R.sup.2SiO.sub.2/2 and R.sup.1R.sup.2.sub.2SiO.sub.1/2 units, relative to a total number of all siloxane units, is from 0.001% to 50%, and wherein R.sup.1 is, independently at each occurrence, a hydroxy group or an alkoxy group of 1 to 30 carbon atoms; R.sup.2 is, independently at each occurrence, a group selected from a substituted or unsubstituted saturated hydrocarbon group of 1 to 12 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group of 6 to 12 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, and the groups as defined for R.sup.1; and R.sup.2′ is a groups selected from the groups as defined for R.sup.2 other than those as defined for R.sup.1, with the proviso that at least one of R.sup.2 and R.sup.2′ is an alkenyl group; (B) an organohydrogenpolysiloxane having at least two hydrosilyl groups, in an amount such that the ratio of the number of hydrosilyl groups in component (B) to a total number of alkenyl groups in component (A) is from 0.1 to 4; and (C) a catalytic amount of a hydrosilylation catalyst.
SILICONE COMPOSITION AND A METHOD FOR ADDITIVE MANUFACTURING A SILICONE ELASTOMER ARTICLE
The invention relates to a silicone composition and a method for additive manufacturing a silicone elastomer article. The silicone composition is crosslinkable through addition reactions and comprise: (A) at least one organopolysiloxane compound A comprising, per molecule at least two C.sub.2-C.sub.6 alkenyl radicals bonded to silicon atoms, (B) at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom, (C) at least one catalyst C consisting of at least one metal or compound, from the platinum group, (D) at least one reinforcing silica filler D which is at least partly surface treated, (E) at least one organopolysiloxane having an aryl group E and (F) optionally at least one crosslinking inhibitor F.
Functionalized coating polymers and uses thereof
The present invention relates to functionalized polymers useful for coating surfaces, such as the internal bore of a column. In particular embodiments, such functionalized polymers provide a selective stationary phase useful for separating and detecting organophosphorous agents. Methods of using such polymers are also described herein.
ADHESIVE
Described herein is a two-part condensation curable adhesive composition suitable for adhering a front lens having an inner surface coated with an anti-haze coating to a lamp body to create a sealed lamp unit. In general, once cured in place, residual ingredients from the adhesive composition or by-products of cure reactions thereof do not visibly inhibit functionality of the anti-haze coating of the sealed lamp unit.
ELECTRONIC DEVICE COMPRISING A CONFORMAL VISCOELASTIC OR NON-NEWTONIAN COATING
A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.