C08G77/80

Fluoroalkyl group-containing curable organopolysiloxane composition, cured product thereof, and transducer or the like provided with cured product
11479670 · 2022-10-25 · ·

A curable organopolysiloxane composition is provided. The composition can be easily processed into a film shape and has a high specific dielectric constant, high dielectric breakdown strength, and a low Young's modulus, allowing for a high energy density to be achieved, in addition to having excellent mechanical strength when used as a dielectric layer in a transducer. A fluoroalkyl group-containing curable organopolysiloxane composition, which can be cured by an addition reaction, comprises: an organopolysiloxane containing an alkenyl group and a fluoroalkyl group; an organohydrogen polysiloxane having SiH at both terminals of a molecular chain but not having a fluoroalkyl group; and a linear fluoroalkyl group-containing organohydrogen polysiloxane or a branched fluoroalkyl group-containing organohydrogen polysiloxane having T units.

Electronic device comprising a conformal viscoelastic or non-Newtonian coating

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

RADIATION SENSITIVE COMPOSITION

A compound of Formula (5-1) or Formula (5-3):

##STR00001##

where R.sup.17 and R.sup.21 are each an ethyl group; R.sup.22 and R.sup.23 are each a methyl group; and R.sup.16 and R.sup.20 are each a methoxy group.

SILSESQUIOXANE DERIVATIVE AND USE THEREOF

A silsesquioxane derivative that can further contribute to improving heat conductivity. The silsesquioxane derivative represented in the following formula forms a matrix having exceptional heat conductivity due to curing.


[C5]


[SiO.sub.4/2].sub.s[R.sup.1—SiO.sub.3/2].sub.t[R.sup.2—SiO.sub.3/2].sub.u[H—SiO.sub.3/2].sub.v[R.sup.3.sub.2—SiO.sub.2/2].sub.w[H,R.sup.4.sub.2—SiO.sub.1/2].sub.x[R.sup.5.sub.3—SiO.sub.1/2].sub.y  (1)

[in the formula, R.sup.1 is a hydrosilylation-reactive organic group having a carbon-carbon unsaturated bond and having 2 to 30 carbon atoms, R.sup.2, R.sup.3, R.sup.4 and R.sup.5 are each independently at least one selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 5 to 10 carbon atoms and an aralkyl group having 6 to 10 carbon atoms, t, u, w and x are a positive number, and s, v and y are 0 or a positive number].

Silicone polymer

Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.

Curable white silicone formulation, a reflective material for optical semiconductor module and optical semiconductor device

A curable white silicone composition that is capable of forming a cured product having a high optical reflectance as well as exceptional light resistance is provided. The curable white silicone composition includes (A) an organopolysiloxane having at least 2 alkenyl groups per molecule, (B) a cerium-containing organopolysiloxane, (C) a white pigment, and (D) a curing catalyst.

Water-based gel-consolidation type lost circulation material system suitable for fractured lost circulation formation, preparation method and use thereof

The present discloses a water-based gel-consolidation type lost circulation material system suitable for fractured lost circulation formation, preparation method and use thereof.

METHOD FOR MAKING EMBEDDED HYDROGEL CONTACT LENSES

The invention is directed to an embedded hydrogel contact lens, which comprises an insert sandwiched between two layers of hydrogel materials and can be produced according to a cast molding method including the procedures involving two females halves (FC1 and FC2) and two male halves (BC1 and BC2) and three consequential molding steps involving three molding assemblies: the 1st one formed between FC1 and BC1 for molding an insert; the 2.sup.nd one formed between FC1 and BC2 for molding a lens precursor having the molded insert embedded in a layer of a hydrogel material in a way that the front surface of the molded insert merges with the convex surface of the lens precursor; and the 3rd one formed between FC2 and BC2 for molding an embedded hydrogel contact of the invention.

Composition for acoustic wave probe, silicone resin for acoustic wave probe formed of the same, acoustic wave probe, ultrasound probe, acoustic wave measurement apparatus, ultrasound diagnostic apparatus, photoacoustic wave measurement apparatus, and ultrasound endoscope

Provided are a composition for an acoustic wave probe which includes polysiloxane that has a vinyl group and a phenyl group, polysiloxane that has two or more Si—H groups in a molecular chain, a titanium oxide particle, and a silica particle, in which at least one of the titanium oxide particle (C) or the silica particle (D) is a particle subjected to surface treatment; a silicone resin for an acoustic wave probe; an acoustic wave probe; an acoustic wave measurement apparatus; an ultrasound diagnostic apparatus; an ultrasound probe; a photoacoustic wave measurement apparatus; and an ultrasound endoscope.

Curable silicone composition, optical semiconductor device and a method of manufacturing the same

A curable silicone composition encapsulates, coats, or adheres an optical semiconductor element. The curable silicone composition can form a cured product with sufficiently low gas-permeability, and with little weight decrease and little change in hardness even on long-term exposure to high temperatures. The curable silicone composition comprises resinous organopolysiloxane that contains at least one (Ar.sub.2SiO.sub.2/2) unit, wherein Ar denotes an aryl group.