Disclosed herein are curable compositions comprising an epoxide-functional polymer, a curing agent capable of reacting with the epoxide-functional polymer that is activatable by an external energy source, and a fluoropolymer that is substantially free of a reactive functional group. The epoxide-functional polymer may be a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.

Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.

A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and diisocyanate, clay, polyester/polyether elastomer, a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof, a tackifying agent, and optionally a second thermoplastic polymer selected from the group consisting of thermoplastic polyurethane, thermoplastic polycaprolactone, and combinations thereof.

A method of manufacturing a footwear includes the steps of providing a leather base layer and providing a leather attachment layer. The leather base layer and the leather attachment layer are fixed against each other with an intermediate application of adhesive between them. The applied adhesive is activated. The leather base layer and the leather attachment layer are forced against each other under a pressure with the adhesive between them. The adhesive is cured and thereby the leather base layer and the leather attachment layer are bonded to each other. The bonded leather base layer and the leather attachment layer are integrated as part of the footwear.

A hot melt moisture cure adhesive composition that includes a polyurethane prepolymer that includes the reaction product of diisocyanate, a polyester triol first polyol, a crystalline polyester second polyol, and a third polyol different from the first and second polyols.

The use, for seamless textile assembly by printing, of a copolyamide including: a) at least one hard segment obtained by polycondensation of at least one of the following: (i) an α,ω-aminocarboxylic acid; (ii) a lactam; and/or (iii) an aliphatic diacid with 6 to 22 carbon atoms and at least one aliphatic diamine with 2 to 14 carbon atoms, and, optionally, b) at least one soft segment obtained by polycondensation of at least one diacid with 4 to 44 carbon atoms with at least one diamine chosen from diamines with 2 to 44 carbon atoms and polyoxyalkylene diamines, the copolyamide having a melting temperature Tm above 80° C. and below 210° C. and a viscosity at 170° C., as measured according to standard ASTM D3236-88 (2009), using a Brookfield rheometer with SC 4-27 spindle, of between 5 Pa.Math.s and 100-200 Pa.Math.s.

The present invention relates to an alkylene-oxide-added polyol composition, a polyurethane using same, and a hot-melt adhesive comprising same, and, more specifically, to an alkylene oxide-added polyol composition, a polyurethane using same, and a hot-melt adhesive comprising same, the composition being prepared by performing, in a specific content ratio, an addition reaction between an alkylene oxide and an anhydrosugar alcohol composition comprising a) a monoanhydrosugar alcohol, b) a dianhydrosugar alcohol, c) a polysaccharide alcohol, d) an anhydrosugar alcohol derived from a polysaccharide alcohol, and e) a polymer of at least one of a) to d), and thus can increase the amount of bio components, improves adhesive strength, and enables a polyurethane to be prepared at a cost lower than that of when using petroleum polyols and other biopolyols.

Various adhesive compositions are described which may optionally comprise one or more active agents such as pharmaceutical agents. The incorporation of one or more absorbents in combination with one or more crystallization inhibitors improves adhesive characteristics of the compositions. Also described are related methods of improving adhesive characteristics of adhesive compositions with the use of a combination of absorbent and inhibitor. Also described are related methods of using the compositions and articles incorporating such compositions.

The present invention provides bonding systems comprising a formaldehyde-based (urea-/melamine-/phenol-/resorcinol-formaldehyde or other combination) and/or a polymeric isocyanate resin system composition for bonding ligno-cellulosic materials to form panels and/or shaped products, which contain a resin hardener, also referred to as resin catalyst, characterised in that the hardener is activated by heat.

This invention relates to adhesive compositions comprising a polyester polyol that includes residues of at least one 2, 2, 4, 4-tetraalkylcyclobutane-1, 3-diol, including, for example, 2, 2, 4, 4-tetramethylcyclobutane-1, 3-diol (TMCD). Adhesive compositions as described herein exhibit enhanced properties as compared to conventional adhesive compositions, and may be suitable for a wide variety of end use applications, including, flexible packaging, woodworking, automotive uses, and electronics.