A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

The present invention addresses the problem of providing a prepreg that has excellent short-time and low-pressure handling properties, during pasting and layering work. In order to solve the problem, this invention has the following configuration. The prepreg includes reinforcing fibers and an epoxy resin composition, has a fiber content of 90 mass % or less, and satisfies conditions (a) and (b) below. (a) When the average thickness of the prepreg is set as D (D being 3 μm or greater), the viscosity at 25° C. of the epoxy resin composition at a site (I) located at a depth of D/4 to 3D/4 from the surface on one side of the prepreg is 50,000 to 300,000 Pa.Math.s inclusive. (b) From among sites (II) located at a depth of up to 0.5 μm from each surface on both sides of the prepreg, the viscosity at 25° C. of the epoxy resin composition at least at a site (II) on the one side is 10,000 to 40,000 Pa.Math.s inclusive.

The present invention provides a laminated plate capable of not only achieving a reduced weight and an increased rigidity but also improving a sound absorbing performance, and a method for manufacturing the same. A laminated plate (1) is supposed to include a core layer (2) including a plate-shaped paper honeycomb structure (4) and a pair of fiber reinforcement layers (3) sandwiching the paper honeycomb structure (4) from both sides in a thickness direction and integrated with the paper honeycomb structure 4. The through-holes (5) of the paper honeycomb structure (4) are filled with a foam resin (6), and the core layer (2) is made up of the paper honeycomb structure 4 and the foam resin (6) filled in the through-holes (5). When the foam resin (6) is filled in the through-holes (5) of the paper honeycomb structure (4), the foam resin plate (6A) is pushed into the through-holes (5) as a filling material by utilizing a compression force of a mold (11).

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

A tribologically modified polyoxymethylene polymer composition is disclosed. The polyoxymethylene polymer composition is comprised of a polyoxymethylene polymer, reinforcing fibers, and at least one tribological modifier. The tribological modifier, in one embodiment, can comprise a graft copolymer. The use of a graft copolymer has been found to unexpectedly and dramatically improve noise generation when tested against various substrates, especially glass substrates.

A composite laminate structure includes one or more layers of prepreg and a thermoplastic polyurethane film layer on the surface of the one or more prepregs. A method of making a composite laminate structure including a thermoplastic polyurethane film is also provided.

Provided are a novel filament for a three-dimensional printer, a winding, a method for producing a filament for a three-dimensional printer, and a method for producing a formed article. The filament for a three-dimensional printer includes a continuous reinforcing fiber impregnated with a thermosetting resin composition containing a thermosetting resin, the filament having a characteristic of being solid at 25° C.

A thermosetting resin composition contains at least: [A] a thermosetting resin; [B] a curing agent; and [C] polyamide particles satisfying following (c1) to (c6): (c1) a melting point of polyamide resin constituting the polyamide particles is 200 to 300° C.; (c2) a crystallization temperature of the polyamide resin constituting the polyamide particles is 150° C. to 250° C.; (c3) a number average particle size of the polyamide particles is 1 to 100 μm; (c4) a sphericity of the polyamide particles is 80 to 100; and (c5) the linseed oil absorption of the polyamide particles is 10 to 100 mL/100 g. A thermosetting resin composition of the present invention enables suitable production of a fiber-reinforced composite material having sufficient compressive strength after impact and wet heat compression performance.

The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.