The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.

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In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

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The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The surface-treated glass cloth includes a surface treatment layer on a surface, and the surface treatment layer includes: a first silane coupling agent containing at least one amine selected from the group consisting of a primary amine, a secondary amine and a tertiary amine and containing no quaternary ammonium cation; a second silane coupling agent containing at least one quaternary ammonium cation; an organic acid; and a surfactant. A total content of the first silane coupling agent and the second silane coupling agent is 0.05 to 1.20 mass% based on the total amount of the surface-treated glass cloth, a ratio of a molar content of the first silane coupling agent to a molar content of the second silane coupling agent is 1.1 to 10.0, and a content of the organic acid is 50 to 300 ppm based on the total amount of the surface-treated glass cloth.

The surface-treated glass cloth includes a surface treatment layer on a surface, and the surface treatment layer includes: a first silane coupling agent containing at least one amine selected from the group consisting of a primary amine, a secondary amine and a tertiary amine and containing no quaternary ammonium cation; a second silane coupling agent containing at least one quaternary ammonium cation; an organic acid; and a surfactant. A total content of the first silane coupling agent and the second silane coupling agent is 0.05 to 1.20 mass% based on the total amount of the surface-treated glass cloth, a ratio of a molar content of the first silane coupling agent to a molar content of the second silane coupling agent is 1.1 to 10.0, and a content of the organic acid is 50 to 300 ppm based on the total amount of the surface-treated glass cloth.

To provide a novel material that maintains suppleness which is the advantage of a material using fibers and has a low thermal shrinkage ratio, and a method for producing the material, a partially welded material using the material, a composite material, and a method for producing a molded product. A material including: a first region, a fiber region, and a second region continuously in a thickness direction; the first region and the second region being each independently a resin layer including from 20 to 100 mass % of a thermoplastic resin component and from 80 to 0 mass % of reinforcing fibers; the fiber region including from 20 to 100 mass % of thermoplastic resin fibers and from 80 to 0 mass % of reinforcing fibers; the thermoplastic resin component included in the first region and the thermoplastic resin component included in the second region each independently having a crystallization energy during temperature increase of 2 J/g or greater, measured by differential scanning calorimetry; and the thermoplastic resin fibers included in the fiber region having a crystallization energy during temperature increase of less than 1 J/g, measured by differential scanning calorimetry; wherein the crystallization energy during temperature increase is a value measured by using a differential scanning calorimeter (DSC) in a nitrogen stream while heating is performed from 25° C. to a temperature that is 20° C. higher than a melting point of the thermoplastic resin component or the thermoplastic resin fibers at a temperature increase rate of 10° C./min.

A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.

An aspect of the present application relates to a resin composition, which contains a polymer having a structural unit represented by Formula (1) in a molecule and a free radical compound and in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (2), (3), (4) and (5) in the molecule.