To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R.sup.2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

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Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:

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A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

The present invention relates to an aqueous binder for a heat-insulating and sound-absorbing inorganic fiber material, the aqueous binder comprising a polymer having a carboxy group and a crosslinking agent for the polymer, wherein the crosslinking agent comprises an alkanol monoamine and a polyamine having an imino group, the polyamine has an amine value of 1200 to 1650 mg KOH/g, and a ratio of the total number of moles of amino groups and imino groups in the crosslinking agent with respect to the total number of moles of hydroxyl groups, amino groups, and imino groups in the crosslinking agent is 0.6 or less.

A prepreg and an integrally molded article are described, the prepreg including a thermoplastic resin existing on one face of a layer in which reinforcing fibers are impregnated with a thermosetting resin, wherein the prepreg exhibits, in injection molding or press molding, thermal weldability with a member containing a thermoplastic resin, and wherein the thermosetting resin has a specific peak on a loss tangent (tan δ) curve obtained by dynamic mechanical analysis (DMA), so that the prepreg exhibits suitable flexibility and adhesiveness, excellent formability on a complicated mold face, and adhesion to a mold face, causes no positional shift, and can be efficiently reinforced and stiffened at an intended position.

A prepreg and an integrally molded article are described, the prepreg including a thermoplastic resin existing on one face of a layer in which reinforcing fibers are impregnated with a thermosetting resin, wherein the prepreg exhibits, in injection molding or press molding, thermal weldability with a member containing a thermoplastic resin, and wherein the thermosetting resin has a specific peak on a loss tangent (tan δ) curve obtained by dynamic mechanical analysis (DMA), so that the prepreg exhibits suitable flexibility and adhesiveness, excellent formability on a complicated mold face, and adhesion to a mold face, causes no positional shift, and can be efficiently reinforced and stiffened at an intended position.

A laminate structure is disclosed including a fibre laminate impregnated with a laminate matrix material, and a veil of carbon nanotubes impregnated with a veil matrix material. The laminate matrix material and the veil matrix material doped with carbon particles. The veil provides lightning strike protection. The structure is manufactured by co-curing the laminate matrix material and the veil matrix material to bond the veil of carbon nanotubes to the fibre laminate.

A first composition is disclosed that includes a fire-resistant thermoplastic resin. The fire-resistant thermoplastic resin includes 1-20 wt % of an aryl phosphate, includes 1-20 wt % of a phosphate polymer, and 60%-98% of a (meth)acrylic polymer, including units from at least one monomer, wherein the monomer is chosen from methyl methacrylate, acrylic acid, methacrylic acid, acrylic acid esters, methacrylic acid esters, acrylonitrile and maleic anhydride. The first composition may further include a fabric or a composite material that is embedded with the fire-resistant thermoplastic resin. In some instances, the aryl-phosphate and the phosphonate polymer synergistically reduce an effective heat of combustion, a peak heat release, or a flame time as compared to a second composition that contains only one of the aryl phosphate or the phosphonate polymer.