Patent classifications
C08J9/32
RADIATION SUPPRESSION FILM AND RADIATION SUPPRESSION STRUCTURE
A radiation suppression film includes a porous body containing a material transparent to a long wavelength infrared ray as a base material.
PELLET BASED TOOLING AND PROCESS FOR BIODEGRADABLE COMPONENT
An example starch-based material for forming a biodegradable component includes a mixture of a starch and an expansion additive. The starch has an amylose content of less than about 70% by weight. The expansion additive enhances the expansion and physical properties of the starch. A method of preparing a starch-based material is also disclosed and an alternate starch-based material for forming a biodegradable component is also disclosed.
PELLET BASED TOOLING AND PROCESS FOR BIODEGRADABLE COMPONENT
An example starch-based material for forming a biodegradable component includes a mixture of a starch and an expansion additive. The starch has an amylose content of less than about 70% by weight. The expansion additive enhances the expansion and physical properties of the starch. A method of preparing a starch-based material is also disclosed and an alternate starch-based material for forming a biodegradable component is also disclosed.
THERMOSETTABLE PRECURSOR OF A STRUCTURAL ADHESIVE COMPOSITION WITH CORROSION RESISTANCE
A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, a method of bonding two parts and to uses of the thermosettable precursor of an expanded structural adhesive composition.
THERMOSETTABLE PRECURSOR OF A STRUCTURAL ADHESIVE COMPOSITION WITH CORROSION RESISTANCE
A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, a method of bonding two parts and to uses of the thermosettable precursor of an expanded structural adhesive composition.
Thermoplastic vulcanizates for foaming applications
The present disclosure relates to TPV compositions suitable for foaming, as well as foamed TPV compositions, methods of making the foregoing, and applications of various foamed TPV compositions. The TPV compositions comprise an at least partially vulcanized rubber component dispersed within a thermoplastic component comprising a thermoplastic resin and a propylene-based elastomer, oil, and optionally one or more additives. According to some aspects, the TPV composition may be made in part by preloading some portion of process oil prior to addition of the curative. TPV compositions provided herein are particularly suitable for foaming with thermo-expandable microsphere foaming agents.
Thermoplastic vulcanizates for foaming applications
The present disclosure relates to TPV compositions suitable for foaming, as well as foamed TPV compositions, methods of making the foregoing, and applications of various foamed TPV compositions. The TPV compositions comprise an at least partially vulcanized rubber component dispersed within a thermoplastic component comprising a thermoplastic resin and a propylene-based elastomer, oil, and optionally one or more additives. According to some aspects, the TPV composition may be made in part by preloading some portion of process oil prior to addition of the curative. TPV compositions provided herein are particularly suitable for foaming with thermo-expandable microsphere foaming agents.
POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad. The polishing pad increases the area in direct contact with the semiconductor substrate during the polishing process and can prevent defects occurring on the surface of the semiconductor substrate by forming a plurality of uniform pores in the polishing layer, thereby adjusting the surface roughness characteristics of the polishing surface of the polishing layer. Further, the present disclosure may provide a method for manufacturing a semiconductor device to which the polishing pad is applied.
Compositions and Foam Compositions Containing Composite Particles, Articles, Composite Particles, and Methods
Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are foam compositions and particles including the foam compositions, such as a sheet or multilayer construction. Composite particles are further provided. Methods of making the foam compositions are additionally described herein. Also, polishing pads, polishing systems, and methods of polishing a substrate are provided.
Epoxy based reinforcing patches having improved damping loss factor
A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.