This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.

Hollow resin particles for thermosensitive recording media containing a thermoplastic resin shell and a hollow part surrounded by the shell. The hollow resin particles contain a thermally-vaporizable hydrocarbon in an encapsulation ratio of at least 0.2 wt %. The hollow resin particles preferably have a mean volume particle size ranging from 0.1 to 10 μm.

The present invention provides a thermally expandable microcapsule having excellent heat resistance and high expansion ratio and enabling production of a light, high-hardness molded article having excellent physical properties (abrasion resistance), and a composition for foam molding containing the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell containing a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell containing silicon dioxide and a polymer obtained by polymerizing a monomer composition containing a carbonyl group-containing monomer, the thermally expandable microcapsule having a ratio of a peak intensity based on a C═O bond in the shell to a peak intensity based on the silicon dioxide in the shell (peak intensity based on C═O bond/peak intensity based on silicon dioxide) of 0.25 to 1.0 as determined by IR spectral analysis, the thermally expandable microcapsule having a maximum foaming temperature (Tmax) of 180° C. to 225° C.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polyurethane polishing pad can be adjusted. Thus, it is possible to provide a porous polyurethane polishing pad that has enhanced physical properties such as a proper level of withstand voltage, excellent polishing performance (i.e., polishing rate), and the like.

Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are foam compositions and particles including the foam compositions, such as a sheet or multilayer construction. Composite particles are further provided. Methods of making the foam compositions are additionally described herein. Also, polishing pads, polishing systems, and methods of polishing a substrate are provided.

The present invention relates to a non-crosslinked block copolymer foam composition, characterised in that it is in the form of a polymer matrix comprising closed cells containing gas, said matrix comprising: from 90 to 99.9% by weight of said block copolymer; and from 0.01 to 10% by weight of metal carbonate, for the total weight of the foam composition. The present invention also relates to a foamable composition and a method for manufacturing said foam, as well as the use of the foam in sports shoe soles, balloons or balls, gloves, personal protection equipment, rail soles, automobile parts, construction parts, electrical and electronic equipment parts, audio equipment, sound- and/or heat-proofing, and parts used to damp vibrations.

Gel compositions for filling cables, such as communication cables, in particular gel compositions containing microspheres, cables containing said gels, and methods of preparing such gels.

Composite particles are provided including a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are compositions and foam compositions containing the composite particles. Further, articles are provided including the foam compositions, such as a sheet, tape, or hearing protection article. Methods of making and using the foam compositions are additionally described herein.

A method of preparing a superabsorbent polymer sheet by polymerization of monomers in the presence of an encapsulated foaming agent and an inorganic foaming agent is provided. According to the method of preparing the superabsorbent polymer sheet of the present invention, a porous and flexible superabsorbent polymer sheet may be prepared.

Heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a polymer of a polymerizable component containing a cross-linkable monomer (A) which has at least two (meth)acryloyl groups per molecule and a reactive carbon-carbon double bond in addition to the (meth)acryloyl groups and has a molecular weight of at least 500. Also disclosed are hollow resin particles manufactured by expanding the heat-expandable microspheres; fine-particle-coated hollow resin particles including the hollow resin particles; a composition including a base component and the heat-expandable microspheres, or hollow resin particles, or fine-particle coated hollow resin particles; and a formed article manufactured by forming the composition.