C08J2351/08

Resin composition, prepreg, resin-equipped film, resin- equipped metal foil, metal-clad laminate, and wiring board

A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule, and a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule, in which an equivalent ratio of the acid anhydride group in the acid anhydride (a2) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).

Low viscosity (meth)acrylates as reactive additives in reactive compositions for making rigid polyurethane/polyisocyanurate comprising foams

A reactive composition is disclosed for making a polyisocyanurate-polyurethane comprising rigid foam (PIR-PUR), said reactive composition comprising a polyisocyanate composition, an isocyanate-reactive composition, at least one catalyst compound suitable for making the PIR-PUR comprising foam, at least one blowing agent; and optionally one or more surfactants, one or more flame retardants, one or more antioxidants, or combinations thereof characterized in that the reactive composition further comprises a reactive viscosity reducer selected from at least one acrylate and/or methacrylate compound having no isocyanate-reactive groups and having a viscosity at 25 C. below 100 mPa.Math.s.

DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM

A thermosetting resin composition having low dielectric constant, low dielectric loss tangent, high glass transition point, and excellent water resistance, and cured product therefrom. The thermosetting resin composition includes the following components (A) and (B). (A) a compound of formula (I) (X.sup.1 and X.sup.2 each independently represent a C1-C20 alkyl group or the like, n1 and n2 each independently represent 0 or 1, Z.sup.1 and Z.sup.2 each independently represent a single bond or the like, X.sup.3 and X.sup.4 each independently represent an organic group or the like, m1 and m2 each independently represent any integer from 0 to 4, and Y represents a polymerizable functional group) (B) a maleimide compound having one or more maleimide groups, a polyphenylene ether compound, polybutadiene, a styrene-butadiene-styrene block copolymer, or polymer having repeat unit of formula (III) (Z.sup.3 represents C6-C12 arylene group, and R.sup.2 to R.sup.7 each independently represent hydrogen atom or the like).

Polyfunctional vinyl resin and method for producing same, polyfunctional vinyl resin composition, cured article, prepreg, resin sheet, and laminated plate

Provided is a resin material showing a high thermal conductivity and having high heat resistance while having a low dielectric constant and a low dielectric loss tangent. The material is a polyfunctional vinyl resin, which is represented by the following general formula (1): ##STR00001##
where R.sup.1s each independently represent a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2s each independently represent a hydrogen atom or a dicyclopentenyl group, and at least one thereof represents a dicyclopentenyl group, Xs each independently represent a hydrogen atom or a vinyl group-containing aromatic group represented by the formula (1a), and at least one thereof represents a vinyl group-containing aromatic group, n represents a number of repetitions, and the average thereof is a number of from 1 to 5, and Ar represents an aromatic ring.

High water reduction powder preparation for dry mortar
12391616 · 2025-08-19 · ·

PCE-type copolymers in powder form can be obtained by spry-drying and are easily re-dispersed in water. The fineness and the anti-caking properties of said PCE-type copolymers in powder form, as well as their water reduction potential and influence on slump life are improved. A production process of said PCE-type copolymers in powder form is by a spray-drying method, and PCE-type copolymers can be used for the improvement of mineral binder compositions and especially dry mortars.

SHEET MOLDING COMPOSITION AND ARTICLES FORMED THEREFROM WITH HIGH CHAR STRENGTH

A sheet molding compound (SMC) composition formulation including a curable resin, such as unsaturated polyester of vinyl ester, in an ethylenically unsaturated monomer; a low profile additive, in a curable solvent; and an intumescent additive, such as melamine polyphosphate or ethylene diamine phosphate. An article formed of the SMC composition formulation experiences no more than a 100% increase in thickness as compared to an initial thickness of the article after exposure to a flame. The low profile additive is present in the composition and the intumescent additive is present in the composition. The resulting article has a char strength at 3 mm thickness of between 100 and 1,000 Newtons.

Compositions for energy conversion and storage and methods of making the same

The present disclosure relates to a composition that includes a first layer that includes a polymer having a repeat unit with a structure that includes ##STR00001##
where m is between 2 and 100, inclusively, the repeat unit is protonated at at least one of position A) and/or B) and/or sulfonated at at least one of rings 1) and/or 2), R.sub.1 includes at least one of a lone pair of electrons, a covalent bond, hydrogen, and/or a hydrocarbon functional group, R.sub.2 includes at least one of a lone pair of electrons, a covalent bond, hydrogen, and/or a hydrocarbon functional group, and custom character is a covalent bond.

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD

A resin composition contains a polyphenylene ether compound (A), a reactive compound (B) having an unsaturated double bond in a molecule, and at least one additive (C) selected from the group consisting of a heavy metal deactivator (C1) having at least one of an amino group and a triazole structure and a phenolic hydroxyl group in a molecule, a phosphite-based antioxidant (C2) having a tertiary butyl group and a phosphite structure in a molecule, and a hindered phenol-based antioxidant (C3) having a tertiary butyl group and a phenolic hydroxyl group in a molecule.