To provide a novel fluororesin which is useful as an electronic substrate material for high-speed transmission. A fluororesin having a structure represented by formula (I) (n is within the range of from 1 to 100; L is a C.sub.5-C.sub.12 cycloalkylidene group which may have substituents; R.sup.3 and R.sup.4 are each independently a group selected from the group consisting of hydrogen, fluorine, C.sub.1-C.sub.10 saturated or unsaturated hydrocarbon groups in which some or all hydrogen is optionally substituted with halogens, and C.sub.6-C.sub.10 aryl groups in which some or all hydrogen is optionally substituted with halogens; and X is a group having an olefinic carbon-carbon double bond or a carbon-carbon triple bond).

Formula (I);

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A built-in and process-adaptive formulation of antimicrobial commodity thermoplastic resins with mixed compositions comprising of a polymer, a backbone linker, and a non-labile antifouling and biocompatible coupling agent which is melt-processable and enabled to be manufactured into finished products in the form of solid, monolith, tube, composite, fiber, film, sheet and varnish without the prerequisite of biocides or antimicrobial additives is disclosed. The said formulation is adapted to thermoforming and thermal curing processes including but not limited to melt compounding, spinning, extrusion, molding, compression foaming and drawing. The antimicrobial property is attributed to the persistent formation of a non-stick bacteria-repellent tethered layer in which the antifouling component of the said formulation is heterogeneously phase separated and/or surface migrated to the surface after product forming in order to minimize adsorption and/or colonization of bacteria.

The present invention relates to a process for the preparation of dispersions of colloidal polymerized particles and to the colloidal polymerized particles obtained and/or obtainable by the process as well as to their use.

An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: T.sub.n-[W-(Z).sub.f/(H).sub.1f-W].sub.n1-[W-(Z).sub.f/(H).sub.1f-(OCN).sub.f/(R).sub.1f].sub.n+2, wherein T is a 1,3,5-substituted-triazine moiety (C.sub.3N.sub.3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

A method for producing a protein adsorbent comprising a substrate and a molecular chain fixed on the surface of the substrate is disclosed. The method comprises, in this order: a dry-heat treatment step of heating a pretreatment adsorbent comprising the substrate and the molecular chain fixed on the surface of the substrate, in which the molecular chain contains a weak electrolytic ion-exchange group; and a wet-heat treatment step of heating the pretreatment adsorbent in a moistened state with a liquid or steam to obtain the protein adsorbent.

A resin composition including a maleimide resin (A) obtained by reacting a tetracarboxylic acid dianhydride (a1), a diamine (a2), and maleic anhydride (a3), in which the tetracarboxylic acid dianhydride (a1) contains at least one of a compound represented by the following Formula (1), a compound represented by the following Formula (2), and a compound represented by the following Formula (6), and the diamine (a2) contains a dimer diamine and a second diamine other than a dimer diamine:

##STR00001##

The present invention relates to a hard coating film, and, more particularly, to a hard coating film having hardness and excellent physical properties. According to the present invention, the hard coating film has high physical properties including hardness, scratch resistance, transparency, durability, light resistance, and light transmittance. Thus, the hard coating film can find useful applications in various fields thanks to its excellent physical properties.

An object of the present invention is to provide a curable resin composition having excellent solvent solubility, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties), and a cured article thereof. Specifically, the curable resin composition includes a curable resin (A) that has a repeating unit represented by General Formula (1) and contains one or more reactive groups selected from the group consisting of a (meth)acryloyloxy group, a vinylbenzyl ether group, and an allyl ether group as a terminal structure, and a curable compound (B) represented by General Formula (2).

##STR00001##

The details of the substituent represented by General Formula (1) and the number of substituents are as described in the specification.

##STR00002##

The details of the substituent represented by General Formula (2) and the number of substituents are as described in the specification.

According to the present invention, there can be provided a resin composition comprising a phenylene ether resin and a petroleum resin, wherein the phenylene ether resin is represented by the following general formula (1):

##STR00001## wherein X represents a unit comprising an aromatic ring; Y.sub.1 and Y.sub.2, which may be the same or different, each represent a phenylene group; Z.sub.1 and Z.sub.2, which may be the same or different, each represent a hydrogen atom or a unit comprising a polymerizable double bonding group; and at least any one of m and n is not 0, and m and n represent an integer of 0 to 300, wherein in the general formula (1), with regard to the percentage (%) of the number of the polymerizable double bonding groups (A) [eq./g] and the number of hydroxyl groups (B) [eq./g], (A)/(B)=95.0 to 99.5/0.5 to 5.0.

A method for producing a protein adsorbent comprising a substrate and a molecular chain fixed on the surface of the substrate is disclosed. The method comprises, in this order: a dry-heat treatment step of heating a pretreatment adsorbent comprising the substrate and the molecular chain fixed on the surface of the substrate, in which the molecular chain contains a weak electrolytic ion-exchange group; and a wet-heat treatment step of heating the pretreatment adsorbent in a moistened state with a liquid or steam to obtain the protein adsorbent.