Patent classifications
C08J2361/04
Sizing composition for mineral fibers and resulting products
The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender. Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20 C., at least equal to 1000%. Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.
Phenolic foam and method of manufacture thereof
A thermal insulating phenolic foam and method of manufacture thereof is provided. A phenolic foam is formed by foaming and curing a phenolic resin composition that comprises a phenolic resin, an acid catalyst, a blowing agent comprising a hydrocarbon having 6 carbon atoms or less, and an alkoxy alcohol. The resulting foam has low thermal conductivity and has excellent long term thermal stability.
METHOD OF PRODUCING PHENOLIC RESIN FOAM
A method of producing a phenolic resin foam is provided. The method includes foaming and curing, on a surface material, a foamable phenolic resin composition containing a phenolic resin, a surfactant, a curing catalyst, and at least one selected from the group consisting of a chlorinated hydrofluoroolefin, a non-chlorinated hydrofluoroolefin, and a halogenated hydrocarbon. The phenolic resin has a weight average molecular weight Mw of at least 400 and no greater than 3,000 as determined by gel permeation chromatography. The phenolic resin has a viscosity at 40 C. of at least 1,000 mPa.Math.s and no greater than 100,000 mPa.Math.s. The phenolic resin has a viscosity increase rate constant of at least 0.05 (1/min) and no greater than 0.5 (1/min).
PHENOLIC RESIN FOAM AND METHOD OF PRODUCING SAME
A phenolic resin foam that has low initial thermal conductivity, maintains low thermal conductivity over the long term, and has excellent compressive strength is provided. A phenolic resin foam comprises: cyclopentane; and a high-boiling hydrocarbon with a boiling point of 140 C. or more and 350 C. or less, and has a density of 10 kg/m.sup.3 or more and 150 kg/m.sup.3 or less. The content of the cyclopentane in the phenolic resin foam is 0.25 mol to 0.85 mol per a space volume of 22.410.sup.3 m.sup.3 in the phenolic resin foam.
Compositions comprising 2,3,3,3-tetrafluoropropene, 1,1,2,3 tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane
The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.
FIBER-CONTAINING PARTICULATE RESIN STRUCTURE, METHOD FOR PRODUCING FIBER-CONTAINING PARTICULATE RESIN STRUCTURE, CURED FIBER-REINFORCED RESIN PRODUCT, AND FIBER-REINFORCED RESIN MOLDED ARTICLE
A fiber-containing particulate resin structure (S) is a particulate resin structure including a resin (1) and fibers (2), in which the fibers (2) are dispersed in the resin (1) in an opened state, and an average density of the resin structure is in a range of 0.20 to 1.00 (g/cm.sup.3).
Foaming Agents And Compositions Containing Fluorine Substituted Olefins And Methods Of Foaming
Disclosed are bowing agent compositions, foamable compositions, foams, foaming methods and/or foamed articles comprising one or more C2 to C6 fluoroalkenes, more preferably one or more C3 to C5 fluoroalkenes, and even more preferably one or more compounds having Formula I as follows:
XCF.sub.zR.sub.3-z (I)
Where X is a C.sub.1, C.sub.2, C.sub.3, C.sub.4, or C.sub.5 unsaturated, substituted or unsubstituted radical, each R is independently Cl, F, Br, I or H, and z is 1 to 3, it generally being preferred that the fluoroalkene of the present invention was at least four (4) halogen substituents, at least three of which are F and even more preferably none of which are Br.
HIGH-STRENGTH NETWORK STRUCTURED NANO-CARRIER MATERIAL AND PREPARATION METHOD AND APPLICATION THEREOF
A high-strength network structured nano-carrier material and a preparation method and application thereof. A nano-cellulose solution and graphene are mixed and ultrasonication is performed in an ultrasonic pulverizer to obtain a nano-cellulose/graphene suspension. The suspension with a phenolic resin adhesive is mixed and stirred to obtain a nano-cellulose/graphene/phenolic resin suspension. The nano-cellulose/graphene/phenolic resin suspension is injected into a mold. The mold is placed in a freeze dryer for freezing and vacuum dried in two stages to obtain a nano-cellulose/graphene/phenolic resin aerogel. The aerogel is preheated and cured in a muffle furnace, then subjected to a high-temperature thermal decomposition treatment in a tube furnace to obtain a nano-carrier material having a high-strength network structure. The preparation method is simple and convenient, low in cost, environmentally friendly and green. The obtained carrier material has a good water resistance and a high mechanical property, and can carry more active substances.
Structural and Decorative Composite Material, Preparation Method Therefor, And Article Containing Same
Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.
THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.