A phenol resin foamed plate contains hydrocarbon and/or chlorinated aliphatic hydrocarbon, in which an average cell diameter is in a range of 5 m or more and 200 m or less, a void area ratio is 5% or less in its cross section, a density is 15 kg/m.sup.3 or more and 26 kg/m.sup.3 or less, and when compression is made by a 10% displacement in a direction perpendicular to the thickness direction, a recovery rate 1 minute after release of this compression is 96.0% or more and 98.5% or less and a degree of change in recovery rates C is 0.030%/hr or more and 0.060%/hr or less.

The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.

Composition for production of phenolic foam, comprising at least one phenolic resin, at least one blowing agent, at least one catalyst and at least one polyethersiloxane of formula 1: M.sub.aM.sub.b.sup.1D.sub.cD.sub.d.sup.1.

The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.

A system for attaching a phenolic panel to a metal part includes a phenolic laminate panel having (i) a phenolic panel, (ii) a ferromagnetic susceptor bonded at an inner side of the phenolic panel via higher melting point adhesive and (iii) a non-magnetic shield having an outer side bonded at an inner side of the ferromagnetic susceptor via higher melting point adhesive. A lower melting point adhesive is applied at an inner side of the non-magnetic shield opposite from the outer side of the non-magnetic shield. With the phenolic laminate panel disposed at a metal part, an electromagnetic field is generated at the phenolic laminate panel to heat the phenolic laminate panel to a temperature greater than the melting point of the lower melting point adhesive and less than the melting point of the higher melting point adhesive to bond the phenolic laminate panel to the metal part.

The invention relates to a method for manufacturing a foam body, such as a foam insulation board, comprising the steps of: (i) providing foam reactant materials which react to form a foam body; (ii) providing a blowing agent; (iii) expanding, during reaction of the foam reactant materials, the foam reactant materials, using the blowing agent so as to form a foam body having cells defined therein and within which cells blowing agent is trapped; and (iv) collecting blowing agent not trapped within the foam body. Also disclosed herein is an apparatus for manufacturing a foam body. The collected blowing agent can be recycled/reused.

Provided are a phenolic resin foam having low environmental impact, high compressive strength, excellent handling properties in installation, and low costs associated with securing, and also a method of producing the same. The phenolic resin foam contains at least one selected from the group consisting of a chlorinated hydrofluoroolefin, a non-chlorinated hydrofluoroolefin, and a halogenated hydrocarbon. The phenolic resin foam has a density of at least 20 kg/m.sup.3 and no greater than 100 kg/m.sup.3, and a closed cell ratio of at least 80% and no greater than 99%. The density and 10% compressive strength of the phenolic resin foam satisfy a relationship: C0.5X7, where C represents the 10% compressive strength (N/cm.sup.2) and X represents the density (kg/m.sup.3).

The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.

Systems and methods relating to a composite flat panel, curved panel, hand-layup panel, prepreg, skin, or composite core matrix panel are provided. In some aspects, it includes a core sandwiched between a first layer and a second layer. At least one of the first layer or the second layer includes a hardening material. At least one of the first layer or the second layer includes a basalt fiber. In other aspects, it includes a hand-layup panel, prepreg, or skin. The hand-layup panel, prepreg or skin includes a layer that includes a hardening material. The layer includes a basalt fiber. In other aspects, it includes a hand-layup panel, prepreg, or skin. It includes a first layer and a second layer, each of the first and second layer includes a hardening material. Each of the first and second layer includes a basalt fiber.

Provided is a phenol resin foam that has low initial thermal conductivity and that retains low thermal conductivity for a long period of time. The present phenol resin foam may contain a cyclopentane and a high-boiling hydrocarbon with a boiling point of from 120 C. to 550 C. and may have a density of from 10 kg/m.sup.3 to 150 kg/m.sup.3. The content of the cyclopentane in the phenol resin foam per 22.410.sup.3 m.sup.3 space volume in the phenol resin foam is from 0.25 mol to 0.85 mol.