A matrix resin composition for fiber reinforced composite materials is described. The resin is thermosetting and achieves a glass transition temperature of at least 177? C. (Tg), obtained by curing under anaerobic conditions at room temperature. The matrix resin will streamline composite fabrication processes by eliminating the need for heating during the cure process. The implications of this development are significant in terms of the ease of use and elimination of procedural steps. While the resin system was developed specifically for vacuum bagging, it is expected to be viable for other composite fabrication methods including resin transfer molding (RTM) and vacuum-assisted resin transfer molding (VARTM). The resin system is viable for use with carbon fiber reinforcements to fabricate laminates at least 0.20 inches thick. The resulting laminates have low porosity and mechanical properties equivalent to those prepared with common epoxy matrix resins.

The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.08 part by mass or less: Component (A): a compound having either or both of a hydroxyl group and a carboxyl group and a polymerizable unsaturated group, Component (B): an aromatic vinyl compound, Component (C): a reinforcing fiber bundle having a fiber length of 5 mm or more and 120 mm or less, Component (D): an isocyanate compound, and Component (E): a metal chelate compound.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100140 parts of halogen-free phosphorous epoxy resin, 1035 parts of dicyclopentadiene phenolic epoxy resin, 3260 parts of benzoxazine, 15 parts of phenolic resin, 0.050.5 parts of accelerants; and 2570 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI500V), high heat resistance (Tg150 C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

The present invention provides a method for manufacturing a fiber reinforced resin material, the method including an opening step of opening an elongated fiber bundle to be widened in a width direction thereof to be put into a flat state; and a heat setting step of heat-setting the opened fiber bundle in the flat state by heating. In addition, the present invention provides an apparatus for manufacturing a fiber reinforced resin material containing a plurality of fiber bundles and a resin, the apparatus including an opening section that opens an elongated fiber bundle to be widened in a width direction thereof to be put into a flat state; and a heat setting section that heat-sets the opened fiber bundle in the flat state by heating.

The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 m or less.

A molding material for thermocompression molding including a resin composition (A) and a carbon-fiber-reinforcing material (B) is provided, wherein resin composition (A) contains poly(meth)acrylate compound (a1) having hydroxy groups, radical-polymerizable diluent (a2), polyisocyanate compound (a3), styrene-based elastomer (a4) having unsaturated double bonds, and polymerization initiator (a5), and carbon-fiber-reinforcing material (B) is carbon paper surface-treated with water-soluble resin (b1) having hydroxy groups. A carbon-fiber-reinforced molded plastic article having uniform mechanical strength can be produced in a short time by using the molding material for thermocompression molding.

The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

A molded article is provided that has a resin matrix having a surface, the resin matrix formed from cross-linked polyester resin or vinyl-ester resin. Glass fibers are crossed linked to the resin matrix via a silane coupling agent reactive with the matrix. A molded article is provided that has a resin matrix having a surface, the resin matrix formed from cross-linked polyester resin or vinyl-ester resin. Glass fibers each covalently bonded to at least one microspheroid matrix via a silane coupling agent reactive with a surface of the at least one microspheroids are present in increase the fiber pull strength. A sizing composition for treating glass fibers is also provided for use in such articles.

A fiber-reinforced resin forming material contains at least a matrix resin and bundled aggregates of discontinuous reinforcing fibers, wherein: the bundled aggregates include both reinforcing fiber aggregates A having a shape formed by cutting after having performed a splitting treatment to completely split the strands of continuous reinforcing fibers into a plurality of bundles of strands, and reinforcing fiber aggregates B1 having a shape that includes unsplit parts where splitting treatment was inadequate and/or reinforcing fiber aggregates B2 having a shape not subjected to splitting treatment; and both the ratio of the weight of the reinforcing fiber aggregates B1 with respect to the total weight of reinforcing fibers in the fiber-reinforced resin forming material, and the ratio of the total weight of the reinforcing fiber aggregates B1 and the reinforcing fiber aggregates B2 with respect to the total weight of reinforcing fibers in the fiber-reinforced resin forming material, are 50-95%.

The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).