The present invention provides a flexible display cover substrate, which comprises a transparent polyimide film; and a device protection layer formed by curing a hard coating composition and disposed on at least one surface of the transparent polyimide film. The hard coating composition includes a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle. According to the present invention, a flexible display cover substrate with low haze and good bending resistance can be obtained.

A black resin composition, a cured film, and a black filter are provided. The black resin composition includes: a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), a photoinitiator (E), a UV absorber (F), and a surfactant (G). The resin (D) includes a first resin having a weight-average molecular weight of 2,000 to 20,000. The first resin includes a structural unit having a fluorene ring and two or more ethylenically-polymerizable groups. The UV absorber (F) includes a benzylidene-based derivative.

A flexible window stack structure includes a substrate, a first hard coating layer formed on a surface of the substrate and a second hard coating layer formed on an opposite surface of the substrate. The first hard coating layer has a curing contraction greater than that of the second hard coating layer, and the second hard coating layer is disposed at an elongated side when the window stack structure is folded. Cracks may be prevented by a curl property of the first hard coating layer when being bent.

Provided is an optical laminate capable of suppressing deterioration of visibility in a high-temperature environment. The optical laminate comprises a layer comprising a metal oxide on a plastic film, wherein the emissivity of the optical laminate for light with a wavelength range of 2000 nm or more and 22000 nm or less is 0.27 or more and 0.75 or less as measured from the side of the layer comprising a metal oxide with respect to the plastic film.

The present application relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation film having excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending, while preventing generation of bright spots in the organic electronic device.

The present invention relates to an anti-reflective film exhibiting one or more peaks (q.sub.max) at a scattering vector of 0.0758 to 0.1256 nm.sup.−1, in a graph showing a log value of scattering intensity to a scattering vector defined in small-angle X-ray scattering.

Provided are a heat-resistant synthetic resin microporous film that has both good heat resistance and good mechanical strength and exhibits a suppressed decrease in mechanical strength over time, and a method for producing the heat-resistant synthetic resin microporous film. The heat-resistant synthetic resin microporous film of the present invention includes a synthetic resin microporous film, and a coating layer formed on at least part of the surface of the synthetic resin microporous film and containing a polymer of a polymerizable compound having two or more radically polymerizable functional groups per molecule. The maximum thermal shrinkage rate of the heat-resistant synthetic resin microporous film when heated from 25° C. to 180° C. at a temperature rising rate of 5° C./min is 15% or less. The piercing strength thereof is 0.6 N or more. The rate of retention of the piercing strength after heating at 70° C. for 168 hours is 85% or more.

Polymer compositions capable of being crosslinked, for example by ionizing radiation such as electron beam radiation, are prepared from masterbatch compositions containing thermoplastic polymer, multi(meth)acrylate-functionalized resin, and, optionally, scorch retarder (which is preferably present if the multi(meth)acrylate-functionalized resin has a low (meth)acrylate equivalent weight). Such polymer compositions are useful for the manufacture of articles such as films, fibers and the like.

The present invention relates to a decorative material having excellent printability, and the decorative material according to the present invention has an ink-receiving layer having a radially fine sloping structure having a dendritic shape, whereby the absorbing and/or fixing property, i.e., printability, of the ink printed on the ink-receiving layer is improved, and clarity is excellent, so that aesthetic effects are excellent. In addition, since the ink-receiving layer is manufactured through UV curing, it can be directly coated on a substrate layer, and can include various kinds of substrate layers; and since it is manufactured using a solvent-free type resin composition without using an organic solvent, and has an excellent absorbing and/or fixing property with respect to a water soluble ink, it has environmental friendly advantages.

The present invention provides a binder that is for inorganic fibers and that is characterized by containing (A) 100 parts by mass of a polyvinyl alcohol resin having a degree of polymerization of 100-3500, (B) 1-50 parts by mass of colloidal silica having an average particle size of 100 nm or less, and (C) 3 parts by mass or more of an ammonia-modified copolymer containing maleic anhydride. By using the binder for inorganic fibers according to the present invention, an inorganic fiber mat having resiliency comparable to that of phenolic resins can be fabricated, and the amount of volatile organic compounds released from the inorganic fiber mat is very small.