The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

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The resin composition includes a block copolymer including a vinyl aromatic hydrocarbon-derived structural unit and a conjugated diene-derived structural unit, the resin composition satisfying the following (1) to (3): (1) an area ratio of components having a molecular weight in terms of polystyrene of equal to or more than 400,000 with respect to all components is equal to or more than 8% and equal to or less than 50%; (2) at least one main peak of a loss tangent value (tan δ) measured under a condition of a frequency of 1 Hz at a temperature rising rate of 4° C./min in accordance with ISO 6721-1 is present in a range of equal to or more than 70° C. and equal to or less than 100° C.; and (3) a strain hardening degree (λ max) of a compression-molded specimen prepared in accordance with ISO 293 is equal to or more than 2.0.

The modified asphalt provided by the disclosure is prepared from the following raw materials in parts by weight: 100 to 120 parts of asphalt, 6 to 20 parts of a modifier, 3 to 9 parts of a compatibilizer, 0.15 to 0.25 parts of sulfur, 0.4 to 0.6 parts of a non-amine anti-stripping agent and 0.2 to 0.4 parts of a coupling agent; and the modifier comprises a styrene-butadiene-styrene block copolymer, a rubber, and a polyurethane. The modified asphalt provided by the disclosure can simultaneously satisfy an elastic recovery at 25° C. of ≥98%, a dynamic viscosity at 60° C. of ≥500,000 Pa.Math.s, a composite shear modulus at 60° C. of ≥10 Pa, and a critical temperature at G*/Sin≥2.2 kPa of ≥94° C.

[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

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The purpose of the present invention is to provide a resin composition for manufacturing a medical storage container that has improved oxygen permeability and that tends not to have excessively lower transparency. To this end, the present invention pertains to a resin composition for manufacturing a medical storage container, the composition including polyethylene (a) and polymethylpentene (b). The resin composition contains, as polyethylene (a), a first polyethylene (a-1), which is a main component of the polyethylene (a), and a second polyethylene (a-2) having a lower density than the first polyethylene.

Disclosed herein is a primerless paint composition comprising a carboxylated chlorinated polyolefin elastomer; one or more of a polyacrylic binder, a polyvinylchloride binder and a vinyl aromatic block copolymer binder; a pigment; and a liquid carrier. Disclosed herein too is a method comprising blending a primerless paint composition comprising a carboxylated chlorinated polyolefin elastomer; one or more of a polyacrylic binder, polyvinylchloride binder and a vinyl aromatic block copolymer binder; a pigment; and a liquid carrier; and disposing the primerless paint composition on a polyolefin elastomer substrate that does not have a primer disposed on it prior to the disposing of the primerless paint composition.

A foamed article formed by foam injection molding or foam extrusion of a composition is disclosed. The article is formed from a molding composition consisting essentially of: 100 phr of at least two different hydrogenated styrenic block copolymers (HSBC), a first HSBC and a second HSBC, having different molecular weights, a molecular weight ratio of at least 1.2:1, respectively; and a weight ratio of ranging from 5:95 to 95:5, respectively; 10-55 phr of a polypropylene having a melt flow of at least 2 g10/min; and optionally up to 55 phr of a plasticizer, selected from hydrocarbon based oils, fatty acids, triglyceride oils, and mixtures thereof. The composition has a melt flow rate of 2-50 g/10 min, a Shore A hardness of 60-90, a melt strength (F) of at least 0.010 N, and a melt strength (V) of at least 10.

A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.

A polypropylene resin composition according to the present invention contains 1 to 41 parts by mass of fibrous basic magnesium sulfate, 50 to 98 parts by mass of a propylene polymer, 0.02 to 1.6 parts by mass of a lubricant, and less than 0.5 times the amount of the basic magnesium sulfate and 0.1 to 20 parts by mass of an acid-modified elastomer.