C08J2463/02

SELF-ADHESIVE PREPREG
20220213285 · 2022-07-07 · ·

A self-adhesive prepreg comprising a fibre reinforcement layer having a first side and a second side, wherein the first side of the fibre reinforcement layer has been pre-impregnated with a self-adhesive resin composition. The self-adhesive may be used as a structural reinforcement and is especially adapted for direct bonding to oily steel or galvanized steel in the automotive, aerospace and other sheet metal fabrication industries.

Prepreg and fiber reinforced composite material

A prepreg contains components [A] to [E], wherein 85% by mass or more of the component [E] is present in a range within 9% of the average thickness of the prepreg from each surface of the prepreg, and a range within 7% of the average thickness of the prepreg from each surface of the prepreg is composed of a first resin composition containing components [B] to [E]. [A] a carbon fiber, [B] an epoxy resin having two or more glycidyl groups in one molecule, [C] an aromatic amine compound, [D] a thermoplastic resin having a polyarylether skeleton, and [E] particles having a number average primary particle size of 5 to 50 μm, having a content ratio (% by mass) of thermoplastic resin and thermosetting resin of 95:5 to 70:30.

Extraction Materials for In-Situ Consolidation and Multi-Packaging of Underwater Fragile Cultural Relics, and Extraction and Restoration Methods
20220243027 · 2022-08-04 ·

The present disclosure discloses extraction materials for in-situ consolidation and multi-packaging of underwater fragile cultural relics, and extraction and restoration methods.

Circuit build-up film for wafer-level packaging, and fabrication method and use thereof

A circuit build-up film for wafer-level packaging (WLP) includes 40 to 60 parts by mass of a first epoxy resin, 15 to 30 parts by mass of a second epoxy resin, 25 to 50 parts by mass of a curing agent, 0.1 to 5 parts by mass of a curing accelerator, 5 to 20 parts by mass of an additive, 320 to 650 parts by mass of an inorganic filler, and 0.01 to 5 parts by mass of a silane coupling agent (SCA), where the additive is obtained by subjecting an epoxy resin to a reaction with a polyhydroxyl-terminated dendritic crosslinking agent. The build-up film shows prominent fluidity during heating and curing, and can completely fill gaps among wafers. A packaging process using the build-up film is simple. Regardless of the number of wafers, packaging can be completed through one procedure with the build-up film.

CATALYST-DOPED SIZING AGENT FOR PREPARATION OF HIGH AREAL WEIGHT FIBER SHELF-STABLE PREPREG OR MOLDING COMPOUND INTERMEDIATES

The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a thermosetting resin mixture and a fiber material component of a heat resistant fiber, such as carbon fiber, having an areal weight of from 500 to 3,000 g/m2 having a coating of from 0.5 to 4 phr of a latent, particulate curative or solid curative, preferably, dicyandiamide, wherein the prepregs are infused with a thermosetting resin mixture comprising (a) at least one liquid epoxy resin, and (b) a hardener and/or a catalyst, as well as methods of making the same. The prepregs of present invention enables the simple provision of lightweight composites having consistent resin cure throughout.

POLY(ARYLENE SULFIDE) RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE MOLDED ARTICLE, AND METHODS RESPECTIVELY FOR PRODUCING SAID PRODUCTS
20210238371 · 2021-08-05 · ·

Provided are a polyarylene sulfide resin composition which can provide a composite molded article; a molded article produced from the polyarylene sulfide resin composition; and methods respectively for producing the polyarylene sulfide resin composition and the molded article thereof. More specifically provided are a composite molded article obtained by bonding a molded article which is produced by molding a polyarylene sulfide resin composition and is subjected to an annealing treatment to a cured product produced from a curable resin composition containing an epoxy resin, wherein the polyarylene sulfide resin composition contains, as essential components, an epoxy resin and an olefin wax containing a carboxyl group and a carboxylic acid anhydride group and having an acid value of 65 to 150 [mgKOH/g]; a polyarylene sulfide resin composition for providing the composite molded article; a molded article; and methods respectively for producing the aforementioned products.

METAL-FIBER-REINFORCED RESIN MATERIAL COMPOSITE AND PRODUCTION METHOD THEREOF

A metal-fiber reinforced resin material composite is provided which improves the shear strength between a metallic member and a fiber reinforced material by more strongly bonding the metallic member and the fiber reinforced resin member, and which is very light and has excellent workability while increasing strength.

[Solution]

This metal-fiber reinforced resin material composite is provided with a metallic member and with a fiber reinforced resin material that is stacked on at least one surface of the metallic member and combined with the metallic member, wherein the fiber reinforced resin material comprises a matrix resin containing a thermoplastic resin, a reinforcing fiber material included in the matrix resin, and a resin layer interposed between the reinforcing fiber material and the metallic member and comprising a resin of the same type as the matrix resin. The shear strength of the metallic member and the fiber reinforced resin material is greater than or equal to 0.8 MPa.

FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, MOLDED BODY OF FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, AND MANUFACTURING METHOD OF FIBER-REINFORCED THERMOPLASTIC RESIN SHEET

An object of the present invention is to provide a fiber-reinforced thermoplastic resin sheet which can be manufactured into a molded body exhibiting excellent appearance quality as well as exhibits both high moldability and strength and a manufacturing method of such a fiber-reinforced thermoplastic resin sheet. The present invention relates to a fiber-reinforced thermoplastic resin sheet which is a random laminated body of a tape-shaped unidirectional prepreg and contains spread reinforcement fibers and a polymer (a) and in which the polymer (a) is a polymer of at least a bisphenol A type epoxy compound represented by Formula (1):

##STR00001##

[where n is an integer of 1 to 4] and a bisphenol compound selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol E, and bisphenol P, and M.sub.wa is 25,000 or more and a proportion (M.sub.wb/M.sub.wa) of M.sub.wb to M.sub.wa is 1.01 to 1.8, where M.sub.wa denotes a weight average molecular weight of the polymer (a) and M.sub.wb denotes a weight average molecular weight of a polymer (b) contained in a heat-treated fiber-reinforced thermoplastic resin sheet acquired by heating the fiber-reinforced thermoplastic resin sheet at 180° C. for 1 hour.

METHODS FOR TREATING THERMOPLASTIC POLYURETHANE COVERS FOR GOLF BALLS WITH EPOXY COMPOSITIONS

Golf balls having covers made of thermoplastic polyurethane compositions are provided. Multi-piece golf balls can be made. In one embodiment, the outer cover layer is formed from a composition comprising a thermoplastic polyurethane and epoxy compound. Mixtures of multi-functional amines and imines, and multi-functional isocyanates, and epoxy curing agents; and solvent, can be applied to the outer cover. The resulting coating may contain polyurethanes, polyureas, and hybrids, copolymers, and blends thereof. The cover composition and surface coatings can further include catalysts, ultraviolet (UV)-light stabilizers, and other additives. The coating methods have many benefits and the finished balls have good physical properties.

Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same

A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): ##STR00001## wherein R.sub.1 is an organic group; and (D) a resin represented by the following formula (II): ##STR00002## wherein n is an integer of 1 to 10.