Patent classifications
C08J2463/04
PREPREGS AND PRODUCTION OF COMPOSITE MATERIAL USING PREPREGS
A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140 C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150 C. to 180 C. and (ii) the cured thermosetting resin is at least 90% cured.
Resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same
The present invention relates to a prepreg which is manufactured by impregnating thermosetting resin composition and at least one thermoplastic additive into unidirectional carbon fiber, and to a resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same by differentiating a resin constituent, a resin equivalent weight, viscosity, gel time and glass transition temperature differing from those described in the prior art.
STABLE HIGH GLASS TRANSITION TEMPERATURE EPOXY RESIN SYSTEM FOR MAKING COMPOSITES
A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.
RESIN COMPOSITION SUITABLE FOR RIGID-FLEX BOARD AND USE THEREOF
The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.
Concentrated polymeric compositions of vinyl aromatic polymers and/or copolymers
The present invention relates to a concentrated polymeric composition which comprises: a) vinyl aromatic polymers and/or copolymers in an amount ranging from 10% to 90% by weight, calculated with respect to the overall composition, with respect to the overall composition, b) at least one compound containing epoxy functional groups in an amount ranging from 0.01% to 5% by weight, calculated with respect to the overall composition, with respect to the overall composition, c) at least one infrared absorbing agent, in an amount ranging from 10% to 90% by weight, calculated with respect to the overall composition, with respect to the overall composition.
Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same
A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I):
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wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
Benzoxazine Low Temperature Curable Composition
The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.
Polyamide resin composition, method of manufacturing and molded product
A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130 C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.
Resin-coated metal sheet for containers
The resin-coated metal sheet for containers includes a resin coating layer (A) having a multilayered structure mainly composed of a polyester resin on at least one surface thereof. The resin coating layer (A) includes a resin layer (a1). The resin layer (a1) adheres to the metal sheet, contains (i) a polyester resin, (ii) a phenolic resin, (iii) a metal alkoxide compound and/or a metal chelate compound, (iv) an epoxy resin, and (v) at least one selected from the group consisting of polyamine resins, polyamidoamine resins, and polyamide resins, and is mainly composed of the polyester resin. Preferably, a polyester film (a2) is disposed on the resin layer (a1).
SIZING COMPOSITIONS FOR CARBON FIBERS
The present invention provides aqueous, epoxy-based sizing compositions for carbon fibers. The size composition incorporates highly functionalized film forming epoxy novolac phenolic resins in combination with highly functionalized sulfonated polyesters having high Tg characteristics, sulfonate equivalent weights in the range from 2000 to 20,000 and number average molecular weights in the range from about 1000 to about 100,000. The present invention also provides corresponding sized carbon fibers and fiber-reinforced matrices.