Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device can be prevented.

A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 m; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

Provided is a primer composition that can cause a fiber-reinforced plastic (FRP) and an adhesive to sufficiently conform to each other to express a sufficient adhesive strength. The present invention also provides a composite article containing a fiber-reinforced plastic (FRP) subjected to a primer treatment with such primer composition. The primer composition of the present invention includes: an aromatic compound having a hydroxyl group; and an epoxy. The composite article of the present invention includes a fiber-reinforced plastic, and at least part of a surface of the fiber-reinforced plastic is subjected to a primer treatment with the primer composition of the present invention.

A curable resin composition which comprising (A), (B) and (C) as follows: (A) 100 parts by mass of polyfunctional epoxy component which contains (A1) a trifunctional epoxy compound having three glycidyl groups in a molecule and (A2) a tetrafunctional epoxy compound having four glycidyl groups in a molecule, wherein (A1):(A2) is 10:90 to 90:10 in terms of mass; (B) 25 to 200 parts by mass of a cyanic acid ester compound having two or more of cyanato groups; and (C) 0.5 to 20 parts by mass of an imidazole compound as a curing agent.

This disclosure relates to thermosetting compositions suitable for use in making electronic materials such as circuit board substrates, as well as cured compositions, prepregs and laminates based on such thermosetting compositions. One aspect of the disclosure is a thermosetting composition comprising: an aromatic epoxy resin component; a poly(styrene-co-maleic anhydride) component; a maleimide-bearing oligomer component; the maleimide-bearing oligomer component having an average of at least 4 maleimides per molecule, on a number average, and a softening point of no more than 100 C.; a benzoxazine/maleimide component, that is a bis(benzoxazine) subcomponent and a bis(maleimide) subcomponent, and/or a reaction product thereof; an aromatic primary diamine component; microparticulate silica; an organic halogen-free fire retardant component; an effective amount of one or more catalysts.

A thermoplastic polyester resin composition includes 10 parts by weight or more and 80 parts by weight or less of a polyester resin (B) containing 50 to 90 mol % of a structure in which a terephthalic acid residue and a 1,4-cyclohexanedimethanol residue are bonded, with respect to 100 parts by weight of a polybutylene terephthalate-based resin (A), wherein the thermoplastic polyester resin composition has a melting point of 222 C. or more and 230 C. or less as measured using a differential scanning calorimeter at heating and cooling rates of 20 C./min, and has a cold crystallization temperature of 170 C. or more and 200 C. or less as measured under the same condition.

A resin composition contains: a curable resin (A); an acrylic-monomer copolymer (B) having a structure expressed by formulae (1) to (3) and having a weight average molecular weight equal to or greater than 10,000 and equal to or less than 900,000; an inorganic filler (C) where a molybdenum compound is present on at least a part of a surface thereof; and another inorganic filler (D) different from the inorganic filler (C). R1 is either a hydrogen atom or a methyl group. R2 includes at least one of a glycidyl group or an epoxidized alkyl group which is selected from the group consisting of a hydrogen atom, an alkyl group, the glycidyl group, and the epoxidized alkyl group. R3 is either a hydrogen atom or a methyl group. R4 is Ph (phenyl group), COOCH.sub.2Ph, or COO(CH.sub.2).sub.2Ph.

A fiber-reinforced composite article in which toughness is maintained and a strength and an elastic modulus are improved, and a prepreg for obtaining the fiber-reinforced composite article are provided. The prepreg of the present invention comprises a matrix resin composition comprising at least the following components (A) to (C), and carbon fibers. Component (A): an epoxy resin Component (B): an aliphatic polycarbonate resin Component (C): a curing agent