Provided is a resin composition that is capable of producing a cured product having excellent environmental suitability, high strength, and excellent flame retardancy, and that is suitably usable as a matrix resin for fiber-reinforced plastics. A resin composition contains (A) an epoxy resin, (B) a cyanate resin, (C) an aromatic amine curing agent that is liquid at 25° C., and (D) a phosphorus-containing compound represented by formula (1). Preferably, in formula (1), R.sup.1 and R.sup.2 each independently represent an alkyl group or an aryl group, and X and Y are an oxygen atom.

A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa.Math.s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

A process of preparing polybenzoxazines using an alkylammonium salt of an acid having a pKa in acetonitrile of 9 or more as catalyst is described.

A thermosetting resin composition at least including: [A] an epoxy resin containing two or more glycidyl groups; [B] a cyanate ester resin containing two or more cyanate groups; and [C] an amine compound; and satisfying the following conditions (1) and (2): (1) 0.25the number of moles of glycidyl groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition1.5; and (2) 0.05the number of moles of active hydrogen contained in the amino groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition<0.5; and a prepreg and a fiber reinforced composite material using the thermosetting resin composition. Provided are a thermosetting resin composition having excellent mechanical properties and heat resistance in a high-temperature environment after moisture absorption, and having excellent reactivity that allows curing in a short time; a prepreg prepared by impregnating a reinforced fiber with a thermosetting resin composition, which prepreg has excellent handling ability (tackiness properties) at room temperature; and a fiber reinforced composite material including a thermosetting resin composition and a reinforced fiber.

A method of applying a gas-impermeable coating includes forming a polyelectrolyte complex suspension. The polyelectrolyte complex suspension is applied to a substrate. The substrate having the polyelectrolyte complex applied theron is treated. The treating reduces salt content of the polyelectrolyte complex. The treating results in a gas-impermeable coating being formed on the substrate

Provided is a resin composition, which comprises 1 to 10 parts by weight of a bifunctional aliphatic long-chain acrylate and 30 to 50 parts by weight of a thermosetting resin. Moreover, an article is also provided, which is made from the resin composition described above. The article may comprise a prepreg, a resin film, a laminate or a printed circuit board.

A compound having a structure represented by the following Formula (I), where Q.sup.1 and Q.sup.2 individually represent a functional group containing a CC unsaturated bond and J.sup.1 and J.sup.2 individually represent a flame retardant group containing a phosphorus atom, useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy. ##STR00001##

Provided is a resin composition, which comprises 1 to 10 parts by weight of a bifunctional aliphatic long-chain acrylate and 30 to 50 parts by weight of a thermosetting resin. Moreover, an article is also provided, which is made from the resin composition described above. The article may comprise a prepreg, a resin film, a laminate or a printed circuit board.

Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.

The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.